DE69018580D1 - Zerstäubungsgerät. - Google Patents
Zerstäubungsgerät.Info
- Publication number
- DE69018580D1 DE69018580D1 DE69018580T DE69018580T DE69018580D1 DE 69018580 D1 DE69018580 D1 DE 69018580D1 DE 69018580 T DE69018580 T DE 69018580T DE 69018580 T DE69018580 T DE 69018580T DE 69018580 D1 DE69018580 D1 DE 69018580D1
- Authority
- DE
- Germany
- Prior art keywords
- atomizer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1316365A JP2934711B2 (ja) | 1989-12-07 | 1989-12-07 | スパッタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69018580D1 true DE69018580D1 (de) | 1995-05-18 |
DE69018580T2 DE69018580T2 (de) | 1995-08-10 |
Family
ID=18076287
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69018580T Expired - Fee Related DE69018580T2 (de) | 1989-12-07 | 1990-12-05 | Zerstäubungsgerät. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5514259A (de) |
EP (1) | EP0431592B1 (de) |
JP (1) | JP2934711B2 (de) |
DE (1) | DE69018580T2 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656146A (en) * | 1996-04-26 | 1997-08-12 | Phoenix Precision Graphics, Inc. | Single phase fluid gas extractor for electrophoretic purifier systems |
US5873983A (en) * | 1997-01-13 | 1999-02-23 | Vanguard International Semiconductor Corporation | Method for minimizing substrate to clamp sticking during thermal processing of thermally flowable layers |
DE19734633C2 (de) * | 1997-08-11 | 1999-08-26 | Forschungszentrum Juelich Gmbh | Hochdruck-Magnetron-Kathode |
US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6306265B1 (en) | 1999-02-12 | 2001-10-23 | Applied Materials, Inc. | High-density plasma for ionized metal deposition capable of exciting a plasma wave |
US6183614B1 (en) | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
US6290825B1 (en) * | 1999-02-12 | 2001-09-18 | Applied Materials, Inc. | High-density plasma source for ionized metal deposition |
US6495000B1 (en) * | 2001-07-16 | 2002-12-17 | Sharp Laboratories Of America, Inc. | System and method for DC sputtering oxide films with a finned anode |
US6776848B2 (en) * | 2002-01-17 | 2004-08-17 | Applied Materials, Inc. | Motorized chamber lid |
US20080308417A1 (en) * | 2005-03-14 | 2008-12-18 | Toyoaki Hirata | Sputtering Apparatus |
US20070235320A1 (en) * | 2006-04-06 | 2007-10-11 | Applied Materials, Inc. | Reactive sputtering chamber with gas distribution tubes |
JP5222281B2 (ja) * | 2006-04-06 | 2013-06-26 | アプライド マテリアルズ インコーポレイテッド | ラージエリア基板への酸化亜鉛透明導電性酸化物の反応性スパッタリング |
US20080011601A1 (en) * | 2006-07-14 | 2008-01-17 | Applied Materials, Inc. | Cooled anodes |
US8647486B2 (en) * | 2009-01-05 | 2014-02-11 | Applied Materials, Inc. | Magnet bar support system |
US8673122B2 (en) | 2009-04-07 | 2014-03-18 | Magna Mirrors Of America, Inc. | Hot tile sputtering system |
US20110263065A1 (en) * | 2010-04-22 | 2011-10-27 | Primestar Solar, Inc. | Modular system for high-rate deposition of thin film layers on photovoltaic module substrates |
CN103898462B (zh) * | 2012-12-29 | 2017-08-22 | 深圳富泰宏精密工业有限公司 | 磁控溅射镀膜装置 |
US11414747B2 (en) * | 2018-06-26 | 2022-08-16 | Tokyo Electron Limited | Sputtering device |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4116806A (en) * | 1977-12-08 | 1978-09-26 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
US4198283A (en) * | 1978-11-06 | 1980-04-15 | Materials Research Corporation | Magnetron sputtering target and cathode assembly |
US4401539A (en) * | 1981-01-30 | 1983-08-30 | Hitachi, Ltd. | Sputtering cathode structure for sputtering apparatuses, method of controlling magnetic flux generated by said sputtering cathode structure, and method of forming films by use of said sputtering cathode structure |
US4395323A (en) * | 1981-04-17 | 1983-07-26 | Denton Vacuum Inc. | Apparatus for improving a sputtering process |
JPS5816078A (ja) * | 1981-07-17 | 1983-01-29 | Toshiba Corp | プラズマエツチング装置 |
NL8200902A (nl) * | 1982-03-05 | 1983-10-03 | Philips Nv | Magnetron-kathodesputtersysteem. |
NL8202092A (nl) * | 1982-05-21 | 1983-12-16 | Philips Nv | Magnetronkathodesputtersysteem. |
US4558388A (en) * | 1983-11-02 | 1985-12-10 | Varian Associates, Inc. | Substrate and substrate holder |
JPH0627323B2 (ja) * | 1983-12-26 | 1994-04-13 | 株式会社日立製作所 | スパツタリング方法及びその装置 |
DE3503398A1 (de) * | 1985-02-01 | 1986-08-07 | W.C. Heraeus Gmbh, 6450 Hanau | Sputteranlage zum reaktiven beschichten eines substrates mit hartstoffen |
US4749465A (en) * | 1985-05-09 | 1988-06-07 | Seagate Technology | In-line disk sputtering system |
DE3521053A1 (de) * | 1985-06-12 | 1986-12-18 | Leybold-Heraeus GmbH, 5000 Köln | Vorrichtung zum aufbringen duenner schichten auf ein substrat |
JPS6260866A (ja) * | 1985-08-02 | 1987-03-17 | Fujitsu Ltd | マグネトロンスパツタ装置 |
DE3731444A1 (de) * | 1987-09-18 | 1989-03-30 | Leybold Ag | Vorrichtung zum beschichten von substraten |
JPH01268859A (ja) * | 1988-04-20 | 1989-10-26 | Casio Comput Co Ltd | 透明導電膜の形成方法および形成装置 |
DE3821207A1 (de) * | 1988-06-23 | 1989-12-28 | Leybold Ag | Anordnung zum beschichten eines substrats mit dielektrika |
DE3929695C2 (de) * | 1989-09-07 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten eines Substrats |
-
1989
- 1989-12-07 JP JP1316365A patent/JP2934711B2/ja not_active Expired - Fee Related
-
1990
- 1990-12-05 DE DE69018580T patent/DE69018580T2/de not_active Expired - Fee Related
- 1990-12-05 EP EP90123314A patent/EP0431592B1/de not_active Expired - Lifetime
-
1993
- 1993-11-26 US US08/158,821 patent/US5514259A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0431592B1 (de) | 1995-04-12 |
US5514259A (en) | 1996-05-07 |
EP0431592A2 (de) | 1991-06-12 |
DE69018580T2 (de) | 1995-08-10 |
JP2934711B2 (ja) | 1999-08-16 |
EP0431592A3 (en) | 1991-07-31 |
JPH03177569A (ja) | 1991-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee | ||
8370 | Indication related to discontinuation of the patent is to be deleted | ||
8339 | Ceased/non-payment of the annual fee |