DE68918823D1 - Vorrichtung zum Ausschneiden von Tab-Anordnungen und zum Formen von deren Anschlüssen. - Google Patents

Vorrichtung zum Ausschneiden von Tab-Anordnungen und zum Formen von deren Anschlüssen.

Info

Publication number
DE68918823D1
DE68918823D1 DE68918823T DE68918823T DE68918823D1 DE 68918823 D1 DE68918823 D1 DE 68918823D1 DE 68918823 T DE68918823 T DE 68918823T DE 68918823 T DE68918823 T DE 68918823T DE 68918823 D1 DE68918823 D1 DE 68918823D1
Authority
DE
Germany
Prior art keywords
connections
forming
cutting tab
tab arrangements
arrangements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68918823T
Other languages
English (en)
Other versions
DE68918823T2 (de
Inventor
Peter Henry Bruhn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE68918823D1 publication Critical patent/DE68918823D1/de
Application granted granted Critical
Publication of DE68918823T2 publication Critical patent/DE68918823T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE68918823T 1988-12-21 1989-12-06 Vorrichtung zum Ausschneiden von Tab-Anordnungen und zum Formen von deren Anschlüssen. Expired - Fee Related DE68918823T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/289,996 US4877174A (en) 1988-12-21 1988-12-21 Tab device excise and lead form apparatus

Publications (2)

Publication Number Publication Date
DE68918823D1 true DE68918823D1 (de) 1994-11-17
DE68918823T2 DE68918823T2 (de) 1995-04-27

Family

ID=23114083

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68918823T Expired - Fee Related DE68918823T2 (de) 1988-12-21 1989-12-06 Vorrichtung zum Ausschneiden von Tab-Anordnungen und zum Formen von deren Anschlüssen.

Country Status (4)

Country Link
US (1) US4877174A (de)
EP (1) EP0375204B1 (de)
JP (1) JPH06101495B2 (de)
DE (1) DE68918823T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443534A (en) * 1992-07-21 1995-08-22 Vlt Corporation Providing electronic components for circuity assembly
US5307555A (en) * 1993-02-12 1994-05-03 Ford Motor Company Part pitch independent electrical component feeder
KR100213874B1 (ko) * 1996-07-29 1999-08-02 윤종용 전자부품이 배치된 테이프 및 이를 이용하기 위한 시스템
US5964137A (en) * 1998-07-23 1999-10-12 Jung; William Emil Bantam twin pipe notcher
SE526725C2 (sv) * 2003-09-17 2005-11-01 Acreo Ab Förfarande och anordning för tillverkning av elektriska komponenter
US8931378B2 (en) * 2009-08-11 2015-01-13 Marquip, Llc Method and apparatus for dry lubrication of a thin slitting blade
US8544165B2 (en) * 2010-03-29 2013-10-01 Hong Kong Applied Science & Technology Research Institute Co., Ltd. Apparatus for aligning electronic components
RU2595706C2 (ru) 2010-09-23 2016-08-27 Шэйп Корп. Установка и способ для изготовления трубчатой балки с одной центральной секцией
GB201021373D0 (en) * 2010-12-16 2011-01-26 Rolls Royce Plc A clipping die for clipping a component
KR101733820B1 (ko) 2011-05-26 2017-05-08 가부시키가이샤 제이올레드 표시 패널 및 그 제조 방법
DE102013015180A1 (de) * 2013-09-11 2015-03-12 Webo Werkzeugbau Oberschwaben Gmbh Verfahren und Vorrichtung zum Präzisionsschneiden von Werkstücken in einer Presse
CN109103128B (zh) * 2018-08-09 2021-08-27 重庆市嘉凌新科技有限公司 一种引线框架带切割机构

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488672A (en) * 1967-02-20 1970-01-06 Usm Corp Mechanism for cutting,forming and inserting components
NL160985C (de) * 1968-04-15 1900-01-01 Ibm
FR2205800B1 (de) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US4071180A (en) * 1976-10-04 1978-01-31 Northern Telecom Limited Apparatus for preforming wire leads and alignment for bonding
US4166562A (en) * 1977-09-01 1979-09-04 The Jade Corporation Assembly system for microcomponent devices such as semiconductor devices
FR2495836A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Machine automatique de cambrage des pattes de connexion de plaquettes de circuits integres
US4399610A (en) * 1981-04-01 1983-08-23 Western Electric Company, Inc. Assembling an electronic device
JPS58138062A (ja) * 1982-02-12 1983-08-16 Sharp Corp 半導体装置のボンデイング方式

Also Published As

Publication number Publication date
EP0375204A2 (de) 1990-06-27
US4877174A (en) 1989-10-31
EP0375204A3 (de) 1991-01-23
JPH06101495B2 (ja) 1994-12-12
JPH02185046A (ja) 1990-07-19
DE68918823T2 (de) 1995-04-27
EP0375204B1 (de) 1994-10-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee