DE69030288T2 - Anordnung mit einem Stapel elektronischer Submontagen - Google Patents

Anordnung mit einem Stapel elektronischer Submontagen

Info

Publication number
DE69030288T2
DE69030288T2 DE69030288T DE69030288T DE69030288T2 DE 69030288 T2 DE69030288 T2 DE 69030288T2 DE 69030288 T DE69030288 T DE 69030288T DE 69030288 T DE69030288 T DE 69030288T DE 69030288 T2 DE69030288 T2 DE 69030288T2
Authority
DE
Germany
Prior art keywords
stack
arrangement
electronic subassemblies
subassemblies
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69030288T
Other languages
English (en)
Other versions
DE69030288D1 (de
Inventor
Yung-Cheng Lee
John Maurice Segelken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69030288D1 publication Critical patent/DE69030288D1/de
Publication of DE69030288T2 publication Critical patent/DE69030288T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE69030288T 1989-07-28 1990-07-18 Anordnung mit einem Stapel elektronischer Submontagen Expired - Fee Related DE69030288T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38748089A 1989-07-28 1989-07-28
US07/519,728 US5049982A (en) 1989-07-28 1990-05-10 Article comprising a stacked array of electronic subassemblies

Publications (2)

Publication Number Publication Date
DE69030288D1 DE69030288D1 (de) 1997-04-30
DE69030288T2 true DE69030288T2 (de) 1997-09-25

Family

ID=27011889

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69030288T Expired - Fee Related DE69030288T2 (de) 1989-07-28 1990-07-18 Anordnung mit einem Stapel elektronischer Submontagen

Country Status (4)

Country Link
US (1) US5049982A (de)
EP (1) EP0410631B1 (de)
JP (1) JPH0671057B2 (de)
DE (1) DE69030288T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10243026B3 (de) * 2002-09-13 2004-06-03 Oliver Laing Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes

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US5343447A (en) * 1990-05-23 1994-08-30 Olympus Optical Co., Ltd. Self-cooling optomagnetic disk device with locking internal mechanism
US5241456A (en) * 1990-07-02 1993-08-31 General Electric Company Compact high density interconnect structure
US5590345A (en) * 1990-11-13 1996-12-31 International Business Machines Corporation Advanced parallel array processor(APAP)
US5809292A (en) * 1990-11-13 1998-09-15 International Business Machines Corporation Floating point for simid array machine
US5794059A (en) * 1990-11-13 1998-08-11 International Business Machines Corporation N-dimensional modified hypercube
US5963746A (en) * 1990-11-13 1999-10-05 International Business Machines Corporation Fully distributed processing memory element
US5765011A (en) * 1990-11-13 1998-06-09 International Business Machines Corporation Parallel processing system having a synchronous SIMD processing with processing elements emulating SIMD operation using individual instruction streams
US5625836A (en) * 1990-11-13 1997-04-29 International Business Machines Corporation SIMD/MIMD processing memory element (PME)
US5966528A (en) * 1990-11-13 1999-10-12 International Business Machines Corporation SIMD/MIMD array processor with vector processing
US5630162A (en) * 1990-11-13 1997-05-13 International Business Machines Corporation Array processor dotted communication network based on H-DOTs
US5765015A (en) * 1990-11-13 1998-06-09 International Business Machines Corporation Slide network for an array processor
US5815723A (en) * 1990-11-13 1998-09-29 International Business Machines Corporation Picket autonomy on a SIMD machine
US5828894A (en) * 1990-11-13 1998-10-27 International Business Machines Corporation Array processor having grouping of SIMD pickets
US5963745A (en) * 1990-11-13 1999-10-05 International Business Machines Corporation APAP I/O programmable router
US5765012A (en) * 1990-11-13 1998-06-09 International Business Machines Corporation Controller for a SIMD/MIMD array having an instruction sequencer utilizing a canned routine library
US5734921A (en) * 1990-11-13 1998-03-31 International Business Machines Corporation Advanced parallel array processor computer package
US5588152A (en) * 1990-11-13 1996-12-24 International Business Machines Corporation Advanced parallel processor including advanced support hardware
EP0485690B1 (de) * 1990-11-13 1999-05-26 International Business Machines Corporation Paralleles Assoziativprozessor-System
US5617577A (en) * 1990-11-13 1997-04-01 International Business Machines Corporation Advanced parallel array processor I/O connection
US5713037A (en) * 1990-11-13 1998-01-27 International Business Machines Corporation Slide bus communication functions for SIMD/MIMD array processor
US5304845A (en) * 1991-04-09 1994-04-19 Digital Equipment Corporation Apparatus for an air impingement heat sink using secondary flow generators
US5594918A (en) * 1991-05-13 1997-01-14 International Business Machines Corporation Parallel computer system providing multi-ported intelligent memory
US5168348A (en) * 1991-07-15 1992-12-01 International Business Machines Corporation Impingment cooled compliant heat sink
US5200631A (en) * 1991-08-06 1993-04-06 International Business Machines Corporation High speed optical interconnect
DE69218913T2 (de) * 1992-01-31 1997-07-17 Cit Alcatel Verfahren zur Bestimmung der Laufzeit zwischen einer entfernten Endstation und einer zentralen Endstation, in einem bidirektionalen Punkt-zu-Mehrpunkt-Übertragungssystem
US5208729A (en) * 1992-02-14 1993-05-04 International Business Machines Corporation Multi-chip module
JP2642039B2 (ja) * 1992-05-22 1997-08-20 インターナショナル・ビジネス・マシーンズ・コーポレイション アレイ・プロセッサ
WO1993024955A1 (de) * 1992-05-25 1993-12-09 Mannesmann Ag Fluidgekühlte leistungstransistoranordnung
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
DE69330450T2 (de) * 1992-08-05 2001-11-08 Fujitsu Ltd Dreidimensionaler Multichipmodul
US5334029A (en) * 1993-05-11 1994-08-02 At&T Bell Laboratories High density connector for stacked circuit boards
US5847927A (en) * 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
US6110306A (en) * 1999-11-18 2000-08-29 The United States Of America As Represented By The Secretary Of The Navy Complexed liquid fuel compositions
US7024046B2 (en) * 2000-04-18 2006-04-04 Real Time Image Ltd. System and method for the lossless progressive streaming of images over a communication network
US6977346B2 (en) * 2002-06-10 2005-12-20 Visteon Global Technologies, Inc. Vented circuit board for cooling power components
US20040115995A1 (en) * 2002-11-25 2004-06-17 Sanders Samuel Sidney Circuit array module
US20040160742A1 (en) * 2003-02-14 2004-08-19 Weiss Roger E. Three-dimensional electrical device packaging employing low profile elastomeric interconnection
US20070089902A1 (en) * 2005-10-25 2007-04-26 Tourne Joseph A Circuit board having a multi-signal via
JP4885529B2 (ja) * 2005-12-08 2012-02-29 住友重機械工業株式会社 放射線検出ユニットおよび放射線検査装置
US7432702B2 (en) * 2005-12-22 2008-10-07 Honeywell International Inc. Circuit board damping assembly
US20090226696A1 (en) * 2008-02-06 2009-09-10 World Properties, Inc. Conductive Polymer Foams, Method of Manufacture, And Uses Thereof
JP2010518227A (ja) * 2007-02-06 2010-05-27 ワールド プラパティーズ、 インコーポレイテッド 導電性ポリマー発泡体、その作製方法、およびその使用
US8623265B2 (en) * 2007-02-06 2014-01-07 World Properties, Inc. Conductive polymer foams, method of manufacture, and articles thereof
CN102686652A (zh) * 2009-12-29 2012-09-19 罗杰斯公司 导电聚合物泡沫、其制造方法及其用途
JP5758584B2 (ja) * 2010-03-18 2015-08-05 本田技研工業株式会社 ジャンクションボックス

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US3727114A (en) * 1971-08-03 1973-04-10 Mitsubishi Electric Corp Air cooled semiconductor stack
US4536824A (en) * 1983-03-28 1985-08-20 Goodyear Aerospace Corporation Indirect cooling of electronic circuits
JPS60234762A (ja) * 1984-05-03 1985-11-21 Toyoda Autom Loom Works Ltd 強化繊維成形体の製造方法とその装置
US4839774A (en) * 1988-01-25 1989-06-13 Digital Equipment Corporation Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
US4841355A (en) * 1988-02-10 1989-06-20 Amdahl Corporation Three-dimensional microelectronic package for semiconductor chips

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10243026B3 (de) * 2002-09-13 2004-06-03 Oliver Laing Vorrichtung zur lokalen Kühlung oder Erwärmung eines Gegenstandes
US7648347B2 (en) 2002-09-13 2010-01-19 Itt Manfacturing Enterprises, Inc. Device for the local cooling or heating of an object

Also Published As

Publication number Publication date
US5049982A (en) 1991-09-17
EP0410631A3 (en) 1992-03-18
EP0410631B1 (de) 1997-03-26
JPH03124053A (ja) 1991-05-27
JPH0671057B2 (ja) 1994-09-07
EP0410631A2 (de) 1991-01-30
DE69030288D1 (de) 1997-04-30

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8339 Ceased/non-payment of the annual fee