DE69225091T2 - Beidseitig aufgerauhte Kupferfolie mit Schutzfilm - Google Patents

Beidseitig aufgerauhte Kupferfolie mit Schutzfilm

Info

Publication number
DE69225091T2
DE69225091T2 DE69225091T DE69225091T DE69225091T2 DE 69225091 T2 DE69225091 T2 DE 69225091T2 DE 69225091 T DE69225091 T DE 69225091T DE 69225091 T DE69225091 T DE 69225091T DE 69225091 T2 DE69225091 T2 DE 69225091T2
Authority
DE
Germany
Prior art keywords
sides
protective film
copper foil
foil roughened
roughened
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69225091T
Other languages
German (de)
English (en)
Other versions
DE69225091D1 (de
Inventor
Azuma Keiji
Katoh Kimikazu
Oguro Ryoichi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Circuit Foil Japan Co Ltd
Sumitomo Bakelite Co Ltd
Original Assignee
Circuit Foil Japan Co Ltd
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Circuit Foil Japan Co Ltd, Sumitomo Bakelite Co Ltd filed Critical Circuit Foil Japan Co Ltd
Application granted granted Critical
Publication of DE69225091D1 publication Critical patent/DE69225091D1/de
Publication of DE69225091T2 publication Critical patent/DE69225091T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Insulated Conductors (AREA)
DE69225091T 1991-06-18 1992-06-08 Beidseitig aufgerauhte Kupferfolie mit Schutzfilm Expired - Fee Related DE69225091T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3145704A JPH04369290A (ja) 1991-06-18 1991-06-18 保護フィルム付き両面粗化処理銅箔及びその製法

Publications (2)

Publication Number Publication Date
DE69225091D1 DE69225091D1 (de) 1998-05-20
DE69225091T2 true DE69225091T2 (de) 1998-12-03

Family

ID=15391189

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69225091T Expired - Fee Related DE69225091T2 (de) 1991-06-18 1992-06-08 Beidseitig aufgerauhte Kupferfolie mit Schutzfilm

Country Status (5)

Country Link
EP (1) EP0519631B1 (US06373033-20020416-M00002.png)
JP (1) JPH04369290A (US06373033-20020416-M00002.png)
KR (1) KR100324486B1 (US06373033-20020416-M00002.png)
DE (1) DE69225091T2 (US06373033-20020416-M00002.png)
TW (1) TW210421B (US06373033-20020416-M00002.png)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6770380B2 (en) 1998-08-11 2004-08-03 Nikko Materials Usa, Inc. Resin/copper/metal laminate and method of producing same
JP2005340382A (ja) * 2004-05-25 2005-12-08 Mitsui Mining & Smelting Co Ltd フレキシブルプリント配線板及びそのフレキシブルプリント配線板の製造方法
KR100839760B1 (ko) * 2006-02-06 2008-06-19 주식회사 엘지화학 칩 온 필름용 동장 적층판
JP5018181B2 (ja) * 2007-03-30 2012-09-05 味の素株式会社 多層プリント配線板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1778825A1 (de) * 1968-06-10 1971-08-26 Licentia Gmbh Verfahren zur Herstellung von kupferkaschierten Schichtstoffen bzw.Schichtpressstoffen
EP0395871A3 (en) * 1989-05-05 1991-09-18 Gould Electronics Inc. Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing
JPH0366195A (ja) * 1989-08-04 1991-03-20 Hitachi Chem Co Ltd 銅張り積層板

Also Published As

Publication number Publication date
DE69225091D1 (de) 1998-05-20
TW210421B (US06373033-20020416-M00002.png) 1993-08-01
KR930000257A (ko) 1993-01-15
KR100324486B1 (ko) 2002-06-20
EP0519631B1 (en) 1998-04-15
EP0519631A3 (US06373033-20020416-M00002.png) 1994-12-28
JPH04369290A (ja) 1992-12-22
EP0519631A2 (en) 1992-12-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee