DE69205922T2 - Hochvakuumdichtes Substratgehäuse. - Google Patents
Hochvakuumdichtes Substratgehäuse.Info
- Publication number
- DE69205922T2 DE69205922T2 DE69205922T DE69205922T DE69205922T2 DE 69205922 T2 DE69205922 T2 DE 69205922T2 DE 69205922 T DE69205922 T DE 69205922T DE 69205922 T DE69205922 T DE 69205922T DE 69205922 T2 DE69205922 T2 DE 69205922T2
- Authority
- DE
- Germany
- Prior art keywords
- high vacuum
- substrate housing
- vacuum tight
- tight substrate
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/26—Sealing together parts of vessels
- H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
- H01J19/54—Vessels; Containers; Shields associated therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J29/00—Details of cathode-ray tubes or of electron-beam tubes of the types covered by group H01J31/00
- H01J29/86—Vessels; Containers; Vacuum locks
- H01J29/861—Vessels or containers characterised by the form or the structure thereof
- H01J29/862—Vessels or containers characterised by the form or the structure thereof of flat panel cathode ray tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Pressure Vessels And Lids Thereof (AREA)
- Micromachines (AREA)
- Physical Vapour Deposition (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Measuring Fluid Pressure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/751,854 US5247133A (en) | 1991-08-29 | 1991-08-29 | High-vacuum substrate enclosure |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69205922D1 DE69205922D1 (de) | 1995-12-14 |
DE69205922T2 true DE69205922T2 (de) | 1996-05-30 |
Family
ID=25023791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69205922T Expired - Fee Related DE69205922T2 (de) | 1991-08-29 | 1992-08-10 | Hochvakuumdichtes Substratgehäuse. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5247133A (de) |
EP (1) | EP0529392B1 (de) |
JP (1) | JP2507259B2 (de) |
DE (1) | DE69205922T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2705163B1 (fr) * | 1993-05-12 | 1995-07-28 | Pixel Int Sa | Procede de mise en vide et de scellement d'ecrans plats de visualisation. |
JP2570697Y2 (ja) * | 1993-07-14 | 1998-05-06 | 双葉電子工業株式会社 | 真空電子装置およびその外囲器 |
US5763998A (en) * | 1995-09-14 | 1998-06-09 | Chorus Corporation | Field emission display arrangement with improved vacuum control |
US5916004A (en) * | 1996-01-11 | 1999-06-29 | Micron Technology, Inc. | Photolithographically produced flat panel display surface plate support structure |
US5980349A (en) | 1997-05-14 | 1999-11-09 | Micron Technology, Inc. | Anodically-bonded elements for flat panel displays |
US6554671B1 (en) * | 1997-05-14 | 2003-04-29 | Micron Technology, Inc. | Method of anodically bonding elements for flat panel displays |
EP0951068A1 (de) | 1998-04-17 | 1999-10-20 | Interuniversitair Micro-Elektronica Centrum Vzw | Herstellungsverfahren für eine Mikrostruktur mit Innenraum |
FR2793950A1 (fr) | 1999-05-21 | 2000-11-24 | Thomson Plasma | Procede de fabrication de composants sur substrats de verre devant etre scelles, tels que des ecrans d'affichage plats du type panneau a plasma |
WO2006020095A2 (en) * | 2004-07-16 | 2006-02-23 | Geotrust, Inc. | Security systems and services to provide identity and uniform resource identifier verification |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2577576A (en) * | 1950-11-30 | 1951-12-04 | Mannes N Glickman | Hermetic crystal holder |
US3762039A (en) * | 1971-09-10 | 1973-10-02 | Mos Technology Inc | Plastic encapsulation of microcircuits |
US4326214A (en) * | 1976-11-01 | 1982-04-20 | National Semiconductor Corporation | Thermal shock resistant package having an ultraviolet light transmitting window for a semiconductor chip |
GB2010159A (en) * | 1977-10-25 | 1979-06-27 | Bfg Glassgroup | Soldering a vitreous envelope for gas discharge display panels |
US4395244A (en) * | 1979-06-22 | 1983-07-26 | David Glaser | Method of making a display panel |
DE3036671A1 (de) * | 1980-09-29 | 1982-05-13 | Siemens AG, 1000 Berlin und 8000 München | Flacher bildschirm, verfahren zu seiner herstellung und seine verwendung |
DE3343951A1 (de) * | 1983-12-05 | 1985-06-13 | Siemens AG, 1000 Berlin und 8000 München | Anzeigevorrichtung und verfahren zu ihrer herstellung |
US4780572A (en) * | 1985-03-04 | 1988-10-25 | Ngk Spark Plug Co., Ltd. | Device for mounting semiconductors |
US5013871A (en) * | 1988-02-10 | 1991-05-07 | Olin Corporation | Kit for the assembly of a metal electronic package |
US4897508A (en) * | 1988-02-10 | 1990-01-30 | Olin Corporation | Metal electronic package |
US5023398A (en) * | 1988-10-05 | 1991-06-11 | Olin Corporation | Aluminum alloy semiconductor packages |
-
1991
- 1991-08-29 US US07/751,854 patent/US5247133A/en not_active Expired - Lifetime
-
1992
- 1992-08-10 EP EP92113618A patent/EP0529392B1/de not_active Expired - Lifetime
- 1992-08-10 DE DE69205922T patent/DE69205922T2/de not_active Expired - Fee Related
- 1992-08-25 JP JP4248590A patent/JP2507259B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0529392B1 (de) | 1995-11-08 |
JPH05308105A (ja) | 1993-11-19 |
US5247133A (en) | 1993-09-21 |
JP2507259B2 (ja) | 1996-06-12 |
EP0529392A1 (de) | 1993-03-03 |
DE69205922D1 (de) | 1995-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |