DE69121461D1 - Lichtempfindliches, wärmebeständiges Polymer mit Hydroxyphenylgruppen - Google Patents

Lichtempfindliches, wärmebeständiges Polymer mit Hydroxyphenylgruppen

Info

Publication number
DE69121461D1
DE69121461D1 DE69121461T DE69121461T DE69121461D1 DE 69121461 D1 DE69121461 D1 DE 69121461D1 DE 69121461 T DE69121461 T DE 69121461T DE 69121461 T DE69121461 T DE 69121461T DE 69121461 D1 DE69121461 D1 DE 69121461D1
Authority
DE
Germany
Prior art keywords
photosensitive
heat
resistant polymer
hydroxyphenyl groups
hydroxyphenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69121461T
Other languages
English (en)
Other versions
DE69121461T2 (de
Inventor
Hirotoshi Maeda
Kouichi Kunimune
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JNC Corp
Original Assignee
Chisso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chisso Corp filed Critical Chisso Corp
Publication of DE69121461D1 publication Critical patent/DE69121461D1/de
Application granted granted Critical
Publication of DE69121461T2 publication Critical patent/DE69121461T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1089—Polyisoimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/107—Polyamide or polyurethane
DE69121461T 1990-05-10 1991-05-08 Lichtempfindliches, wärmebeständiges Polymer mit Hydroxyphenylgruppen Expired - Fee Related DE69121461T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2118805A JPH0415226A (ja) 1990-05-10 1990-05-10 ヒドロキシフェニル基を有する感光性耐熱重合体

Publications (2)

Publication Number Publication Date
DE69121461D1 true DE69121461D1 (de) 1996-09-26
DE69121461T2 DE69121461T2 (de) 1997-03-06

Family

ID=14745561

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69121461T Expired - Fee Related DE69121461T2 (de) 1990-05-10 1991-05-08 Lichtempfindliches, wärmebeständiges Polymer mit Hydroxyphenylgruppen

Country Status (5)

Country Link
US (2) US5298359A (de)
EP (1) EP0456469B1 (de)
JP (1) JPH0415226A (de)
KR (1) KR960004117B1 (de)
DE (1) DE69121461T2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0478321B1 (de) * 1990-09-28 1997-11-12 Kabushiki Kaisha Toshiba Fotoempfindliche Harzzusammensetzung zum Herstellen eines Polyimidfilmmusters und Verfahren zum Herstellen eines Polyimidfilmmusters
US5614354A (en) * 1993-02-03 1997-03-25 Toray Industries, Inc. Method of forming positive polyimide patterns
JP3004583U (ja) * 1994-02-15 1994-11-22 相云 李 石材研磨機
US6010825A (en) * 1997-09-11 2000-01-04 Olin Microelectronics Chemicals, Inc. Negatively acting photoresist composition based on polyimide precursors
US6004722A (en) * 1998-04-06 1999-12-21 Chartered Semiconductor Manufacturing Ltd. Hydrolytically stable organic polymer material for organic polymer anti-reflective (ARC) layer
US6379865B1 (en) 2000-04-11 2002-04-30 3M Innovative Properties Company Photoimageable, aqueous acid soluble polyimide polymers
US6841652B2 (en) 2001-05-17 2005-01-11 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Space environmentally durable polyimides and copolyimides
EP1688997B1 (de) * 2005-02-02 2014-04-16 Infineon Technologies AG Elektronisches Bauteil mit gestapelten Halbleiterchips
JP2019070074A (ja) * 2017-10-10 2019-05-09 Jnc株式会社 イソイミド結合を有する重合体およびその製造方法、ならびにイミド結合を有する重合体
JP7454672B2 (ja) * 2020-06-23 2024-03-22 富士フイルム株式会社 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイス、及び、熱硬化性樹脂

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3282898A (en) * 1963-11-21 1966-11-01 Du Pont Treatment of aromatic polyamide-acids with carbodiimides
US4395527A (en) * 1978-05-17 1983-07-26 M & T Chemicals Inc. Siloxane-containing polymers
DE2933826A1 (de) * 1979-08-21 1981-03-19 Siemens AG, 1000 Berlin und 8000 München Polyimid-, polyisoindolochinazolindion-, polyoxazindion- und polychinazolindion-vorstufen sowie deren herstellung
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
DE3411659A1 (de) * 1984-03-29 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyoxazol- und polythiazol-vorstufen
EP0188205B1 (de) * 1985-01-15 1988-06-22 Ciba-Geigy Ag Polyamidester-Fotoresist-Formulierungen gesteigerter Empfindlichkeit
US4551522A (en) * 1985-04-26 1985-11-05 E. I. Du Pont De Nemours And Company Process for making photopolymerizable aromatic polyamic acid derivatives
JPS62129316A (ja) * 1985-07-16 1987-06-11 Kanegafuchi Chem Ind Co Ltd ポリイミド前駆体を部分的に閉環させた薄膜
US4942108A (en) * 1985-12-05 1990-07-17 International Business Machines Corporation Process of making diazoquinone sensitized polyamic acid based photoresist compositions having reduced dissolution rates in alkaline developers
US4847359A (en) * 1986-06-30 1989-07-11 Ciba-Geigy Corporation Diamino-9,10-dihydroanthracenes and polyamide acid (esters) and polyimides derived therefrom
US4830953A (en) * 1986-08-18 1989-05-16 Ciba-Geigy Corporation Radiation-sensitive coating composition with polyazide and polyimide and process of photo-crosslinking the coating
US5037720A (en) * 1987-07-21 1991-08-06 Hoechst Celanese Corporation Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use
US4927736A (en) * 1987-07-21 1990-05-22 Hoechst Celanese Corporation Hydroxy polyimides and high temperature positive photoresists therefrom
US5037949A (en) * 1987-11-24 1991-08-06 Hoechst Celanese Corp. Polymers prepared from 4,4'-bis[2-(amino (halo) phenoxyphenyl) hexafluoroisopropyl]diphenyl ether
JPH023053A (ja) * 1988-06-20 1990-01-08 Chisso Corp チオール基を有する感光性重合体
US5114826A (en) * 1989-12-28 1992-05-19 Ibm Corporation Photosensitive polyimide compositions
US5098814A (en) * 1990-04-26 1992-03-24 Eastman Kodak Company Laminate for the formation of beam leads for IC chip bonding

Also Published As

Publication number Publication date
EP0456469A2 (de) 1991-11-13
KR920005732A (ko) 1992-04-03
KR960004117B1 (ko) 1996-03-26
JPH0415226A (ja) 1992-01-20
US5298359A (en) 1994-03-29
EP0456469A3 (en) 1992-09-02
EP0456469B1 (de) 1996-08-21
US5320935A (en) 1994-06-14
DE69121461T2 (de) 1997-03-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee