DE69032988D1 - Ausrichtungssystem - Google Patents

Ausrichtungssystem

Info

Publication number
DE69032988D1
DE69032988D1 DE69032988T DE69032988T DE69032988D1 DE 69032988 D1 DE69032988 D1 DE 69032988D1 DE 69032988 T DE69032988 T DE 69032988T DE 69032988 T DE69032988 T DE 69032988T DE 69032988 D1 DE69032988 D1 DE 69032988D1
Authority
DE
Germany
Prior art keywords
alignment system
alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032988T
Other languages
English (en)
Other versions
DE69032988T2 (de
Inventor
Hiroshi Kurosawa
Koji Uda
Kunitaka Ozawa
Shunichi Uzawa
Ryuichi Ebinuma
Takao Kariya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69032988D1 publication Critical patent/DE69032988D1/de
Publication of DE69032988T2 publication Critical patent/DE69032988T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69032988T 1989-08-30 1990-08-29 Ausrichtungssystem Expired - Fee Related DE69032988T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22154089A JP2777915B2 (ja) 1989-08-30 1989-08-30 位置合わせ機構

Publications (2)

Publication Number Publication Date
DE69032988D1 true DE69032988D1 (de) 1999-04-15
DE69032988T2 DE69032988T2 (de) 1999-08-19

Family

ID=16768322

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032988T Expired - Fee Related DE69032988T2 (de) 1989-08-30 1990-08-29 Ausrichtungssystem

Country Status (4)

Country Link
US (1) US5112133A (de)
EP (1) EP0415724B1 (de)
JP (1) JP2777915B2 (de)
DE (1) DE69032988T2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5621813A (en) * 1993-01-14 1997-04-15 Ultratech Stepper, Inc. Pattern recognition alignment system
JP3002351B2 (ja) * 1993-02-25 2000-01-24 キヤノン株式会社 位置合わせ方法および装置
KR0139039B1 (ko) * 1993-06-30 1998-06-01 미타라이 하지메 노광장치와 이것을 이용한 디바이스 제조방법
JPH0737786A (ja) * 1993-07-21 1995-02-07 Canon Inc ステージ位置決め制御方法
US5593800A (en) * 1994-01-06 1997-01-14 Canon Kabushiki Kaisha Mask manufacturing method and apparatus and device manufacturing method using a mask manufactured by the method or apparatus
JPH07321024A (ja) * 1994-05-25 1995-12-08 Canon Inc 位置決め方法およびその装置ならびにこれらを用いた露光装置
EP1091256A1 (de) * 1994-11-29 2001-04-11 Canon Kabushiki Kaisha Ausrichtungsverfahren und Halbleiterbelichtungsverfahren
JP3261948B2 (ja) * 1995-03-28 2002-03-04 キヤノン株式会社 Ｘ線露光用マスク及びそれを用いた半導体素子の製造方法
JP3391940B2 (ja) * 1995-06-26 2003-03-31 キヤノン株式会社 照明装置及び露光装置
JP3320262B2 (ja) * 1995-07-07 2002-09-03 キヤノン株式会社 走査露光装置及び方法並びにそれを用いたデバイス製造方法
US5751404A (en) * 1995-07-24 1998-05-12 Canon Kabushiki Kaisha Exposure apparatus and method wherein alignment is carried out by comparing marks which are incident on both reticle stage and wafer stage reference plates
JP3894509B2 (ja) * 1995-08-07 2007-03-22 キヤノン株式会社 光学装置、露光装置およびデバイス製造方法
JPH09129550A (ja) 1995-08-30 1997-05-16 Canon Inc 露光装置及びそれを用いたデバイスの製造方法
JP3815750B2 (ja) * 1995-10-09 2006-08-30 キヤノン株式会社 ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法
JP3634487B2 (ja) * 1996-02-09 2005-03-30 キヤノン株式会社 位置合せ方法、位置合せ装置、および露光装置
TW341719B (en) * 1996-03-01 1998-10-01 Canon Kk Surface position detecting method and scanning exposure method using the same
US5930324A (en) * 1996-04-03 1999-07-27 Canon Kabushiki Kaisha Exposure apparatus and device manufacturing method using the same
JP3337921B2 (ja) 1996-08-23 2002-10-28 キヤノン株式会社 投影露光装置および位置合せ方法
US5917580A (en) * 1996-08-29 1999-06-29 Canon Kabushiki Kaisha Scan exposure method and apparatus
JP3377165B2 (ja) * 1997-05-19 2003-02-17 キヤノン株式会社 半導体露光装置
JPH11260701A (ja) * 1998-03-13 1999-09-24 Tokyo Inst Of Technol 電子ビーム露光の位置合わせマーク
JP4585649B2 (ja) * 2000-05-19 2010-11-24 キヤノン株式会社 露光装置およびデバイス製造方法
JP3907497B2 (ja) * 2002-03-01 2007-04-18 キヤノン株式会社 位置決め装置及びその制御方法、並びに露光装置、並びにその制御方法により制御される露光装置により半導体デバイスを製造する製造方法
JP3833148B2 (ja) * 2002-06-25 2006-10-11 キヤノン株式会社 位置決め装置及びその制御方法、露光装置、デバイスの製造方法、半導体製造工場、露光装置の保守方法
JP2005129674A (ja) * 2003-10-23 2005-05-19 Canon Inc 走査露光装置およびデバイス製造方法
US8372126B2 (en) * 2006-04-21 2013-02-12 Warsaw Orthopedic, Inc. Surgical fasteners with mechanical and osteogenic fixation means
US20080221688A1 (en) * 2007-03-09 2008-09-11 Warsaw Orthopedic, Inc. Method of Maintaining Fatigue Performance In A Bone-Engaging Implant
US20080221681A1 (en) * 2007-03-09 2008-09-11 Warsaw Orthopedic, Inc. Methods for Improving Fatigue Performance of Implants With Osteointegrating Coatings

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH079877B2 (ja) * 1986-07-11 1995-02-01 株式会社ニコン アライメント装置
JP2631485B2 (ja) * 1988-01-28 1997-07-16 キヤノン株式会社 位置決め装置

Also Published As

Publication number Publication date
DE69032988T2 (de) 1999-08-19
EP0415724A3 (en) 1991-07-24
JP2777915B2 (ja) 1998-07-23
EP0415724B1 (de) 1999-03-10
JPH0385718A (ja) 1991-04-10
US5112133A (en) 1992-05-12
EP0415724A2 (de) 1991-03-06

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee