DE69125571T2 - Verfahren und Apparat zum Prüfen der Verlötung von Halbleiterbauteilen durch den Nachweis von Leckstrom - Google Patents

Verfahren und Apparat zum Prüfen der Verlötung von Halbleiterbauteilen durch den Nachweis von Leckstrom

Info

Publication number
DE69125571T2
DE69125571T2 DE69125571T DE69125571T DE69125571T2 DE 69125571 T2 DE69125571 T2 DE 69125571T2 DE 69125571 T DE69125571 T DE 69125571T DE 69125571 T DE69125571 T DE 69125571T DE 69125571 T2 DE69125571 T2 DE 69125571T2
Authority
DE
Germany
Prior art keywords
soldering
testing
leakage current
semiconductor components
detecting leakage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69125571T
Other languages
English (en)
Other versions
DE69125571D1 (de
Inventor
John M Heumann
Vance R Harwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Application granted granted Critical
Publication of DE69125571D1 publication Critical patent/DE69125571D1/de
Publication of DE69125571T2 publication Critical patent/DE69125571T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/265—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52—Testing for short-circuits, leakage current or ground faults
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/54—Testing for continuity

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
DE69125571T 1990-10-29 1991-10-07 Verfahren und Apparat zum Prüfen der Verlötung von Halbleiterbauteilen durch den Nachweis von Leckstrom Expired - Fee Related DE69125571T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/605,289 US5111137A (en) 1990-10-29 1990-10-29 Method and apparatus for the detection of leakage current

Publications (2)

Publication Number Publication Date
DE69125571D1 DE69125571D1 (de) 1997-05-15
DE69125571T2 true DE69125571T2 (de) 1997-07-17

Family

ID=24423044

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69125571T Expired - Fee Related DE69125571T2 (de) 1990-10-29 1991-10-07 Verfahren und Apparat zum Prüfen der Verlötung von Halbleiterbauteilen durch den Nachweis von Leckstrom

Country Status (4)

Country Link
US (1) US5111137A (de)
EP (1) EP0483983B1 (de)
JP (1) JP3285913B2 (de)
DE (1) DE69125571T2 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625292A (en) * 1990-12-20 1997-04-29 Hewlett-Packard Company System for measuring the integrity of an electrical contact
US5557209A (en) * 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
JP3214766B2 (ja) * 1992-08-06 2001-10-02 アジレント・テクノロジーズ・インク 接続検査のための装置
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
WO1994016337A1 (en) * 1992-12-31 1994-07-21 United Technologies Corporation Non-contact current injection apparatus and method for use with linear bipolar circuits
JP3396834B2 (ja) * 1997-12-17 2003-04-14 日本電気エンジニアリング株式会社 Ｉｃ接続試験方法
US7474115B1 (en) * 2004-12-28 2009-01-06 Dupont Displays, Inc. Organic electronic device display defect detection
CN101320076B (zh) * 2008-07-23 2011-03-23 潘敏智 一种快恢复二极管的反向动态漏电流测试方法及测试电路
US9778310B2 (en) 2010-11-05 2017-10-03 Kelsey-Hayes Company Apparatus and method for detection of solenoid current
US10551423B1 (en) 2015-01-13 2020-02-04 The United States Of America As Represented By The Secretary Of The Army System and method for simultaneous testing of radiation, environmental and electrical reliability of multiple semiconductor electrical devices
FR3068781A1 (fr) 2017-07-06 2019-01-11 Ateq Procede de detection de fuite d'une piece creuse et installation pour la mise en œuvre d'un tel procede
FR3073623B1 (fr) 2017-11-16 2019-11-08 Ateq Installation et procede de detection et de localisation de fuite dans un circuit de transport d'un fluide, notamment d'un aeronef
CN112334783B (zh) * 2018-06-21 2024-03-22 三菱电机株式会社 半导体元件的可靠性评价装置和半导体元件的可靠性评价方法
ES2966778T3 (es) * 2018-08-31 2024-04-24 Ateq Corp Dispositivo y procedimientos de prueba de fugas de batería
FR3092171B1 (fr) 2019-01-29 2021-04-30 Ateq Système de détection de fuite par gaz traceur et utilisation correspondante.
FR3106661B1 (fr) 2020-01-28 2022-01-21 Ateq Dispositif de détection de fuites
CN112924840B (zh) * 2021-02-26 2023-09-12 航天科工防御技术研究试验中心 发光二极管失效定位方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4575676A (en) * 1983-04-04 1986-03-11 Advanced Research And Applications Corporation Method and apparatus for radiation testing of electron devices
US4588945A (en) * 1983-06-13 1986-05-13 Hewlett-Packard Company High throughput circuit tester and test technique avoiding overdriving damage
US4588950A (en) * 1983-11-15 1986-05-13 Data Probe Corporation Test system for VLSI digital circuit and method of testing
US4588946A (en) * 1983-12-30 1986-05-13 At&T Bell Laboratories Method for measuring current at a p-n junction
US4712063A (en) * 1984-05-29 1987-12-08 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for measuring areas of photoelectric cells and photoelectric cell performance parameters
US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
US4644264A (en) * 1985-03-29 1987-02-17 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
JPS61267336A (ja) * 1985-05-21 1986-11-26 Matsushita Electric Ind Co Ltd 半導体装置の検査方法および検査装置
US4779041A (en) * 1987-05-20 1988-10-18 Hewlett-Packard Company Integrated circuit transfer test device system
US4870352A (en) * 1988-07-05 1989-09-26 Fibertek, Inc. Contactless current probe based on electron tunneling

Also Published As

Publication number Publication date
EP0483983A2 (de) 1992-05-06
JP3285913B2 (ja) 2002-05-27
EP0483983A3 (en) 1992-09-23
DE69125571D1 (de) 1997-05-15
US5111137A (en) 1992-05-05
EP0483983B1 (de) 1997-04-09
JPH04288900A (ja) 1992-10-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AGILENT TECHNOLOGIES, INC. (N.D.GES.D.STAATES DELA

8339 Ceased/non-payment of the annual fee