ES2081485T3 - Dispositivo de retencion por resorte multiple y metodo para su fabricacion. - Google Patents

Dispositivo de retencion por resorte multiple y metodo para su fabricacion.

Info

Publication number
ES2081485T3
ES2081485T3 ES91912225T ES91912225T ES2081485T3 ES 2081485 T3 ES2081485 T3 ES 2081485T3 ES 91912225 T ES91912225 T ES 91912225T ES 91912225 T ES91912225 T ES 91912225T ES 2081485 T3 ES2081485 T3 ES 2081485T3
Authority
ES
Spain
Prior art keywords
components
manufacture
electronic
retention device
multiple spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES91912225T
Other languages
English (en)
Inventor
Gilles Jurek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive France SAS
Original Assignee
Siemens Automotive SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Automotive SA filed Critical Siemens Automotive SA
Application granted granted Critical
Publication of ES2081485T3 publication Critical patent/ES2081485T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Connection Of Plates (AREA)
  • Springs (AREA)
  • Insertion Pins And Rivets (AREA)
  • Clamps And Clips (AREA)
  • Punching Or Piercing (AREA)

Abstract

EL DISPOSITIVO COMPRENDE UNA PEQUEÑA VARILLA DE CONEXION (1) Y UNA PLURALIDAD DE LENGUETAS ELASTICAS SUJETAS EN (3) SOBRE LA PEQUEÑA VARILLA. UNOS TORNILLOS (8) FIJAN EL DISPOSITIVO SOBRE LA BASE (6) DE UN ALOJAMIENTO QUE RECIBE UNA TARJETA DE CIRCUITO ELECTRONICO (5) ASOCIADA CON COMPONENTES ELECTRONICOS (4). LAS LENGUETAS (2) COMPRIMEN LOS COMPONENTES (4) CONTRA UN RADIADOR (7). EL DISPOSITIVO TIENE UNA NATURALEZA MODULAR QUE PERMITE LA PRODUCCION DE UNA FAMILIA DE DISPOSITIVOS DE ESTE TIPO ADAPTADOS A DISTRIBUCIONES VARIABLES DE COMPONENTES (4). EL DISPOSITIVO TIENE APLICACION EN LA REFRIGERACION DE COMPONENTES ELECTRONICOS EN UN ALOJAMIENTO DE CONTROL DE DISPOSITIVOS ELECTRONICOS PARA UN AUTOMOVIL.
ES91912225T 1990-06-21 1991-06-21 Dispositivo de retencion por resorte multiple y metodo para su fabricacion. Expired - Lifetime ES2081485T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9007760A FR2663809B1 (fr) 1990-06-21 1990-06-21 Organe multiple de retenue a ressort et son procede de fabrication.

Publications (1)

Publication Number Publication Date
ES2081485T3 true ES2081485T3 (es) 1996-03-16

Family

ID=9397849

Family Applications (1)

Application Number Title Priority Date Filing Date
ES91912225T Expired - Lifetime ES2081485T3 (es) 1990-06-21 1991-06-21 Dispositivo de retencion por resorte multiple y metodo para su fabricacion.

Country Status (6)

Country Link
US (1) US5344113A (es)
EP (1) EP0535130B1 (es)
DE (1) DE69115697T2 (es)
ES (1) ES2081485T3 (es)
FR (1) FR2663809B1 (es)
WO (1) WO1991019420A2 (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5461541A (en) * 1994-02-22 1995-10-24 Dana Corporation Enclosure for an electronic circuit module
US5731955A (en) * 1996-02-05 1998-03-24 Ford Motor Company Spring clip for electronics assembly
WO2000053462A1 (en) * 1999-03-05 2000-09-14 Magna Seating Systems Inc. Self locking fastener
US8893770B2 (en) 2011-07-29 2014-11-25 Schneider Electric It Corporation Heat sink assembly for electronic components
JP6075176B2 (ja) * 2013-04-16 2017-02-08 Tdk株式会社 電源装置
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
KR102457660B1 (ko) * 2016-01-08 2022-10-24 엘지이노텍 주식회사 전력 변환 장치
DE102017204600A1 (de) * 2017-03-20 2018-09-20 Robert Bosch Gmbh Verbinder zum Verbinden von zwei Gehäuseteilen und Gehäuse umfassend zwei Gehäuseteile und mindestens einen Verbinder
US9905274B1 (en) * 2017-04-26 2018-02-27 Dell Products, Lp Flexible heat exchanging mechanism
CN109428497B (zh) * 2017-08-23 2020-09-18 台达电子企业管理（上海）有限公司 电源模块的组装结构及其组装方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3766440A (en) * 1972-08-11 1973-10-16 Gen Motors Corp Ceramic integrated circuit convector assembly
US3992653A (en) * 1975-08-18 1976-11-16 Sperry Rand Corporation Zero insertion force card guide
LU83439A1 (de) * 1980-09-25 1981-10-29 Siemens Ag Gehaeuseloses,senkrecht steckbares single-in-line-schaltungsmodul
US4689719A (en) * 1980-09-25 1987-08-25 Siemens Aktiengesellschaft Housing-free vertically insertable single-in-line circuit module
JPS5886752A (ja) * 1981-11-18 1983-05-24 Matsushita Electric Ind Co Ltd 発熱部品取付装置
US4688150A (en) * 1984-06-15 1987-08-18 Texas Instruments Incorporated High pin count chip carrier package
FR2578710B1 (fr) * 1985-03-07 1988-03-04 Bendix Electronics Sa Agrafe multiple de fixation et dispositif de montage collectif de composants electroniques de puissance
US5237485A (en) * 1985-04-26 1993-08-17 Sgs Microelettronica S.P.A. Apparatus and method for improved thermal coupling of a semiconductor package to a cooling plate and increased electrical coupling of package leads on more than one side of the package to a circuit board
US4669028A (en) * 1986-02-18 1987-05-26 Ncr Corporation Heat sink for solid state devices connected to a circuit board
US4855867A (en) * 1987-02-02 1989-08-08 International Business Machines Corporation Full panel electronic packaging structure
SE460008B (sv) * 1987-11-04 1989-08-28 Saab Scania Ab Kylkropp foer ett elektriskt kretskort samt anvaendning daerav
US4803545A (en) * 1988-03-17 1989-02-07 Motorola, Inc. Self-fixturing heat sink
US4961125A (en) * 1989-08-18 1990-10-02 Thermalloy Incorporated Apparatus and method of attaching an electronic device package and a heat sink to a circuit board
US5138524A (en) * 1991-09-19 1992-08-11 Thermalloy Incorporated Apparatus for securing electronic device packages to heat sinks

Also Published As

Publication number Publication date
WO1991019420A3 (en) 1992-04-16
FR2663809B1 (fr) 1996-07-19
EP0535130B1 (en) 1995-12-20
EP0535130A1 (en) 1993-04-07
DE69115697D1 (de) 1996-02-01
FR2663809A1 (fr) 1991-12-27
US5344113A (en) 1994-09-06
DE69115697T2 (de) 1996-07-11
WO1991019420A2 (en) 1991-12-26

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