DE69115697T2 - Mehrfach rückhaltefedereinrichtung - Google Patents
Mehrfach rückhaltefedereinrichtungInfo
- Publication number
- DE69115697T2 DE69115697T2 DE69115697T DE69115697T DE69115697T2 DE 69115697 T2 DE69115697 T2 DE 69115697T2 DE 69115697 T DE69115697 T DE 69115697T DE 69115697 T DE69115697 T DE 69115697T DE 69115697 T2 DE69115697 T2 DE 69115697T2
- Authority
- DE
- Germany
- Prior art keywords
- spring device
- restraint spring
- multiple restraint
- spring
- restraint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Springs (AREA)
- Punching Or Piercing (AREA)
- Insertion Pins And Rivets (AREA)
- Connection Of Plates (AREA)
- Clamps And Clips (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9007760A FR2663809B1 (fr) | 1990-06-21 | 1990-06-21 | Organe multiple de retenue a ressort et son procede de fabrication. |
PCT/EP1991/001148 WO1991019420A2 (en) | 1990-06-21 | 1991-06-21 | Multiple spring-retention device and method for manufacturing it |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69115697D1 DE69115697D1 (de) | 1996-02-01 |
DE69115697T2 true DE69115697T2 (de) | 1996-07-11 |
Family
ID=9397849
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69115697T Expired - Fee Related DE69115697T2 (de) | 1990-06-21 | 1991-06-21 | Mehrfach rückhaltefedereinrichtung |
Country Status (6)
Country | Link |
---|---|
US (1) | US5344113A (de) |
EP (1) | EP0535130B1 (de) |
DE (1) | DE69115697T2 (de) |
ES (1) | ES2081485T3 (de) |
FR (1) | FR2663809B1 (de) |
WO (1) | WO1991019420A2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5461541A (en) * | 1994-02-22 | 1995-10-24 | Dana Corporation | Enclosure for an electronic circuit module |
US5731955A (en) * | 1996-02-05 | 1998-03-24 | Ford Motor Company | Spring clip for electronics assembly |
US6364347B1 (en) * | 1999-03-05 | 2002-04-02 | Magne Seating Systems Inc. | Self locking fastener |
US8893770B2 (en) * | 2011-07-29 | 2014-11-25 | Schneider Electric It Corporation | Heat sink assembly for electronic components |
JP6075176B2 (ja) * | 2013-04-16 | 2017-02-08 | Tdk株式会社 | 電源装置 |
US10192846B2 (en) | 2014-11-05 | 2019-01-29 | Infineon Technologies Austria Ag | Method of inserting an electronic component into a slot in a circuit board |
US10553557B2 (en) * | 2014-11-05 | 2020-02-04 | Infineon Technologies Austria Ag | Electronic component, system and method |
US10064287B2 (en) | 2014-11-05 | 2018-08-28 | Infineon Technologies Austria Ag | System and method of providing a semiconductor carrier and redistribution structure |
KR102457660B1 (ko) | 2016-01-08 | 2022-10-24 | 엘지이노텍 주식회사 | 전력 변환 장치 |
DE102017204600A1 (de) * | 2017-03-20 | 2018-09-20 | Robert Bosch Gmbh | Verbinder zum Verbinden von zwei Gehäuseteilen und Gehäuse umfassend zwei Gehäuseteile und mindestens einen Verbinder |
US9905274B1 (en) * | 2017-04-26 | 2018-02-27 | Dell Products, Lp | Flexible heat exchanging mechanism |
CN109428497B (zh) * | 2017-08-23 | 2020-09-18 | 台达电子企业管理(上海)有限公司 | 电源模块的组装结构及其组装方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3766440A (en) * | 1972-08-11 | 1973-10-16 | Gen Motors Corp | Ceramic integrated circuit convector assembly |
US3992653A (en) * | 1975-08-18 | 1976-11-16 | Sperry Rand Corporation | Zero insertion force card guide |
LU83439A1 (de) * | 1980-09-25 | 1981-10-29 | Siemens Ag | Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul |
US4689719A (en) * | 1980-09-25 | 1987-08-25 | Siemens Aktiengesellschaft | Housing-free vertically insertable single-in-line circuit module |
JPS5886752A (ja) * | 1981-11-18 | 1983-05-24 | Matsushita Electric Ind Co Ltd | 発熱部品取付装置 |
US4688150A (en) * | 1984-06-15 | 1987-08-18 | Texas Instruments Incorporated | High pin count chip carrier package |
FR2578710B1 (fr) * | 1985-03-07 | 1988-03-04 | Bendix Electronics Sa | Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance |
US5237485A (en) * | 1985-04-26 | 1993-08-17 | Sgs Microelettronica S.P.A. | Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board |
US4669028A (en) * | 1986-02-18 | 1987-05-26 | Ncr Corporation | Heat sink for solid state devices connected to a circuit board |
US4855867A (en) * | 1987-02-02 | 1989-08-08 | International Business Machines Corporation | Full panel electronic packaging structure |
SE460008B (sv) * | 1987-11-04 | 1989-08-28 | Saab Scania Ab | Kylkropp foer ett elektriskt kretskort samt anvaendning daerav |
US4803545A (en) * | 1988-03-17 | 1989-02-07 | Motorola, Inc. | Self-fixturing heat sink |
US4961125A (en) * | 1989-08-18 | 1990-10-02 | Thermalloy Incorporated | Apparatus and method of attaching an electronic device package and a heat sink to a circuit board |
US5138524A (en) * | 1991-09-19 | 1992-08-11 | Thermalloy Incorporated | Apparatus for securing electronic device packages to heat sinks |
-
1990
- 1990-06-21 FR FR9007760A patent/FR2663809B1/fr not_active Expired - Fee Related
-
1991
- 1991-06-21 WO PCT/EP1991/001148 patent/WO1991019420A2/en active IP Right Grant
- 1991-06-21 ES ES91912225T patent/ES2081485T3/es not_active Expired - Lifetime
- 1991-06-21 DE DE69115697T patent/DE69115697T2/de not_active Expired - Fee Related
- 1991-06-21 EP EP91912225A patent/EP0535130B1/de not_active Expired - Lifetime
- 1991-06-21 US US07/952,870 patent/US5344113A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO1991019420A3 (en) | 1992-04-16 |
FR2663809B1 (fr) | 1996-07-19 |
WO1991019420A2 (en) | 1991-12-26 |
DE69115697D1 (de) | 1996-02-01 |
US5344113A (en) | 1994-09-06 |
EP0535130B1 (de) | 1995-12-20 |
EP0535130A1 (de) | 1993-04-07 |
ES2081485T3 (es) | 1996-03-16 |
FR2663809A1 (fr) | 1991-12-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: BERG, P., DIPL.-ING., PAT.-ASS., 80339 MUENCHEN |
|
8327 | Change in the person/name/address of the patent owner |
Owner name: SIEMENS VDO AUTOMOTIVE, TOULOUSE, FR |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: MAIER, D., DIPL.-ING. UNIV., PAT.-ASS., 85221 DACH |
|
8339 | Ceased/non-payment of the annual fee |