DE69029586T2 - Photolackentferner - Google Patents

Photolackentferner

Info

Publication number
DE69029586T2
DE69029586T2 DE69029586T DE69029586T DE69029586T2 DE 69029586 T2 DE69029586 T2 DE 69029586T2 DE 69029586 T DE69029586 T DE 69029586T DE 69029586 T DE69029586 T DE 69029586T DE 69029586 T2 DE69029586 T2 DE 69029586T2
Authority
DE
Germany
Prior art keywords
paint remover
photo paint
photo
remover
paint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69029586T
Other languages
English (en)
Other versions
DE69029586D1 (de
Inventor
Alicia Dean
John Fitzsimmons
Janos Havas
Barry Mccormick
Probodh Shah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69029586D1 publication Critical patent/DE69029586D1/de
Publication of DE69029586T2 publication Critical patent/DE69029586T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69029586T 1990-05-01 1990-10-15 Photolackentferner Expired - Lifetime DE69029586T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/517,105 US5091103A (en) 1990-05-01 1990-05-01 Photoresist stripper
PCT/US1990/005898 WO1991017484A1 (en) 1990-05-01 1990-10-15 Photoresist stripper

Publications (2)

Publication Number Publication Date
DE69029586D1 DE69029586D1 (de) 1997-02-13
DE69029586T2 true DE69029586T2 (de) 1997-07-17

Family

ID=24058389

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69029586T Expired - Lifetime DE69029586T2 (de) 1990-05-01 1990-10-15 Photolackentferner

Country Status (5)

Country Link
US (1) US5091103A (de)
EP (1) EP0531292B1 (de)
JP (1) JP2502815B2 (de)
DE (1) DE69029586T2 (de)
WO (1) WO1991017484A1 (de)

Families Citing this family (63)

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US20040018949A1 (en) * 1990-11-05 2004-01-29 Wai Mun Lee Semiconductor process residue removal composition and process
US6000411A (en) * 1990-11-05 1999-12-14 Ekc Technology, Inc. Cleaning compositions for removing etching residue and method of using
US6110881A (en) * 1990-11-05 2000-08-29 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
US7205265B2 (en) 1990-11-05 2007-04-17 Ekc Technology, Inc. Cleaning compositions and methods of use thereof
US6121217A (en) 1990-11-05 2000-09-19 Ekc Technology, Inc. Alkanolamine semiconductor process residue removal composition and process
US6242400B1 (en) 1990-11-05 2001-06-05 Ekc Technology, Inc. Method of stripping resists from substrates using hydroxylamine and alkanolamine
US5556482A (en) * 1991-01-25 1996-09-17 Ashland, Inc. Method of stripping photoresist with composition containing inhibitor
US5240878A (en) * 1991-04-26 1993-08-31 International Business Machines Corporation Method for forming patterned films on a substrate
DK169079B1 (da) * 1991-11-12 1994-08-08 Ebbe Damgaard Larsen I det væsentlige vandfrit middel til aflakering af emner af let korroderbare materialer, hvilket middel indeholder N-methyl-pyrrolidon, kaliumhydroxyd og en alkohol med 2-3 karbonatomer samt fremgangsmåde til dets fremstilling og anvendelse af dette
DE4303923A1 (de) * 1993-02-10 1994-08-11 Microparts Gmbh Verfahren zum Beseitigen von Kunststoffen aus Mikrostrukturen
US7144849B2 (en) * 1993-06-21 2006-12-05 Ekc Technology, Inc. Cleaning solutions including nucleophilic amine compound having reduction and oxidation potentials
US5670376A (en) * 1994-12-14 1997-09-23 Lucent Technologies Inc. Methodology for monitoring solvent quality
US5597420A (en) * 1995-01-17 1997-01-28 Ashland Inc. Stripping composition having monoethanolamine
US5563119A (en) * 1995-01-26 1996-10-08 Ashland Inc. Stripping compositions containing alkanolamine compounds
JP3614242B2 (ja) * 1996-04-12 2005-01-26 三菱瓦斯化学株式会社 フォトレジスト剥離剤及び半導体集積回路の製造方法
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
US6030932A (en) * 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US6224785B1 (en) 1997-08-29 2001-05-01 Advanced Technology Materials, Inc. Aqueous ammonium fluoride and amine containing compositions for cleaning inorganic residues on semiconductor substrates
US6896826B2 (en) 1997-01-09 2005-05-24 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US6755989B2 (en) 1997-01-09 2004-06-29 Advanced Technology Materials, Inc. Aqueous cleaning composition containing copper-specific corrosion inhibitor for cleaning inorganic residues on semiconductor substrate
US5904156A (en) * 1997-09-24 1999-05-18 International Business Machines Corporation Dry film resist removal in the presence of electroplated C4's
TW386256B (en) * 1997-12-24 2000-04-01 United Microelectronics Corp Method for removing photoresistor
US6057240A (en) * 1998-04-06 2000-05-02 Chartered Semiconductor Manufacturing, Ltd. Aqueous surfactant solution method for stripping metal plasma etch deposited oxidized metal impregnated polymer residue layers from patterned metal layers
EP1070157A4 (de) * 1998-04-06 2003-02-12 Arch Spec Chem Inc Verfahren zum entfernen von photoresist- und plasmaätzrückständen
US6280527B1 (en) 1998-06-12 2001-08-28 International Business Machines Corporation Aqueous quaternary ammonium hydroxide as a screening mask cleaner
US6319884B2 (en) 1998-06-16 2001-11-20 International Business Machines Corporation Method for removal of cured polyimide and other polymers
US7579308B2 (en) * 1998-07-06 2009-08-25 Ekc/Dupont Electronics Technologies Compositions and processes for photoresist stripping and residue removal in wafer level packaging
US6103680A (en) * 1998-12-31 2000-08-15 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition and method for removing photoresist and/or plasma etching residues
US6514355B1 (en) * 1999-02-08 2003-02-04 International Business Machines Corporation Method and apparatus for recovery of semiconductor wafers from a chemical tank
US6348100B1 (en) * 1999-07-01 2002-02-19 International Business Machines Corporation Resist bowl cleaning
US6217667B1 (en) * 1999-09-24 2001-04-17 Semitool, Inc. Method for cleaning copper surfaces
US6413923B2 (en) * 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6194366B1 (en) 1999-11-16 2001-02-27 Esc, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
US6723691B2 (en) 1999-11-16 2004-04-20 Advanced Technology Materials, Inc. Post chemical-mechanical planarization (CMP) cleaning composition
JP2002016034A (ja) * 2000-06-30 2002-01-18 Mitsubishi Electric Corp 半導体装置の製造方法、及び半導体装置
JP4501248B2 (ja) * 2000-07-24 2010-07-14 東ソー株式会社 レジスト剥離剤
JP4501256B2 (ja) * 2000-08-22 2010-07-14 東ソー株式会社 レジスト剥離剤
US6617674B2 (en) * 2001-02-20 2003-09-09 Dow Corning Corporation Semiconductor package and method of preparing same
MY143399A (en) * 2001-07-09 2011-05-13 Avantor Performance Mat Inc Microelectronic cleaning compositons containing ammonia-free fluoride salts for selective photoresist stripping and plasma ash residue cleaning
MY139607A (en) * 2001-07-09 2009-10-30 Avantor Performance Mat Inc Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
MY131912A (en) * 2001-07-09 2007-09-28 Avantor Performance Mat Inc Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
US6551973B1 (en) 2001-10-09 2003-04-22 General Chemical Corporation Stable metal-safe stripper for removing cured negative-tone novolak and acrylic photoresists and post-etch residue
US7543592B2 (en) * 2001-12-04 2009-06-09 Ekc Technology, Inc. Compositions and processes for photoresist stripping and residue removal in wafer level packaging
AU2003225178A1 (en) * 2002-04-24 2003-11-10 Ekc Technology, Inc. Oxalic acid as a cleaning product for aluminium, copper and dielectric surfaces
US7393819B2 (en) * 2002-07-08 2008-07-01 Mallinckrodt Baker, Inc. Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility
US20040094507A1 (en) * 2002-11-14 2004-05-20 Goodner Michael D. Stripping cross-linked photoresists
EP1692572A2 (de) 2003-10-29 2006-08-23 Mallinckrodt Baker, Inc. Alkali-, nach-plasmaätz-/aschenrestentfernungsmittel und fotoresist-entfernungszusammensetzungen mit metallhalogenid-korrosionsinhibitoren
KR20060064441A (ko) * 2004-12-08 2006-06-13 말린크로트 베이커, 인코포레이티드 비수성 비부식성 마이크로전자 세정 조성물
US8026201B2 (en) 2007-01-03 2011-09-27 Az Electronic Materials Usa Corp. Stripper for coating layer
US8475924B2 (en) * 2007-07-09 2013-07-02 E.I. Du Pont De Nemours And Company Compositions and methods for creating electronic circuitry
JP2009057518A (ja) * 2007-09-03 2009-03-19 Institute Of Physical & Chemical Research 異方性フィルムおよび異方性フィルムの製造方法
TWI450052B (zh) * 2008-06-24 2014-08-21 Dynaloy Llc 用於後段製程操作有效之剝離溶液
US8444768B2 (en) * 2009-03-27 2013-05-21 Eastman Chemical Company Compositions and methods for removing organic substances
US8309502B2 (en) * 2009-03-27 2012-11-13 Eastman Chemical Company Compositions and methods for removing organic substances
US8614053B2 (en) 2009-03-27 2013-12-24 Eastman Chemical Company Processess and compositions for removing substances from substrates
JP6165442B2 (ja) * 2009-07-30 2017-07-19 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 高度な半導体応用のためのポストイオン注入フォトレジスト剥離用組成物
US9029268B2 (en) 2012-11-21 2015-05-12 Dynaloy, Llc Process for etching metals
US20140227446A1 (en) * 2013-02-13 2014-08-14 Seiren Co., Ltd. Surface modifier for polyimide resin and surface-modifying method for polyimide resin
JP2017026645A (ja) * 2013-12-03 2017-02-02 Jsr株式会社 レジスト除去剤およびレジスト除去方法
JP6927619B2 (ja) * 2018-01-19 2021-09-01 エムティーアイ カンパニー, リミテッドMti Co., Ltd. ダイシング工程用保護コーティング剤剥離用剥離剤

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3673099A (en) * 1970-10-19 1972-06-27 Bell Telephone Labor Inc Process and composition for stripping cured resins from substrates
US4744834A (en) * 1986-04-30 1988-05-17 Noor Haq Photoresist stripper comprising a pyrrolidinone, a diethylene glycol ether, a polyglycol and a quaternary ammonium hydroxide
JPS62265665A (ja) * 1986-05-14 1987-11-18 Nitto Chem Ind Co Ltd フオトレジスト剥離剤
WO1988005813A1 (en) * 1987-02-05 1988-08-11 Macdermid, Incorporated Photoresist stripper composition
SE462975B (sv) * 1987-06-05 1990-09-24 Chemie Consult Scandinavia Ab Saett och rengoeringsmedel vid rengoering av foeremaal eller ytor med anvaendning av ett laettflytande, vaetskeformigt rengoeringsmedel innehaallande n-metyl-2-pyrrolidon genom neddoppning i ett bad innehaallande medlet

Also Published As

Publication number Publication date
EP0531292A1 (de) 1993-03-17
WO1991017484A1 (en) 1991-11-14
JPH05504204A (ja) 1993-07-01
JP2502815B2 (ja) 1996-05-29
DE69029586D1 (de) 1997-02-13
EP0531292B1 (de) 1997-01-02
US5091103A (en) 1992-02-25

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8328 Change in the person/name/address of the agent

Representative=s name: DUSCHER, R., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 7