DE69217793D1 - Packung für eine Oberflächenwellenanordnung - Google Patents

Packung für eine Oberflächenwellenanordnung

Info

Publication number
DE69217793D1
DE69217793D1 DE69217793T DE69217793T DE69217793D1 DE 69217793 D1 DE69217793 D1 DE 69217793D1 DE 69217793 T DE69217793 T DE 69217793T DE 69217793 T DE69217793 T DE 69217793T DE 69217793 D1 DE69217793 D1 DE 69217793D1
Authority
DE
Germany
Prior art keywords
package
surface wave
wave arrangement
arrangement
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69217793T
Other languages
English (en)
Other versions
DE69217793T2 (de
Inventor
Frederick Y Cho
David Penunuri
Robert Frank Falkner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of DE69217793D1 publication Critical patent/DE69217793D1/de
Application granted granted Critical
Publication of DE69217793T2 publication Critical patent/DE69217793T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H03H9/02874—Means for compensation or elimination of undesirable effects of direct coupling between input and output transducers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/058—Holders; Supports for surface acoustic wave devices
    • H03H9/0585—Holders; Supports for surface acoustic wave devices consisting of an adhesive layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
DE69217793T 1991-09-30 1992-09-25 Packung für eine Oberflächenwellenanordnung Expired - Fee Related DE69217793T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/767,338 US5237235A (en) 1991-09-30 1991-09-30 Surface acoustic wave device package

Publications (2)

Publication Number Publication Date
DE69217793D1 true DE69217793D1 (de) 1997-04-10
DE69217793T2 DE69217793T2 (de) 1997-09-18

Family

ID=25079178

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69217793T Expired - Fee Related DE69217793T2 (de) 1991-09-30 1992-09-25 Packung für eine Oberflächenwellenanordnung

Country Status (4)

Country Link
US (1) US5237235A (de)
EP (1) EP0535554B1 (de)
JP (1) JPH05267985A (de)
DE (1) DE69217793T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5420472A (en) * 1992-06-11 1995-05-30 Motorola, Inc. Method and apparatus for thermal coefficient of expansion matched substrate attachment
EP0622897B1 (de) * 1993-04-28 2001-03-07 Matsushita Electric Industrial Co., Ltd. Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür
US5459368A (en) * 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
KR100648751B1 (ko) 1994-05-02 2007-03-02 지멘스 마츠시타 컴포넌츠 게엠베하 운트 콤파니 카게 전자부품용밀봉장치
US5939817A (en) * 1994-09-22 1999-08-17 Nippon Electric Co Surface acoustic wave device
JP3171043B2 (ja) * 1995-01-11 2001-05-28 株式会社村田製作所 弾性表面波装置
GB2303265B (en) * 1995-07-10 1998-07-08 Matsushita Electric Ind Co Ltd Spread spectrum communication apparatus,and demodulator,surface acoustic wave element and surface acoustic wave parts for spread spectrum communication
US5654693A (en) * 1996-04-10 1997-08-05 X-Cyte, Inc. Layered structure for a transponder tag
US5729185A (en) * 1996-04-29 1998-03-17 Motorola Inc. Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal
US6107899A (en) * 1996-10-21 2000-08-22 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave filter with grounds not connected in the package or on the piezoelectric substrate
US6119920A (en) * 1996-12-20 2000-09-19 Rf Monolithics, Inc. Method of forming an electronic package with a solder seal
KR100267966B1 (ko) * 1998-07-24 2000-10-16 구자홍 표면 탄성파 필터의 패키지 구조
DE19911369C2 (de) * 1999-03-15 2003-04-03 Nanotron Ges Fuer Mikrotechnik Oberflächen-Wellen-Wandler-Einrichtung sowie Identifikationssystem hiermit
FI19992852A (fi) * 1999-12-31 2001-07-01 Nokia Mobile Phones Ltd Menetelmä ja sovitelma elektronisen laitteen EMC-suojauksen toteuttamiseksi sekä elektronisen laitteen piirilevy
US6566981B2 (en) * 2000-07-28 2003-05-20 Kyocera Corporation Surface acoustic wave device having plural ground conductor films in the housing cavity
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US8623710B1 (en) 2000-11-28 2014-01-07 Knowles Electronics, Llc Methods of manufacture of bottom port multi-part surface mount silicon condenser microphone packages
US7154206B2 (en) * 2002-07-31 2006-12-26 Kyocera Corporation Surface acoustic wave device and method for manufacturing same
JP4525965B2 (ja) 2004-01-06 2010-08-18 ルネサスエレクトロニクス株式会社 半導体装置
US7224100B2 (en) * 2004-06-04 2007-05-29 Michelin Recherche Et Technique S.A. Reducing coupling of RF interrogated SAWs to external bodies
US7651879B2 (en) * 2005-12-07 2010-01-26 Honeywell International Inc. Surface acoustic wave pressure sensors
CN103999484B (zh) 2011-11-04 2017-06-30 美商楼氏电子有限公司 作为声学设备中的屏障的嵌入式电介质和制造方法
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
WO2017110308A1 (ja) * 2015-12-21 2017-06-29 株式会社村田製作所 弾性波装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3885173A (en) * 1973-10-09 1975-05-20 Magnavox Co Apparatus and method for coupling an acoustical surface wave device to an electronic circuit
US3982113A (en) * 1974-11-05 1976-09-21 Bell Telephone Laboratories, Incorporated Acoustoelectric wave semiconductor signal processing apparatus with storage of weighting factor
US4213104A (en) * 1978-09-25 1980-07-15 United Technologies Corporation Vacuum encapsulation for surface acoustic wave (SAW) devices
US4381469A (en) * 1979-07-20 1983-04-26 Murata Manufacturing Company, Ltd. Temperature stable piezoelectric device
JPS5694815A (en) * 1979-12-28 1981-07-31 Matsushita Electric Ind Co Ltd Elastic surface wave device
GB2100521B (en) * 1981-05-13 1984-09-12 Plessey Co Plc Electrical device package
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
JPS5977715A (ja) * 1982-10-26 1984-05-04 Murata Mfg Co Ltd チツプ状圧電振動部品
CA1281810C (en) * 1984-02-20 1991-03-19 Stephen P. Rogerson Mounting of saw devices
JPS62109420A (ja) * 1985-11-07 1987-05-20 Alps Electric Co Ltd 弾性表面波素子
US5162822A (en) * 1988-10-31 1992-11-10 Hitachi, Ltd. Saw filter chip mounted on a substrate with shielded conductors on opposite surfaces
JPH02170611A (ja) * 1988-12-22 1990-07-02 Clarion Co Ltd 弾性表面波装置
US5059848A (en) * 1990-08-20 1991-10-22 The United States Of America As Represented By The Secretary Of The Army Low-cost saw packaging technique

Also Published As

Publication number Publication date
EP0535554B1 (de) 1997-03-05
US5237235A (en) 1993-08-17
EP0535554A1 (de) 1993-04-07
JPH05267985A (ja) 1993-10-15
DE69217793T2 (de) 1997-09-18

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee