DE69200745T2 - Vorrichtung zum Abschrägen der Kerbe eines Plättchen. - Google Patents

Vorrichtung zum Abschrägen der Kerbe eines Plättchen.

Info

Publication number
DE69200745T2
DE69200745T2 DE1992600745 DE69200745T DE69200745T2 DE 69200745 T2 DE69200745 T2 DE 69200745T2 DE 1992600745 DE1992600745 DE 1992600745 DE 69200745 T DE69200745 T DE 69200745T DE 69200745 T2 DE69200745 T2 DE 69200745T2
Authority
DE
Germany
Prior art keywords
chamfering
notch
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1992600745
Other languages
English (en)
Other versions
DE69200745D1 (de
Inventor
Kaoru Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69200745D1 publication Critical patent/DE69200745D1/de
Application granted granted Critical
Publication of DE69200745T2 publication Critical patent/DE69200745T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE1992600745 1991-06-12 1992-06-10 Vorrichtung zum Abschrägen der Kerbe eines Plättchen. Expired - Fee Related DE69200745T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16775491A JP2652090B2 (ja) 1991-06-12 1991-06-12 ウエーハのノッチ部面取り装置

Publications (2)

Publication Number Publication Date
DE69200745D1 DE69200745D1 (de) 1995-01-12
DE69200745T2 true DE69200745T2 (de) 1995-07-13

Family

ID=15855480

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992600745 Expired - Fee Related DE69200745T2 (de) 1991-06-12 1992-06-10 Vorrichtung zum Abschrägen der Kerbe eines Plättchen.

Country Status (3)

Country Link
EP (1) EP0518642B1 (de)
JP (1) JP2652090B2 (de)
DE (1) DE69200745T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111975532A (zh) * 2020-08-25 2020-11-24 赣州市业润自动化设备有限公司 一种带调心装置的单晶硅片倒角设备

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2798345B2 (ja) * 1993-06-11 1998-09-17 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP2832142B2 (ja) * 1993-10-29 1998-12-02 信越半導体株式会社 ウェーハのノッチ部研磨装置
JP3197253B2 (ja) 1998-04-13 2001-08-13 株式会社日平トヤマ ウエーハの面取り方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0632905B2 (ja) * 1986-12-08 1994-05-02 住友電気工業株式会社 ▲ｉｉｉ▼―ｖ族化合物半導体ウエハ薄層化処理方法
JP2541844B2 (ja) * 1988-09-26 1996-10-09 信越半導体株式会社 半導体ウエ―ハ、ノッチ面取り方法及びその装置
US4905425A (en) * 1988-09-30 1990-03-06 Shin-Etsu Handotai Company Limited Method for chamfering the notch of a notch-cut semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111975532A (zh) * 2020-08-25 2020-11-24 赣州市业润自动化设备有限公司 一种带调心装置的单晶硅片倒角设备
CN111975532B (zh) * 2020-08-25 2021-08-31 叶怡晴 一种带调心装置的单晶硅片倒角设备

Also Published As

Publication number Publication date
EP0518642B1 (de) 1994-11-30
DE69200745D1 (de) 1995-01-12
JPH04364729A (ja) 1992-12-17
JP2652090B2 (ja) 1997-09-10
EP0518642A1 (de) 1992-12-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee