DE69115234T2 - Verfahren und Vorrichtung zur Handhabung von Wafern. - Google Patents

Verfahren und Vorrichtung zur Handhabung von Wafern.

Info

Publication number
DE69115234T2
DE69115234T2 DE69115234T DE69115234T DE69115234T2 DE 69115234 T2 DE69115234 T2 DE 69115234T2 DE 69115234 T DE69115234 T DE 69115234T DE 69115234 T DE69115234 T DE 69115234T DE 69115234 T2 DE69115234 T2 DE 69115234T2
Authority
DE
Germany
Prior art keywords
handling wafers
wafers
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69115234T
Other languages
English (en)
Other versions
DE69115234D1 (de
Inventor
Kohichi Tanaka
Makoto Tsukuda
Fumio Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69115234D1 publication Critical patent/DE69115234D1/de
Application granted granted Critical
Publication of DE69115234T2 publication Critical patent/DE69115234T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
DE69115234T 1990-12-26 1991-12-24 Verfahren und Vorrichtung zur Handhabung von Wafern. Expired - Fee Related DE69115234T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2414067A JPH0770504B2 (ja) 1990-12-26 1990-12-26 ウエーハのハンドリング方法及び装置

Publications (2)

Publication Number Publication Date
DE69115234D1 DE69115234D1 (de) 1996-01-18
DE69115234T2 true DE69115234T2 (de) 1996-08-01

Family

ID=18522603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69115234T Expired - Fee Related DE69115234T2 (de) 1990-12-26 1991-12-24 Verfahren und Vorrichtung zur Handhabung von Wafern.

Country Status (4)

Country Link
US (1) US5226758A (de)
EP (1) EP0493117B1 (de)
JP (1) JPH0770504B2 (de)
DE (1) DE69115234T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5421889A (en) * 1993-06-29 1995-06-06 Tokyo Electron Limited Method and apparatus for inverting samples in a process
US5733175A (en) 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US7169015B2 (en) 1995-05-23 2007-01-30 Nova Measuring Instruments Ltd. Apparatus for optical inspection of wafers during processing
IL113829A (en) 1995-05-23 2000-12-06 Nova Measuring Instr Ltd Apparatus for optical inspection of wafers during polishing
US6516509B1 (en) * 1996-06-07 2003-02-11 Canon Kabushiki Kaisha Method of manufacturing a liquid jet head having a plurality of movable members
US5765890A (en) * 1996-10-03 1998-06-16 Memc Electronic Materials, Inc. Device for transferring a semiconductor wafer
US5993148A (en) 1997-07-22 1999-11-30 Micron Technology, Inc. Article transfer methods
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
ATE242064T1 (de) 1998-02-14 2003-06-15 Lam Res Corp Vorrichtung zum laden von halbleiterscheiben
US6045299A (en) * 1998-04-13 2000-04-04 International Business Machines Corp. Unidirectional gate between interconnecting fluid transport regions
JP2000040679A (ja) * 1998-07-24 2000-02-08 Hitachi Ltd 半導体集積回路装置の製造方法
US6368183B1 (en) * 1999-02-03 2002-04-09 Speedfam-Ipec Corporation Wafer cleaning apparatus and associated wafer processing methods
US6318953B1 (en) * 1999-07-12 2001-11-20 Asyst Technologies, Inc. SMIF-compatible open cassette enclosure
US6413356B1 (en) * 2000-05-02 2002-07-02 Applied Materials, Inc. Substrate loader for a semiconductor processing system
JP5591562B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置決め装置
JP5591563B2 (ja) * 2010-03-10 2014-09-17 日本発條株式会社 位置確認装置
JP6048400B2 (ja) * 2011-03-30 2016-12-21 大日本印刷株式会社 超臨界乾燥装置及び超臨界乾燥方法
JP6602720B2 (ja) 2016-04-04 2019-11-06 グローバルウェーハズ・ジャパン株式会社 半導体基板の保護膜形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3630804A (en) * 1968-08-19 1971-12-28 Chemcut Corp Etching apparatus
JPS58171255A (ja) * 1982-03-29 1983-10-07 Toshiba Corp 両面鏡面研摩装置
JPS609129A (ja) * 1983-06-29 1985-01-18 Fujitsu Ltd ウエツト処理装置
JPH029319A (ja) * 1988-06-28 1990-01-12 Yamamoto Mfg Co Ltd ロックファイバー成形物の処理方法および処理装置と処理物を用いた土壌培養剤

Also Published As

Publication number Publication date
JPH04225229A (ja) 1992-08-14
EP0493117A2 (de) 1992-07-01
DE69115234D1 (de) 1996-01-18
EP0493117B1 (de) 1995-12-06
JPH0770504B2 (ja) 1995-07-31
EP0493117A3 (de) 1994-02-16
US5226758A (en) 1993-07-13

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee