DE69213522D1 - Verbindungsverfahren für innere TAB-Leiter und Werkzeug zum Verbinden - Google Patents

Verbindungsverfahren für innere TAB-Leiter und Werkzeug zum Verbinden

Info

Publication number
DE69213522D1
DE69213522D1 DE69213522T DE69213522T DE69213522D1 DE 69213522 D1 DE69213522 D1 DE 69213522D1 DE 69213522 T DE69213522 T DE 69213522T DE 69213522 T DE69213522 T DE 69213522T DE 69213522 D1 DE69213522 D1 DE 69213522D1
Authority
DE
Germany
Prior art keywords
connection
tool
inner tab
tab conductors
connection method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69213522T
Other languages
English (en)
Other versions
DE69213522T2 (de
Inventor
Yasuhiro Otsuka
Hideki Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Application granted granted Critical
Publication of DE69213522D1 publication Critical patent/DE69213522D1/de
Publication of DE69213522T2 publication Critical patent/DE69213522T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
DE69213522T 1991-03-27 1992-03-27 Verbindungsverfahren für innere TAB-Leiter und Werkzeug zum Verbinden Expired - Fee Related DE69213522T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8589591 1991-03-27
JP3279370A JP2697411B2 (ja) 1991-03-27 1991-10-25 Ｔａｂインナーリードの接合方法

Publications (2)

Publication Number Publication Date
DE69213522D1 true DE69213522D1 (de) 1996-10-17
DE69213522T2 DE69213522T2 (de) 1997-04-24

Family

ID=26426900

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69213522T Expired - Fee Related DE69213522T2 (de) 1991-03-27 1992-03-27 Verbindungsverfahren für innere TAB-Leiter und Werkzeug zum Verbinden

Country Status (5)

Country Link
US (1) US5288006A (de)
EP (1) EP0506112B1 (de)
JP (1) JP2697411B2 (de)
KR (1) KR100220109B1 (de)
DE (1) DE69213522T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5977618A (en) * 1992-07-24 1999-11-02 Tessera, Inc. Semiconductor connection components and methods with releasable lead support
KR100209457B1 (ko) * 1992-07-24 1999-07-15 토마스 디스테파노 반도체 접속 부품과 그 제조 방법 및 반도체 칩 접속 방법
US6054756A (en) 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
US5390844A (en) * 1993-07-23 1995-02-21 Tessera, Inc. Semiconductor inner lead bonding tool
JP2727970B2 (ja) * 1993-10-07 1998-03-18 日本電気株式会社 ボンディングツール
US5816472A (en) * 1994-01-28 1998-10-06 Hewlett-Packard Company Bonding tool for tape automated assembly
JP2606606B2 (ja) * 1994-10-14 1997-05-07 日本電気株式会社 半導体装置の製造方法
JP3456293B2 (ja) * 1995-03-17 2003-10-14 株式会社デンソー 異種金属の超音波溶接方法
AU6377796A (en) * 1995-05-26 1996-12-11 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substra tes
US5735446A (en) * 1995-07-05 1998-04-07 Ford Global Technologies, Inc. Friction welding non-metallics to metallics
US6148515A (en) * 1996-01-30 2000-11-21 Suzuki Motor Corporation Method of bonding aluminum members
US6089442A (en) * 1996-04-10 2000-07-18 Canon Kabushiki Kaisha Electrode connection method
US5868301A (en) * 1996-04-10 1999-02-09 Tessera, Inc. Semiconductor inner lead bonding tool
US5937276A (en) 1996-12-13 1999-08-10 Tessera, Inc. Bonding lead structure with enhanced encapsulation
US5921460A (en) * 1997-06-05 1999-07-13 Ford Motor Company Method of soldering materials supported on low-melting substrates
US5879206A (en) * 1997-11-05 1999-03-09 Ford Global Technologies, Inc. Terminal connector capable of attachment to a metallic surface
US6019272A (en) * 1997-11-12 2000-02-01 Ford Global Technologies, Inc. Method for attaching a terminal connector to a metallic surface
US6378759B1 (en) * 2000-07-18 2002-04-30 Chartered Semiconductor Manufacturing Ltd. Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding
US7223939B2 (en) * 2004-11-12 2007-05-29 Agc Automotive Americas, R & D, Inc. Electrical connector for a window pane of a vehicle
US7134201B2 (en) * 2004-11-12 2006-11-14 Agc Automotive Americas R&D, Inc. Window pane and a method of bonding a connector to the window pane
US20060163315A1 (en) 2005-01-27 2006-07-27 Delsman Mark A Ribbon bonding tool and process
US20070075012A1 (en) * 2005-10-05 2007-04-05 Estochen Edwin G Tubular assembly and method
JP4927391B2 (ja) 2005-11-25 2012-05-09 東京エレクトロン株式会社 接合方法
JP2007173363A (ja) * 2005-12-20 2007-07-05 Fujitsu Ltd フライングリードの接合方法
CN105598573B (zh) * 2009-02-06 2019-08-20 奥托戴尼电气公司 带式焊接工具及采用所述工具的方法
US10847491B2 (en) 2009-02-06 2020-11-24 Kulicke And Soffa Industries, Inc. Ribbon bonding tools and methods of using the same
CN103443583B (zh) * 2011-03-11 2016-05-25 阿尔卑斯电气株式会社 物理量传感器装置及其制造方法
US9272371B2 (en) 2013-05-30 2016-03-01 Agc Automotive Americas R&D, Inc. Solder joint for an electrical conductor and a window pane including same
US10263362B2 (en) 2017-03-29 2019-04-16 Agc Automotive Americas R&D, Inc. Fluidically sealed enclosure for window electrical connections
US10849192B2 (en) 2017-04-26 2020-11-24 Agc Automotive Americas R&D, Inc. Enclosure assembly for window electrical connections

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3391451A (en) * 1965-03-22 1968-07-09 Sperry Rand Corp Method for preparing electronic circuit units
NL6510032A (de) * 1965-08-03 1967-02-06
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3607580A (en) * 1969-02-24 1971-09-21 Branson Instr Tool having penetration limiting means for joining thermoplastic parts by sonic or ultrasonic energy
US3683105A (en) * 1970-10-13 1972-08-08 Westinghouse Electric Corp Microcircuit modular package
US4189825A (en) * 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
SU776822A1 (ru) * 1979-01-02 1980-11-07 Предприятие П/Я Р-6495 Устройство дл ультразвуковой сварки
JPS6021535A (ja) * 1983-06-30 1985-02-02 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体装置を相互接続する方法
GB8624513D0 (en) * 1986-10-13 1986-11-19 Microelectronics & Computer Single point bonding method
JPH0346343A (ja) * 1989-07-14 1991-02-27 Fujitsu Ltd 半導体製造装置
JP2501473B2 (ja) * 1989-10-05 1996-05-29 シャープ株式会社 配線基板の製造方法

Also Published As

Publication number Publication date
US5288006A (en) 1994-02-22
JPH04355940A (ja) 1992-12-09
DE69213522T2 (de) 1997-04-24
EP0506112A1 (de) 1992-09-30
KR100220109B1 (ko) 1999-09-01
EP0506112B1 (de) 1996-09-11
JP2697411B2 (ja) 1998-01-14

Similar Documents

Publication Publication Date Title
DE69213522D1 (de) Verbindungsverfahren für innere TAB-Leiter und Werkzeug zum Verbinden
DE69527563D1 (de) Automationssystem und -verfahren zum LSI-Entwurf
DE19580698T1 (de) Universelle, automatisierte Keraktektomie-Vorrichtung und Verfahren
DE69429799D1 (de) Verfahren und einrichtung für mikrobische reduktion
NO932537L (no) Broennsilanordning og framgangsmaate for framstilling av samme
DE69435286D1 (de) Verfahren und zusammensetzungen zum hervorrufen von schlaf
DE3777284D1 (de) Verfahren und einrichtung zum plasma-schweissen.
GB2291905B (en) Method and apparatus for testing wells
DE69130208D1 (de) Verfahren, system und zusammensetzung zum induktionslöten
DE3687842D1 (de) Verfahren und geraet zum software-austesten.
DE69429983D1 (de) Datenübertragungsnetz und Verfahren zum Betreiben des Netzes
DE69430474D1 (de) Verfahren und gerät zum verbinden von metallstücken
DE69308361D1 (de) Halbleiteranordnung und Verfahren zum Zusammensetzen derselben
DE69414507D1 (de) Methode und Gerät zum Unterrichten
DE69511080D1 (de) Schnittstellenanordnung und verfahren
DE69412624D1 (de) Verfahren und vorrichtungen zum verbinden von kabeln
NO970726D0 (no) Test-fremgangsmåte
NO920518L (no) Verktoey for inntrekking og kopling av undervannsledninger
DE69419875D1 (de) Vorrichtungen und Verfahren zum Überprüfen von Verbindern
DE69621448D1 (de) Wärmerückstellbarer gegenstand und verfahren zum dichten von kabelverbindungen
DE69500725D1 (de) Verfahren und Gerät zum Löten
NO944891D0 (no) Fremgangsmåte og anordning for avviksboring
DE69211728D1 (de) Immunoassay-Element und Verfahren zum Immuntest
DE69319811D1 (de) Editiermethode und Editiergeräte
NO963943D0 (no) Fremgangsmåte og utstyr for detektering av fluider

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee