DE69018307D1 - Verfahren zur Herstellung von Kontakten in Halbleiterbauelementen. - Google Patents

Verfahren zur Herstellung von Kontakten in Halbleiterbauelementen.

Info

Publication number
DE69018307D1
DE69018307D1 DE69018307T DE69018307T DE69018307D1 DE 69018307 D1 DE69018307 D1 DE 69018307D1 DE 69018307 T DE69018307 T DE 69018307T DE 69018307 T DE69018307 T DE 69018307T DE 69018307 D1 DE69018307 D1 DE 69018307D1
Authority
DE
Germany
Prior art keywords
contacts
production
semiconductor components
semiconductor
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69018307T
Other languages
English (en)
Other versions
DE69018307T2 (de
Inventor
Takayuki Ohba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69018307D1 publication Critical patent/DE69018307D1/de
Application granted granted Critical
Publication of DE69018307T2 publication Critical patent/DE69018307T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H01L21/02063—Cleaning during device manufacture during, before or after processing of insulating layers the processing being the formation of vias or contact holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76841—Barrier, adhesion or liner layers
    • H01L21/76843—Barrier, adhesion or liner layers formed in openings in a dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
    • H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69018307T 1989-05-09 1990-05-09 Verfahren zur Herstellung von Kontakten in Halbleiterbauelementen. Expired - Fee Related DE69018307T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11712889 1989-05-09
JP5891890 1990-03-09

Publications (2)

Publication Number Publication Date
DE69018307D1 true DE69018307D1 (de) 1995-05-11
DE69018307T2 DE69018307T2 (de) 1995-08-03

Family

ID=26399931

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69018307T Expired - Fee Related DE69018307T2 (de) 1989-05-09 1990-05-09 Verfahren zur Herstellung von Kontakten in Halbleiterbauelementen.

Country Status (3)

Country Link
EP (1) EP0397131B1 (de)
KR (1) KR930005947B1 (de)
DE (1) DE69018307T2 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0583876B1 (de) * 1992-07-27 1999-02-17 STMicroelectronics, Inc. Planaxer Kontakt mit einer Lücke
US6291343B1 (en) 1994-11-14 2001-09-18 Applied Materials, Inc. Plasma annealing of substrates to improve adhesion
US6251758B1 (en) 1994-11-14 2001-06-26 Applied Materials, Inc. Construction of a film on a semiconductor wafer
US6156382A (en) * 1997-05-16 2000-12-05 Applied Materials, Inc. Chemical vapor deposition process for depositing tungsten
US6221174B1 (en) 1999-02-11 2001-04-24 Applied Materials, Inc. Method of performing titanium/titanium nitride integration
KR100369354B1 (ko) * 1999-06-30 2003-01-24 주식회사 하이닉스반도체 저에너지 건식 세정 및 급속열처리 공정을 이용한 콘택 저항감소 방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338354A (en) * 1980-04-28 1982-07-06 International Standard Electric Corporation Coating powdered material
JPS5747706A (en) * 1980-09-04 1982-03-18 Toshio Hirai Lump of silicon nitride containing ti and its manufacture
JPS57157525A (en) * 1981-03-23 1982-09-29 Fujitsu Ltd Surface treating method
JPS58172206A (ja) * 1982-04-02 1983-10-11 Shin Etsu Chem Co Ltd 金属窒化物の製造方法
EP0117542B1 (de) * 1983-02-25 1992-06-17 Liburdi Engineering Limited Chemische Dampfabscheidung von Überzügen aus metallischen Verbindungen unter Verwendung von metallischen Subhalogeniden
EP0174743A3 (de) * 1984-09-05 1988-06-08 Morton Thiokol, Inc. Verfahren zur Abscheidung von Dünnfilmen aus Nitriden der Übergangsmetalle
JPS6372881A (ja) * 1986-09-16 1988-04-02 Toshiba Corp 薄膜形成方法
JPH0818919B2 (ja) * 1987-04-03 1996-02-28 東芝タンガロイ株式会社 収率にすぐれたウイスカ−の製造方法
JPH089784B2 (ja) * 1987-04-28 1996-01-31 東芝タンガロイ株式会社 表面精度のすぐれた被覆鉄基合金及びその製造方法
DE3815569A1 (de) * 1987-05-07 1988-12-29 Intel Corp Verfahren zum selektiven abscheiden eines leitenden materials bei der herstellung integrierter schaltungen

Also Published As

Publication number Publication date
EP0397131A2 (de) 1990-11-14
EP0397131A3 (de) 1991-03-27
KR900019159A (ko) 1990-12-24
KR930005947B1 (ko) 1993-06-29
DE69018307T2 (de) 1995-08-03
EP0397131B1 (de) 1995-04-05

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee