DE69020442T2 - Verfahren zum Einbrennen in weniger als einer Minute. - Google Patents

Verfahren zum Einbrennen in weniger als einer Minute.

Info

Publication number
DE69020442T2
DE69020442T2 DE69020442T DE69020442T DE69020442T2 DE 69020442 T2 DE69020442 T2 DE 69020442T2 DE 69020442 T DE69020442 T DE 69020442T DE 69020442 T DE69020442 T DE 69020442T DE 69020442 T2 DE69020442 T2 DE 69020442T2
Authority
DE
Germany
Prior art keywords
burn
minute
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69020442T
Other languages
English (en)
Other versions
DE69020442D1 (de
Inventor
Timothy E Figal
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69020442D1 publication Critical patent/DE69020442D1/de
Application granted granted Critical
Publication of DE69020442T2 publication Critical patent/DE69020442T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
DE69020442T 1989-06-06 1990-05-29 Verfahren zum Einbrennen in weniger als einer Minute. Expired - Fee Related DE69020442T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/362,898 US5030905A (en) 1989-06-06 1989-06-06 Below a minute burn-in

Publications (2)

Publication Number Publication Date
DE69020442D1 DE69020442D1 (de) 1995-08-03
DE69020442T2 true DE69020442T2 (de) 1995-11-16

Family

ID=23427956

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69020442T Expired - Fee Related DE69020442T2 (de) 1989-06-06 1990-05-29 Verfahren zum Einbrennen in weniger als einer Minute.

Country Status (3)

Country Link
US (1) US5030905A (de)
EP (1) EP0407029B1 (de)
DE (1) DE69020442T2 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5646540A (en) * 1989-04-19 1997-07-08 Interuniversitair Micro-Elektronic Centrum Vzw Apparatus and method for measuring electromagnetic ageing parameter of a circuit element and predicting its values
US5391984A (en) * 1991-11-01 1995-02-21 Sgs-Thomson Microelectronics, Inc. Method and apparatus for testing integrated circuit devices
US5361032A (en) * 1992-01-27 1994-11-01 Motorola, Inc. Method of troubleshooting electronic circuit board assemblies using temperature isolation
EP0568294B1 (de) * 1992-04-27 1998-06-24 Fujitsu Limited Testverfahren für integrierte Halbleiter-Schaltung
US5381103A (en) * 1992-10-13 1995-01-10 Cree Research, Inc. System and method for accelerated degradation testing of semiconductor devices
US5677853A (en) * 1994-11-16 1997-10-14 Delco Electronics Corp. Product testing by statistical profile of test variables
US5583875A (en) * 1994-11-28 1996-12-10 Siemens Rolm Communications Inc. Automatic parametric self-testing and grading of a hardware system
US5570027A (en) * 1995-04-19 1996-10-29 Photocircuits Corporation Printed circuit board test apparatus and method
US5721496A (en) * 1996-01-23 1998-02-24 Micron Technology, Inc. Method and apparatus for leak checking unpackaged semiconductor dice
US5742169A (en) * 1996-02-20 1998-04-21 Micron Technology, Inc. Apparatus for testing interconnects for semiconductor dice
US5744975A (en) * 1996-06-06 1998-04-28 International Business Machines Corporation Enhanced defect elimination process for electronic assemblies via application of sequentially combined multiple stress processes
US5760595A (en) * 1996-09-19 1998-06-02 International Business Machines Corporation High temperature electromigration stress test system, test socket, and use thereof
US5954832A (en) * 1997-03-14 1999-09-21 International Business Machines Corporation Method and system for performing non-standard insitu burn-in testings
US6329831B1 (en) * 1997-08-08 2001-12-11 Advanced Micro Devices, Inc. Method and apparatus for reliability testing of integrated circuit structures and devices
US6122600A (en) * 1998-02-03 2000-09-19 Micron Electronics, Inc. Method device qualification
US6125336A (en) * 1998-02-03 2000-09-26 Micron Electronics, Inc. Apparatus for device qualification
US6326800B1 (en) * 1999-06-10 2001-12-04 International Business Machines Corporation Self-adjusting burn-in test
US7149673B1 (en) * 1999-09-09 2006-12-12 Cingular Wireless Ii, Llc Method for estimating changes in product life for a redesigned product
US6598182B1 (en) * 1999-09-29 2003-07-22 International Business Machines Corporation Electromigration and extrusion monitor and control system
US6445206B1 (en) * 2000-05-31 2002-09-03 Agere Systems Guardian Corp. Method and apparatus for determining yield impacting tests at wafer level package level for semiconductor devices
US6820029B2 (en) 2000-12-22 2004-11-16 United Microelectronics Corp. Method for determining failure rate and selecting best burn-in time
DE10115280C2 (de) * 2001-03-28 2003-12-24 Infineon Technologies Ag Verfahren zum Klassifizieren von Bauelementen
US6980016B2 (en) * 2001-07-02 2005-12-27 Intel Corporation Integrated circuit burn-in systems
US7120566B1 (en) 2001-07-06 2006-10-10 Cingular Wireless Ii, Llc Method for estimating changes in product life resulting from HALT using exponential acceleration model
US7260509B1 (en) * 2001-07-06 2007-08-21 Cingular Wireless Ii, Llc Method for estimating changes in product life resulting from HALT using quadratic acceleration model
US7112979B2 (en) 2002-10-23 2006-09-26 Intel Corporation Testing arrangement to distribute integrated circuits
US7265561B2 (en) * 2003-09-30 2007-09-04 International Business Machines Corporation Device burn in utilizing voltage control
US7127371B2 (en) * 2003-10-08 2006-10-24 Ge Medical Systems Information Customized medical equipment preventative maintenance method and system
US9152517B2 (en) 2011-04-21 2015-10-06 International Business Machines Corporation Programmable active thermal control
US10132860B2 (en) 2016-10-28 2018-11-20 Nxp Usa, Inc. Systems and methods for testing package assemblies

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3748579A (en) * 1971-11-12 1973-07-24 Bell Telephone Labor Inc Method for determining concentration profiles of deep levels on both sides of a p-n junction
US3943442A (en) * 1974-11-11 1976-03-09 Nasa Method and apparatus for measurement of trap density and energy distribution in dielectric films
DE3037192A1 (de) * 1980-10-02 1982-05-06 Licentia Gmbh Testverfahren fuer halbleiteranordnungen
US4420722A (en) * 1980-11-14 1983-12-13 Rca Corporation Testing semiconductor furnaces for heavy metal contamination
US4483629A (en) * 1983-01-05 1984-11-20 Syracuse University Dynamic testing of electrical conductors
USRE32625E (en) * 1983-01-05 1988-03-15 Syracuse University Dynamic testing of electrical conductors
JPS6168569A (ja) * 1984-09-10 1986-04-08 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 電子装置を鑑別するための最大温度の決定方法
US4739258A (en) * 1986-07-11 1988-04-19 Syracuse University Dynamic testing of thin-film conductor
IT1201837B (it) * 1986-07-22 1989-02-02 Sgs Microelettronica Spa Sistema per la verifica della funzionalita' e delle caratteristiche di dispositivi a semiconduttore di tipo eprom durante il "burn-in"
US4855672A (en) * 1987-05-18 1989-08-08 Shreeve Robert W Method and process for testing the reliability of integrated circuit (IC) chips and novel IC circuitry for accomplishing same

Also Published As

Publication number Publication date
DE69020442D1 (de) 1995-08-03
EP0407029A2 (de) 1991-01-09
US5030905A (en) 1991-07-09
EP0407029B1 (de) 1995-06-28
EP0407029A3 (en) 1991-09-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD CO. (N.D.GES.D.STAATES DELAWARE),

8327 Change in the person/name/address of the patent owner

Owner name: HEWLETT-PACKARD DEVELOPMENT CO., L.P., HOUSTON, TE

8339 Ceased/non-payment of the annual fee