DE69232574D1 - Verfahren zum Reinigen von Halbleiterprodukten - Google Patents

Verfahren zum Reinigen von Halbleiterprodukten

Info

Publication number
DE69232574D1
DE69232574D1 DE69232574T DE69232574T DE69232574D1 DE 69232574 D1 DE69232574 D1 DE 69232574D1 DE 69232574 T DE69232574 T DE 69232574T DE 69232574 T DE69232574 T DE 69232574T DE 69232574 D1 DE69232574 D1 DE 69232574D1
Authority
DE
Germany
Prior art keywords
semiconductor products
cleaning semiconductor
cleaning
products
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69232574T
Other languages
English (en)
Other versions
DE69232574T2 (de
Inventor
Olli Anttila
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okmetic Oy
Original Assignee
Okmetic Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okmetic Oy filed Critical Okmetic Oy
Application granted granted Critical
Publication of DE69232574D1 publication Critical patent/DE69232574D1/de
Publication of DE69232574T2 publication Critical patent/DE69232574T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE69232574T 1991-02-27 1992-02-27 Verfahren zum Reinigen von Halbleiterprodukten Expired - Fee Related DE69232574T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI910946A FI97920C (fi) 1991-02-27 1991-02-27 Tapa puhdistaa puolijohdevalmiste

Publications (2)

Publication Number Publication Date
DE69232574D1 true DE69232574D1 (de) 2002-05-29
DE69232574T2 DE69232574T2 (de) 2002-08-08

Family

ID=8532002

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69232574T Expired - Fee Related DE69232574T2 (de) 1991-02-27 1992-02-27 Verfahren zum Reinigen von Halbleiterprodukten

Country Status (5)

Country Link
US (1) US5382296A (de)
EP (1) EP0501492B1 (de)
JP (1) JP3390185B2 (de)
DE (1) DE69232574T2 (de)
FI (1) FI97920C (de)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5213622A (en) * 1991-10-11 1993-05-25 Air Products And Chemicals, Inc. Cleaning agents for fabricating integrated circuits and a process for using the same
US5580828A (en) * 1992-12-16 1996-12-03 Semiconductor Physics Laboratory Rt Method for chemical surface passivation for in-situ bulk lifetime measurement of silicon semiconductor material
JP2857042B2 (ja) * 1993-10-19 1999-02-10 新日本製鐵株式会社 シリコン半導体およびシリコン酸化物の洗浄液
JP2893676B2 (ja) * 1994-05-19 1999-05-24 信越半導体株式会社 シリコンウェーハのｈｆ洗浄方法
US5597443A (en) * 1994-08-31 1997-01-28 Texas Instruments Incorporated Method and system for chemical mechanical polishing of semiconductor wafer
RU2052868C1 (ru) * 1995-02-03 1996-01-20 Акционерное общество "Научно-производственное предприятие "Сапфир" Состав раствора для очистки поверхности (типа "полифункционал")
JP3649771B2 (ja) * 1995-05-15 2005-05-18 栗田工業株式会社 洗浄方法
JP3415373B2 (ja) * 1995-11-29 2003-06-09 東芝マイクロエレクトロニクス株式会社 半導体基板等の表層の溶解方法及び装置
EP0784336A3 (de) * 1995-12-15 1998-05-13 Texas Instruments Incorporated Verbesserungen bei der Herstellung und Bearbeitung von Halbleitervorrichtungen
US6103627A (en) * 1996-02-21 2000-08-15 Micron Technology, Inc. Treatment of a surface having an exposed silicon/silica interface
US6296714B1 (en) * 1997-01-16 2001-10-02 Mitsubishi Materials Silicon Corporation Washing solution of semiconductor substrate and washing method using the same
US6514875B1 (en) * 1997-04-28 2003-02-04 The Regents Of The University Of California Chemical method for producing smooth surfaces on silicon wafers
US6165956A (en) * 1997-10-21 2000-12-26 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6294027B1 (en) 1997-10-21 2001-09-25 Lam Research Corporation Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
US6479443B1 (en) 1997-10-21 2002-11-12 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
US6303551B1 (en) 1997-10-21 2001-10-16 Lam Research Corporation Cleaning solution and method for cleaning semiconductor substrates after polishing of cooper film
US6593282B1 (en) 1997-10-21 2003-07-15 Lam Research Corporation Cleaning solutions for semiconductor substrates after polishing of copper film
US6604086B1 (en) 1998-07-20 2003-08-05 Usa Technologies, Inc. Electronic commerce terminal connected to a vending machine operable as a telephone
US6609102B2 (en) 1998-07-20 2003-08-19 Usa Technologies, Inc. Universal interactive advertizing and payment system for public access electronic commerce and business related products and services
US6615183B1 (en) 1998-07-20 2003-09-02 Usa Technologies, Inc. Method of warehousing user data entered at an electronic commerce terminal
US6763336B1 (en) 1998-07-20 2004-07-13 Usa Technologies, Inc. Method of transacting an electronic mail, an electronic commerce, and an electronic business transaction by an electronic commerce terminal using a wirelessly networked plurality of portable digital devices
US6162565A (en) * 1998-10-23 2000-12-19 International Business Machines Corporation Dilute acid rinse after develop for chrome etch
US6173720B1 (en) 1998-12-02 2001-01-16 International Business Machines Corporation Process for treating a semiconductor substrate
US6878213B1 (en) 1998-12-07 2005-04-12 Scp Global Technologies, Inc. Process and system for rinsing of semiconductor substrates
KR100558043B1 (ko) * 1998-12-31 2006-05-03 매그나칩 반도체 유한회사 반도체 소자의 구리 금속 배선 형성 방법
FI113750B (fi) 1999-05-21 2004-06-15 Kojair Tech Oy Menetelmä ja laitteisto puolijohdeteollisuuden työvälineiden pesemiseksi
US6394106B1 (en) 1999-09-24 2002-05-28 Michael Jolley Cleaning solutions and methods for semiconductor wafers
US6653243B2 (en) * 2000-05-25 2003-11-25 Micron Technology, Inc. Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
US6541391B2 (en) 2001-02-28 2003-04-01 Micron Technology, Inc. Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates
US7805338B2 (en) * 2001-03-26 2010-09-28 Usa Technologies, Inc. Method of constructing a digital content play list for transmission and presentation on a public access electronic terminal
US6589882B2 (en) * 2001-10-24 2003-07-08 Micron Technology, Inc. Copper post-etch cleaning process
US6835667B2 (en) * 2002-06-14 2004-12-28 Fsi International, Inc. Method for etching high-k films in solutions comprising dilute fluoride species
ITMI20031196A1 (it) * 2003-06-13 2004-12-14 Lpe Spa Sistema per crescere cristalli di carburo di silicio
US7235495B2 (en) * 2003-07-31 2007-06-26 Fsi International, Inc. Controlled growth of highly uniform, oxide layers, especially ultrathin layers
JP2007505503A (ja) * 2003-09-11 2007-03-08 エフエスアイ インターナショナル インコーポレイテッド 音場を均一にするための音拡散装置
WO2005027202A1 (en) * 2003-09-11 2005-03-24 Fsi International, Inc. Semiconductor wafer immersion systems and treatments using modulated acoustic energy
US6936534B2 (en) * 2003-09-17 2005-08-30 Micron Technology, Inc. Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization
US20060122509A1 (en) * 2004-11-24 2006-06-08 Liposonix, Inc. System and methods for destroying adipose tissue
US7367343B2 (en) * 2006-01-23 2008-05-06 Micron Technology, Inc. Method of cleaning a surface of a cobalt-containing material, method of forming an opening to a cobalt-containing material, semiconductor processing method of forming an integrated circuit comprising a copper-containing conductive line, and a cobalt-containing film cleaning solution

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2709802A1 (de) * 1977-03-07 1978-09-14 Siemens Ag Verfahren zur entfernung von bei ionenimplantationsprozessen in halbleitersystemen entstehenden verunreinigungen
DE2950541A1 (de) * 1979-12-15 1981-06-19 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur oberflaechenbehandlung von jsiliziumplatten bei der halbleiterherstellung
JPS60113434A (ja) * 1983-11-24 1985-06-19 Toshiba Corp 集積回路用基体表面の処理方法
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
JP2787788B2 (ja) * 1990-09-26 1998-08-20 インターナショナル・ビジネス・マシーンズ・コーポレーション 残留物除去方法

Also Published As

Publication number Publication date
EP0501492A2 (de) 1992-09-02
JP3390185B2 (ja) 2003-03-24
JPH0590235A (ja) 1993-04-09
US5382296A (en) 1995-01-17
FI910946A0 (fi) 1991-02-27
FI97920C (fi) 1997-03-10
DE69232574T2 (de) 2002-08-08
EP0501492B1 (de) 2002-04-24
EP0501492A3 (en) 1993-03-10
FI910946A (fi) 1992-08-28
FI97920B (fi) 1996-11-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee