DE69112010D1 - Kühlfinger für Halbleiterschaltung und kryogenische Anordnung mit solchem Finger. - Google Patents

Kühlfinger für Halbleiterschaltung und kryogenische Anordnung mit solchem Finger.

Info

Publication number
DE69112010D1
DE69112010D1 DE69112010T DE69112010T DE69112010D1 DE 69112010 D1 DE69112010 D1 DE 69112010D1 DE 69112010 T DE69112010 T DE 69112010T DE 69112010 T DE69112010 T DE 69112010T DE 69112010 D1 DE69112010 D1 DE 69112010D1
Authority
DE
Germany
Prior art keywords
finger
semiconductor circuit
cold
cryogenic
arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69112010T
Other languages
English (en)
Other versions
DE69112010T2 (de
Inventor
Patrick Langle
Jean-Pierre Langlet
Joseph Loiseau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Societe Anonyme de Telecommunications SAT
Original Assignee
Societe Anonyme de Telecommunications SAT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Societe Anonyme de Telecommunications SAT filed Critical Societe Anonyme de Telecommunications SAT
Application granted granted Critical
Publication of DE69112010D1 publication Critical patent/DE69112010D1/de
Publication of DE69112010T2 publication Critical patent/DE69112010T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/02—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point using Joule-Thompson effect; using vortex effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Radiation Pyrometers (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
DE1991612010 1990-12-28 1991-12-19 Kühlfinger für Halbleiterschaltung und kryogenische Anordnung mit solchem Finger. Expired - Fee Related DE69112010T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9016454A FR2671230B1 (fr) 1990-12-28 1990-12-28 Doigt de refroidissement d'un circuit semi-conducteur et dispositif cryogenique pourvu d'un tel doigt.

Publications (2)

Publication Number Publication Date
DE69112010D1 true DE69112010D1 (de) 1995-09-14
DE69112010T2 DE69112010T2 (de) 1996-04-11

Family

ID=9403816

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991612010 Expired - Fee Related DE69112010T2 (de) 1990-12-28 1991-12-19 Kühlfinger für Halbleiterschaltung und kryogenische Anordnung mit solchem Finger.

Country Status (4)

Country Link
EP (1) EP0493208B1 (de)
DE (1) DE69112010T2 (de)
ES (1) ES2077200T3 (de)
FR (1) FR2671230B1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140141A (en) * 1998-12-23 2000-10-31 Sun Microsystems, Inc. Method for cooling backside optically probed integrated circuits
FR2834127B1 (fr) * 2001-12-26 2005-01-14 Sagem Photodetecteur refroidi
FR2856522B1 (fr) 2003-06-20 2005-08-19 Sagem Photodetecteur refroidi
FR2860637B1 (fr) * 2003-10-01 2005-12-02 Sagem Dispositif de support d'un detecteur
CN108895696B (zh) * 2018-06-08 2020-06-09 上海理工大学 具有锯齿形微通道节流制冷器的复合冷却装置及设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4344302A (en) * 1981-06-08 1982-08-17 Hughes Aircraft Company Thermal coupling structure for cryogenic refrigeration
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
FR2638023B1 (fr) * 1988-10-13 1992-07-31 Telecommunications Sa Dispositif cryostatique pour detecteur de rayonnements
EP0372108B1 (de) * 1988-12-05 1994-08-31 Heinz Karl Diedrich Vakuumbehälter zum kryogenischen Kühlen einer Packung für eine elektronische Anordnung

Also Published As

Publication number Publication date
EP0493208B1 (de) 1995-08-09
ES2077200T3 (es) 1995-11-16
EP0493208A1 (de) 1992-07-01
DE69112010T2 (de) 1996-04-11
FR2671230A1 (fr) 1992-07-03
FR2671230B1 (fr) 1993-04-16

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee