DE69010564T2 - Spannungsarmes Gehäuse zur Montage einer lichtemittierenden Diode. - Google Patents

Spannungsarmes Gehäuse zur Montage einer lichtemittierenden Diode.

Info

Publication number
DE69010564T2
DE69010564T2 DE69010564T DE69010564T DE69010564T2 DE 69010564 T2 DE69010564 T2 DE 69010564T2 DE 69010564 T DE69010564 T DE 69010564T DE 69010564 T DE69010564 T DE 69010564T DE 69010564 T2 DE69010564 T2 DE 69010564T2
Authority
DE
Germany
Prior art keywords
mounting
light
low
emitting diode
voltage housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69010564T
Other languages
English (en)
Other versions
DE69010564D1 (de
Inventor
Dinesh C Shrimali
Frank M Steranka
Cheryl L Mcleod
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HP Inc
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of DE69010564D1 publication Critical patent/DE69010564D1/de
Application granted granted Critical
Publication of DE69010564T2 publication Critical patent/DE69010564T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE69010564T 1989-05-12 1990-05-03 Spannungsarmes Gehäuse zur Montage einer lichtemittierenden Diode. Expired - Fee Related DE69010564T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/351,194 US4920404A (en) 1989-05-12 1989-05-12 Low stress light-emitting diode mounting package

Publications (2)

Publication Number Publication Date
DE69010564D1 DE69010564D1 (de) 1994-08-18
DE69010564T2 true DE69010564T2 (de) 1994-11-03

Family

ID=23379967

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69010564T Expired - Fee Related DE69010564T2 (de) 1989-05-12 1990-05-03 Spannungsarmes Gehäuse zur Montage einer lichtemittierenden Diode.

Country Status (4)

Country Link
US (1) US4920404A (de)
EP (1) EP0397393B1 (de)
JP (1) JPH033374A (de)
DE (1) DE69010564T2 (de)

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* Cited by examiner, † Cited by third party
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US5052301A (en) * 1990-07-30 1991-10-01 Walker Richard E Electric initiator for blasting caps
US5469739A (en) * 1993-03-29 1995-11-28 Bait Data, Inc. On-line fishing depth indicator with encapsulated components
US5534718A (en) * 1993-04-12 1996-07-09 Hsi-Huang Lin LED package structure of LED display
JPH0766325A (ja) * 1993-08-26 1995-03-10 Rohm Co Ltd 合成樹脂パッケージ型電子部品の構造
US6327285B1 (en) 1997-05-09 2001-12-04 Semiconductor Laser International Corporation Surface mounted 2-D diode laser array package
TW449948B (en) * 1999-06-29 2001-08-11 Rohm Co Ltd Semiconductor device
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
DE19959609A1 (de) * 1999-12-10 2001-06-28 Volkswagen Ag Außenrückspiegel mit integriertem Fahrtrichtungsanzeiger
CA2418851C (en) * 2000-08-11 2009-06-16 The Brinkmann Corporation Led flashlight
US6561680B1 (en) * 2000-11-14 2003-05-13 Kelvin Shih Light emitting diode with thermally conductive structure
US6841931B2 (en) 2001-04-12 2005-01-11 Toyoda Gosei Co., Ltd. LED lamp
US6598998B2 (en) 2001-05-04 2003-07-29 Lumileds Lighting, U.S., Llc Side emitting light emitting device
US6896381B2 (en) * 2002-10-11 2005-05-24 Light Prescriptions Innovators, Llc Compact folded-optics illumination lens
US6924943B2 (en) * 2002-12-02 2005-08-02 Light Prescriptions Innovators, Llc Asymmetric TIR lenses producing off-axis beams
US7042655B2 (en) * 2002-12-02 2006-05-09 Light Prescriptions Innovators, Llc Apparatus and method for use in fulfilling illumination prescription
US7377671B2 (en) 2003-02-04 2008-05-27 Light Prescriptions Innovators, Llc Etendue-squeezing illumination optics
US6964507B2 (en) * 2003-04-25 2005-11-15 Everbrite, Llc Sign illumination system
US8075147B2 (en) * 2003-05-13 2011-12-13 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
US7329029B2 (en) * 2003-05-13 2008-02-12 Light Prescriptions Innovators, Llc Optical device for LED-based lamp
US7021797B2 (en) * 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
WO2005012951A2 (en) * 2003-07-28 2005-02-10 Light Prescriptions Innovators, Llc Three-dimensional simultaneous multiple-surface method and free-form illumination-optics designed therefrom
EP1660918B1 (de) * 2003-07-29 2017-03-15 Light Engine Limited Umfänglich emittierende leuchtvorrichtungen und durch transversalachsen-profil-sweeps gebildete linsenelemente
MY130919A (en) * 2003-09-19 2007-07-31 Mattel Inc Multidirectional light emitting diode unit
JP2006093672A (ja) * 2004-08-26 2006-04-06 Toshiba Corp 半導体発光装置
EP2757401A1 (de) * 2005-04-26 2014-07-23 LG Innotek Co., Ltd. Optische Linse, Gehäuse einer lichtemittierenden Vorrichtung mit der optischen Linse und Hintergrundbeleuchtungseinheit
JP2009503793A (ja) * 2005-07-28 2009-01-29 ライト プレスクリプションズ イノベーターズ エルエルシー バックライトおよびフロントライト用のエテンデュ保存型照明光学部品
EP1920285A4 (de) * 2005-07-28 2010-11-03 Light Prescriptions Innovators Linsenförmige optische freiformelemente und ihre anwendung auf kondensatoren und scheinwerfer
US20070066739A1 (en) * 2005-09-16 2007-03-22 General Electric Company Coated articles of manufacture made of high Tg polymer blends
WO2008008994A2 (en) * 2006-07-14 2008-01-17 Light Prescriptions Innovators, Llc Brightness-enhancing film
EP2057409A2 (de) * 2006-08-10 2009-05-13 Light Prescriptions Innovators, LLC. Rezyklierung von led-licht für helligkeitsverstärkung und winkelverengung
WO2008022065A2 (en) * 2006-08-11 2008-02-21 Light Prescriptions Innovators, Llc Led luminance-enhancement and color-mixing by rotationally multiplexed beam-combining
KR101346799B1 (ko) 2006-12-28 2014-01-02 서울반도체 주식회사 발광다이오드 패키지 및 그 제조방법
JP5341337B2 (ja) 2007-10-25 2013-11-13 スパンション エルエルシー 半導体装置及びその製造方法
US20090225529A1 (en) * 2008-02-21 2009-09-10 Light Prescriptions Innovators, Llc Spherically emitting remote phosphor
US20100237364A1 (en) * 2009-03-19 2010-09-23 Christy Alexander C Thermal Energy Dissipating and Light Emitting Diode Mounting Arrangement

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3676668A (en) * 1969-12-29 1972-07-11 Gen Electric Solid state lamp assembly
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
US3914786A (en) * 1974-04-19 1975-10-21 Hewlett Packard Co In-line reflective lead-pair for light-emitting diodes
JPS5270783A (en) * 1975-12-10 1977-06-13 Toshiba Corp Semiconductor luminescent unit
US4267559A (en) * 1979-09-24 1981-05-12 Bell Telephone Laboratories, Incorporated Low thermal impedance light-emitting diode package
JPS56142657A (en) * 1980-04-08 1981-11-07 Nec Corp Resin-sealed semiconductor device
DE3117571A1 (de) * 1981-05-04 1982-11-18 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Lumineszenz-halbleiterbauelement
FR2520934B1 (fr) * 1982-01-29 1985-06-07 Radiotechnique Compelec Dispositif semi-conducteur emetteur de lumiere a multicristaux
JPS6074486A (ja) * 1983-09-29 1985-04-26 Toshiba Corp 半導体発光装置
JPS61207085A (ja) * 1985-03-11 1986-09-13 Toshiba Corp 光半導体装置
GB2206444A (en) * 1987-06-10 1989-01-05 Yue Wen Cheng Light emitting diode

Also Published As

Publication number Publication date
EP0397393A2 (de) 1990-11-14
EP0397393A3 (de) 1991-04-03
DE69010564D1 (de) 1994-08-18
EP0397393B1 (de) 1994-07-13
JPH033374A (ja) 1991-01-09
US4920404A (en) 1990-04-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee