DE69032691D1 - Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck - Google Patents

Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck

Info

Publication number
DE69032691D1
DE69032691D1 DE69032691T DE69032691T DE69032691D1 DE 69032691 D1 DE69032691 D1 DE 69032691D1 DE 69032691 T DE69032691 T DE 69032691T DE 69032691 T DE69032691 T DE 69032691T DE 69032691 D1 DE69032691 D1 DE 69032691D1
Authority
DE
Germany
Prior art keywords
atmospheric pressure
plasma treatment
under atmospheric
treatment under
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69032691T
Other languages
English (en)
Other versions
DE69032691T2 (de
Inventor
Yasuhiro Horiike
Satiko Okazaki
Masuhiro Kogoma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Research Development Corp of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Development Corp of Japan filed Critical Research Development Corp of Japan
Application granted granted Critical
Publication of DE69032691D1 publication Critical patent/DE69032691D1/de
Publication of DE69032691T2 publication Critical patent/DE69032691T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018—Glow discharge

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • ing And Chemical Polishing (AREA)
DE69032691T 1989-12-07 1990-12-07 Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck Expired - Fee Related DE69032691T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31826089 1989-12-07

Publications (2)

Publication Number Publication Date
DE69032691D1 true DE69032691D1 (de) 1998-11-12
DE69032691T2 DE69032691T2 (de) 1999-06-10

Family

ID=18097219

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69032691T Expired - Fee Related DE69032691T2 (de) 1989-12-07 1990-12-07 Verfahren und Gerät zur Plasmabehandlung unter atmosphärischem Druck

Country Status (3)

Country Link
US (1) US5185132A (de)
EP (1) EP0431951B1 (de)
DE (1) DE69032691T2 (de)

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US7264850B1 (en) 1992-12-28 2007-09-04 Semiconductor Energy Laboratory Co., Ltd. Process for treating a substrate with a plasma
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US6429400B1 (en) 1997-12-03 2002-08-06 Matsushita Electric Works Ltd. Plasma processing apparatus and method
US6074514A (en) * 1998-02-09 2000-06-13 Applied Materials, Inc. High selectivity etch using an external plasma discharge
DE69929271T2 (de) * 1998-10-26 2006-09-21 Matsushita Electric Works, Ltd., Kadoma Apparat und Verfahren zur Plasmabehandlung
EP1198610A4 (de) * 1999-05-14 2004-04-07 Univ California Plasmastromerzeugungsvorrichtung mit weitem druckbereich bei niedrigen temperaturen
US7091605B2 (en) 2001-09-21 2006-08-15 Eastman Kodak Company Highly moisture-sensitive electronic device element and method for fabrication
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US20040050685A1 (en) * 2000-11-14 2004-03-18 Takuya Yara Method and device for atmospheric plasma processing
US6841006B2 (en) * 2001-08-23 2005-01-11 Applied Materials, Inc. Atmospheric substrate processing apparatus for depositing multiple layers on a substrate
US6764658B2 (en) * 2002-01-08 2004-07-20 Wisconsin Alumni Research Foundation Plasma generator
US7056416B2 (en) * 2002-02-15 2006-06-06 Matsushita Electric Industrial Co., Ltd. Atmospheric pressure plasma processing method and apparatus
US20030168009A1 (en) * 2002-03-08 2003-09-11 Denes Ferencz S. Plasma processing within low-dimension cavities
TW200308187A (en) * 2002-04-10 2003-12-16 Dow Corning Ireland Ltd An atmospheric pressure plasma assembly
GB0208259D0 (en) * 2002-04-10 2002-05-22 Dow Corning An atmospheric pressure plasma assembly
GB0208261D0 (en) * 2002-04-10 2002-05-22 Dow Corning An atmospheric pressure plasma assembly
TW200409669A (en) * 2002-04-10 2004-06-16 Dow Corning Ireland Ltd Protective coating composition
GB0211354D0 (en) 2002-05-17 2002-06-26 Surface Innovations Ltd Atomisation of a precursor into an excitation medium for coating a remote substrate
GB0212848D0 (en) 2002-06-01 2002-07-17 Surface Innovations Ltd Introduction of liquid/solid slurry into an exciting medium
GB0217553D0 (en) * 2002-07-30 2002-09-11 Sheel David W Titania coatings by CVD at atmospheric pressure
CA2465879C (en) * 2002-08-30 2008-10-07 Sekisui Chemical Co., Ltd. Plasma processing apparatus
CA2471987C (en) * 2002-10-07 2008-09-02 Sekisui Chemical Co., Ltd. Plasma surface processing apparatus
EP1578524A4 (de) * 2002-12-13 2007-03-28 Blue Planet Co Ltd Plasmareaktor und elektrodenplatte dafür
ATE451823T1 (de) * 2003-01-31 2009-12-15 Dow Corning Ireland Ltd Plasmaerzeugungselektrodenbaugruppe
US20040175498A1 (en) * 2003-03-06 2004-09-09 Lotfi Hedhli Method for preparing membrane electrode assemblies
US7824520B2 (en) 2003-03-26 2010-11-02 Semiconductor Energy Laboratory Co., Ltd. Plasma treatment apparatus
WO2004107394A2 (ja) * 2003-05-27 2004-12-09 Matsushita Electric Works, Ltd. プラズマ処理装置、プラズマ生成用の反応器の製造方法、及びプラズマ処理方法
KR20060063900A (ko) * 2003-07-23 2006-06-12 세키스이가가쿠 고교가부시키가이샤 플라즈마 처리 장치 및 그 전극 구조
GB0323295D0 (en) * 2003-10-04 2003-11-05 Dow Corning Deposition of thin films
US20060040067A1 (en) * 2004-08-23 2006-02-23 Thomas Culp Discharge-enhanced atmospheric pressure chemical vapor deposition
WO2006048650A1 (en) * 2004-11-05 2006-05-11 Dow Corning Ireland Limited Plasma system
GB0509648D0 (en) * 2005-05-12 2005-06-15 Dow Corning Ireland Ltd Plasma system to deposit adhesion primer layers
US7691278B2 (en) * 2005-09-27 2010-04-06 Lam Research Corporation Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor
CA2624565C (en) 2005-09-30 2014-07-22 Airbus Espana, S.L. Method of surface treatment of composite material structures with atmospheric plasma beams
JP2008205209A (ja) * 2007-02-20 2008-09-04 Matsushita Electric Works Ltd プラズマ処理装置
US20090045168A1 (en) * 2007-08-17 2009-02-19 Jacob Hanson Surface Treater for Elongated Articles
TW200927983A (en) * 2007-12-21 2009-07-01 Ind Tech Res Inst Atmospheric pressure plasma processing apparatus
EP2316252B1 (de) 2008-08-04 2018-10-31 AGC Flat Glass North America, Inc. Plasmaquelle und verfahren zum auftragen von dünnfilmbeschichtungen mittels plasmaunterstützter chemischer gasphasenabscheidung und verfahren dazu
WO2012173229A1 (ja) * 2011-06-16 2012-12-20 京セラ株式会社 プラズマ発生体及びプラズマ発生装置
US8741393B2 (en) 2011-12-28 2014-06-03 E I Du Pont De Nemours And Company Method for producing metalized fibrous composite sheet with olefin coating
US11149370B2 (en) * 2012-09-19 2021-10-19 Apjet, Inc. Atmospheric-pressure plasma processing apparatus and method
CN107615888B (zh) 2014-12-05 2022-01-04 北美Agc平板玻璃公司 利用宏粒子减少涂层的等离子体源和将等离子体源用于沉积薄膜涂层和表面改性的方法
US10586685B2 (en) 2014-12-05 2020-03-10 Agc Glass Europe Hollow cathode plasma source
US9721764B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Method of producing plasma by multiple-phase alternating or pulsed electrical current
US9721765B2 (en) 2015-11-16 2017-08-01 Agc Flat Glass North America, Inc. Plasma device driven by multiple-phase alternating or pulsed electrical current
US10573499B2 (en) 2015-12-18 2020-02-25 Agc Flat Glass North America, Inc. Method of extracting and accelerating ions
US10242846B2 (en) 2015-12-18 2019-03-26 Agc Flat Glass North America, Inc. Hollow cathode ion source

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GB1500701A (en) * 1974-01-24 1978-02-08 Atomic Energy Authority Uk Vapour deposition apparatus
US3959104A (en) * 1974-09-30 1976-05-25 Surface Activation Corporation Electrode structure for generating electrical discharge plasma
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JPH0622222B2 (ja) * 1984-09-18 1994-03-23 株式会社東芝 光処理装置
US4554047A (en) * 1984-10-12 1985-11-19 At&T Bell Laboratories Downstream apparatus and technique
DE3521318A1 (de) * 1985-06-14 1986-12-18 Leybold-Heraeus GmbH, 5000 Köln Verfahren und vorrichtung zum behandeln, insbesondere zum beschichten, von substraten mittels einer plasmaentladung
DE68922244T2 (de) * 1988-06-06 1995-09-14 Japan Res Dev Corp Verfahren zur Durchführung einer Plasmareaktion bei Atmosphärendruck.
US4992299A (en) * 1990-02-01 1991-02-12 Air Products And Chemicals, Inc. Deposition of silicon nitride films from azidosilane sources

Also Published As

Publication number Publication date
US5185132A (en) 1993-02-09
DE69032691T2 (de) 1999-06-10
EP0431951A3 (en) 1991-11-06
EP0431951A2 (de) 1991-06-12
EP0431951B1 (de) 1998-10-07

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: JAPAN SCIENCE AND TECHNOLOGY CORP., KAWAGUCHI, SAI

8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee