DE69103915D1 - Elektrostatische Klemmvorrichtung und Verfahren. - Google Patents

Elektrostatische Klemmvorrichtung und Verfahren.

Info

Publication number
DE69103915D1
DE69103915D1 DE69103915T DE69103915T DE69103915D1 DE 69103915 D1 DE69103915 D1 DE 69103915D1 DE 69103915 T DE69103915 T DE 69103915T DE 69103915 T DE69103915 T DE 69103915T DE 69103915 D1 DE69103915 D1 DE 69103915D1
Authority
DE
Germany
Prior art keywords
electrostatic clamp
electrostatic
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69103915T
Other languages
English (en)
Other versions
DE69103915T2 (de
Inventor
Stephen E Savas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of DE69103915D1 publication Critical patent/DE69103915D1/de
Publication of DE69103915T2 publication Critical patent/DE69103915T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
DE1991603915 1990-01-25 1991-01-02 Elektrostatische Klemmvorrichtung und Verfahren. Expired - Fee Related DE69103915T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US47028890A 1990-01-25 1990-01-25

Publications (2)

Publication Number Publication Date
DE69103915D1 true DE69103915D1 (de) 1994-10-20
DE69103915T2 DE69103915T2 (de) 1995-05-11

Family

ID=23866990

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1991603915 Expired - Fee Related DE69103915T2 (de) 1990-01-25 1991-01-02 Elektrostatische Klemmvorrichtung und Verfahren.

Country Status (3)

Country Link
EP (1) EP0439000B1 (de)
JP (1) JPH07211767A (de)
DE (1) DE69103915T2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0478133A (ja) * 1990-07-20 1992-03-12 Tokyo Electron Ltd プラズマ処理装置
DE69231299T2 (de) * 1991-11-07 2001-01-18 Varian Semiconductor Equipment Verfahren zur Herstellung einer elektrostatischen Halteplatte
AU6158094A (en) * 1993-03-08 1994-09-26 Whitehead, John Anthony Bailie Non-adhesive ecologically-pure electroadhesion method of clamping and fixing materials
JPH06326175A (ja) * 1993-04-22 1994-11-25 Applied Materials Inc 集積回路処理装置において使用されるウエハサポートの誘電材への保護被覆とその形成方法
US5467249A (en) * 1993-12-20 1995-11-14 International Business Machines Corporation Electrostatic chuck with reference electrode
US5729423A (en) * 1994-01-31 1998-03-17 Applied Materials, Inc. Puncture resistant electrostatic chuck
US6278600B1 (en) 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
JPH07257751A (ja) * 1994-03-18 1995-10-09 Kanagawa Kagaku Gijutsu Akad 静電浮上搬送装置及びその静電浮上用電極
US5792562A (en) * 1995-01-12 1998-08-11 Applied Materials, Inc. Electrostatic chuck with polymeric impregnation and method of making
US5835333A (en) * 1995-10-30 1998-11-10 Lam Research Corporation Negative offset bipolar electrostatic chucks
US5805408A (en) * 1995-12-22 1998-09-08 Lam Research Corporation Electrostatic clamp with lip seal for clamping substrates
US6108189A (en) 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US5764471A (en) * 1996-05-08 1998-06-09 Applied Materials, Inc. Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
US5737175A (en) * 1996-06-19 1998-04-07 Lam Research Corporation Bias-tracking D.C. power circuit for an electrostatic chuck
US5790365A (en) * 1996-07-31 1998-08-04 Applied Materials, Inc. Method and apparatus for releasing a workpiece from and electrostatic chuck
US5904779A (en) * 1996-12-19 1999-05-18 Lam Research Corporation Wafer electrical discharge control by wafer lifter system
US6035101A (en) * 1997-02-12 2000-03-07 Applied Materials, Inc. High temperature multi-layered alloy heater assembly and related methods
US5835335A (en) * 1997-03-26 1998-11-10 Lam Research Corporation Unbalanced bipolar electrostatic chuck power supplies and methods thereof
US5841624A (en) * 1997-06-09 1998-11-24 Applied Materials, Inc. Cover layer for a substrate support chuck and method of fabricating same
US6242767B1 (en) 1997-11-10 2001-06-05 Lightspeed Semiconductor Corp. Asic routing architecture
US6033482A (en) * 1998-04-10 2000-03-07 Applied Materials, Inc. Method for igniting a plasma in a plasma processing chamber
US6361645B1 (en) * 1998-10-08 2002-03-26 Lam Research Corporation Method and device for compensating wafer bias in a plasma processing chamber
US6215640B1 (en) 1998-12-10 2001-04-10 Applied Materials, Inc. Apparatus and method for actively controlling surface potential of an electrostatic chuck
US6263829B1 (en) 1999-01-22 2001-07-24 Applied Materials, Inc. Process chamber having improved gas distributor and method of manufacture
US6273958B2 (en) 1999-06-09 2001-08-14 Applied Materials, Inc. Substrate support for plasma processing
US6500299B1 (en) 1999-07-22 2002-12-31 Applied Materials Inc. Chamber having improved gas feed-through and method
US6478924B1 (en) 2000-03-07 2002-11-12 Applied Materials, Inc. Plasma chamber support having dual electrodes
US6598559B1 (en) 2000-03-24 2003-07-29 Applied Materials, Inc. Temperature controlled chamber
US6581275B2 (en) 2001-01-22 2003-06-24 Applied Materials Inc. Fabricating an electrostatic chuck having plasma resistant gas conduits
US6682627B2 (en) 2001-09-24 2004-01-27 Applied Materials, Inc. Process chamber having a corrosion-resistant wall and method
US6885043B2 (en) 2002-01-18 2005-04-26 Lightspeed Semiconductor Corporation ASIC routing architecture
US7910218B2 (en) 2003-10-22 2011-03-22 Applied Materials, Inc. Cleaning and refurbishing chamber components having metal coatings
JP2008026338A (ja) * 2004-10-29 2008-02-07 Shin-Etsu Engineering Co Ltd 真空貼り合わせ装置用静電チャック及びそれを用いた真空貼り合わせ装置
US7670436B2 (en) 2004-11-03 2010-03-02 Applied Materials, Inc. Support ring assembly
US8617672B2 (en) 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
US7762114B2 (en) 2005-09-09 2010-07-27 Applied Materials, Inc. Flow-formed chamber component having a textured surface
US9127362B2 (en) 2005-10-31 2015-09-08 Applied Materials, Inc. Process kit and target for substrate processing chamber
US8790499B2 (en) 2005-11-25 2014-07-29 Applied Materials, Inc. Process kit components for titanium sputtering chamber
US7981262B2 (en) 2007-01-29 2011-07-19 Applied Materials, Inc. Process kit for substrate processing chamber
US7942969B2 (en) 2007-05-30 2011-05-17 Applied Materials, Inc. Substrate cleaning chamber and components
JP5611718B2 (ja) * 2009-08-27 2014-10-22 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 薄膜蒸着装置及びこれを利用した有機発光表示装置の製造方法
JP6122856B2 (ja) 2011-10-06 2017-04-26 エーエスエムエル ネザーランズ ビー．ブイ． チャック、リソグラフィ装置及びチャックを使用する方法
US8902561B2 (en) * 2012-02-02 2014-12-02 Taiwan Semiconductor Manufacturing Co., Ltd. Electrostatic chuck with multi-zone control
JP6648236B2 (ja) * 2018-10-19 2020-02-14 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
CN112103163B (zh) * 2019-06-17 2022-06-17 北京北方华创微电子装备有限公司 下电极装置及相关等离子体系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1443215A (en) * 1973-11-07 1976-07-21 Mullard Ltd Electrostatically clamping a semiconductor wafer during device manufacture
IL56224A (en) * 1978-01-16 1982-08-31 Veeco Instr Inc Substrate clamp for use in semiconductor fabrication
JPS6131636U (ja) * 1984-07-31 1986-02-26 株式会社 徳田製作所 静電チヤツク
US4671204A (en) * 1986-05-16 1987-06-09 Varian Associates, Inc. Low compliance seal for gas-enhanced wafer cooling in vacuum

Also Published As

Publication number Publication date
DE69103915T2 (de) 1995-05-11
EP0439000A1 (de) 1991-07-31
EP0439000B1 (de) 1994-09-14
JPH07211767A (ja) 1995-08-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee