DE60331472D1 - Widerstandsstrukturen zur elektrischen messung einer fehlanpassung in einer richtung von gehefteten masken - Google Patents
Widerstandsstrukturen zur elektrischen messung einer fehlanpassung in einer richtung von gehefteten maskenInfo
- Publication number
- DE60331472D1 DE60331472D1 DE60331472T DE60331472T DE60331472D1 DE 60331472 D1 DE60331472 D1 DE 60331472D1 DE 60331472 T DE60331472 T DE 60331472T DE 60331472 T DE60331472 T DE 60331472T DE 60331472 D1 DE60331472 D1 DE 60331472D1
- Authority
- DE
- Germany
- Prior art keywords
- resistive element
- test pad
- feh
- matching
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70653—Metrology techniques
- G03F7/70658—Electrical testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43331102P | 2002-12-13 | 2002-12-13 | |
PCT/IB2003/005645 WO2004055599A1 (en) | 2002-12-13 | 2003-12-04 | Resistor structures to electrically measure unidirectional misalignment of stitched masks |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60331472D1 true DE60331472D1 (de) | 2010-04-08 |
Family
ID=32595153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60331472T Expired - Lifetime DE60331472D1 (de) | 2002-12-13 | 2003-12-04 | Widerstandsstrukturen zur elektrischen messung einer fehlanpassung in einer richtung von gehefteten masken |
Country Status (8)
Country | Link |
---|---|
US (2) | US7427857B2 (de) |
EP (1) | EP1573403B1 (de) |
JP (1) | JP2006510211A (de) |
CN (1) | CN1723419A (de) |
AT (1) | ATE459025T1 (de) |
AU (1) | AU2003283692A1 (de) |
DE (1) | DE60331472D1 (de) |
WO (1) | WO2004055599A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006033073A1 (en) * | 2004-09-23 | 2006-03-30 | Koninklijke Philips Electronics N.V. | Analogue measurement of alignment between layers of a semiconductor device |
CN100449406C (zh) * | 2006-06-07 | 2009-01-07 | 友达光电股份有限公司 | 电阻测量系统及应用其的测量方法 |
WO2009130627A1 (en) * | 2008-04-23 | 2009-10-29 | Nxp B.V. | An integrated circuit and a misalignment determination system for characterizing the same |
US8803542B2 (en) * | 2010-05-20 | 2014-08-12 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for verifying stitching accuracy of stitched chips on a wafer |
CN105241367A (zh) * | 2015-10-26 | 2016-01-13 | 上海华力微电子有限公司 | 一种缝合工艺对准精度的检测方法及结构 |
CN110058486B (zh) * | 2019-03-26 | 2022-06-28 | 云谷(固安)科技有限公司 | 掩膜板组件及掩膜板组件拼接精度的检测方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4431923A (en) * | 1980-05-13 | 1984-02-14 | Hughes Aircraft Company | Alignment process using serial detection of repetitively patterned alignment marks |
US4571538A (en) * | 1983-04-25 | 1986-02-18 | Rockwell International Corporation | Mask alignment measurement structure for semiconductor fabrication |
DE3831086C1 (en) * | 1988-09-13 | 1990-02-08 | Texas Instruments Deutschland Gmbh, 8050 Freising, De | Method for determining the alignment of two regions formed in an integrated monolithic (semiconductor) circuit |
US5383136A (en) * | 1992-03-13 | 1995-01-17 | The United States Of America As Represented By The Secretary Of Commerce | Electrical test structure and method for measuring the relative locations of conducting features on an insulating substrate |
EP0578899B1 (de) * | 1992-07-15 | 1996-12-27 | STMicroelectronics S.r.l. | Verfahren zum Messen des Grades der Planheit einer dielektrischen Schicht in einer integrierten Schaltung und integrierter Schaltung mit einer Anordnung zur Durchführung dieses Verfahrens |
US6030752A (en) * | 1997-02-25 | 2000-02-29 | Advanced Micro Devices, Inc. | Method of stitching segments defined by adjacent image patterns during the manufacture of a semiconductor device |
US6225013B1 (en) * | 1999-05-20 | 2001-05-01 | Tower Semiconductor Ltd. | Stitching design rules for forming interconnect layers |
US6563320B1 (en) * | 2000-02-25 | 2003-05-13 | Xilinx, Inc. | Mask alignment structure for IC layers |
US6305095B1 (en) * | 2000-02-25 | 2001-10-23 | Xilinx, Inc. | Methods and circuits for mask-alignment detection |
US6393714B1 (en) * | 2000-02-25 | 2002-05-28 | Xilinx, Inc. | Resistor arrays for mask-alignment detection |
US6787800B2 (en) * | 2001-07-24 | 2004-09-07 | Pdf Solutions, Inc. | Test vehicle with zig-zag structures |
-
2003
- 2003-12-04 AU AU2003283692A patent/AU2003283692A1/en not_active Abandoned
- 2003-12-04 DE DE60331472T patent/DE60331472D1/de not_active Expired - Lifetime
- 2003-12-04 EP EP03775673A patent/EP1573403B1/de not_active Expired - Lifetime
- 2003-12-04 WO PCT/IB2003/005645 patent/WO2004055599A1/en active Application Filing
- 2003-12-04 JP JP2004560030A patent/JP2006510211A/ja not_active Withdrawn
- 2003-12-04 US US10/537,952 patent/US7427857B2/en not_active Expired - Lifetime
- 2003-12-04 CN CNA200380105656XA patent/CN1723419A/zh active Pending
- 2003-12-04 AT AT03775673T patent/ATE459025T1/de not_active IP Right Cessation
-
2008
- 2008-07-24 US US12/179,218 patent/US7825651B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US7427857B2 (en) | 2008-09-23 |
CN1723419A (zh) | 2006-01-18 |
AU2003283692A1 (en) | 2004-07-09 |
JP2006510211A (ja) | 2006-03-23 |
US20090212963A1 (en) | 2009-08-27 |
US7825651B2 (en) | 2010-11-02 |
US20060060843A1 (en) | 2006-03-23 |
ATE459025T1 (de) | 2010-03-15 |
EP1573403B1 (de) | 2010-02-24 |
WO2004055599A1 (en) | 2004-07-01 |
EP1573403A1 (de) | 2005-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60307871D1 (de) | Vorrichtungen und verfahren zur wärmeverlustdruckmessung | |
CN101793020A (zh) | 一种土工格栅应变测试装置及其测试方法 | |
CN208888302U (zh) | 一种电力系统中线路电流的测量装置 | |
JP2005526228A5 (de) | ||
US7397255B2 (en) | Micro Kelvin probes and micro Kelvin probe methodology | |
SE0200126L (sv) | Mätanordning | |
CN105137378A (zh) | 一种分压器的2/1分压比自校准方法 | |
DE602004024123D1 (de) | Magnetfeldempfindliche sensoranordnung | |
DE60331472D1 (de) | Widerstandsstrukturen zur elektrischen messung einer fehlanpassung in einer richtung von gehefteten masken | |
CN105277112B (zh) | 消除导线电阻影响的半桥惠斯通电桥应变测量系统及方法 | |
JP2009515171A5 (de) | ||
CN106707213B (zh) | 一种数字集成电路标准样片 | |
CN207380122U (zh) | Mosfet漏源极耐压检测电路 | |
CN206019676U (zh) | 一种设有惠斯通电桥的电阻式传感器 | |
CN201811808U (zh) | 一种多通道温度测量电路 | |
CN203148615U (zh) | 数字显示压力表 | |
CN204758811U (zh) | 一种接地电阻测试仪点检装置 | |
CN207408489U (zh) | 电路板测试设备 | |
CN207798717U (zh) | 一种用于测试线膨胀系数的电测传感器 | |
CN201876500U (zh) | 一种自检接地电阻测试仪 | |
CN105988056B (zh) | 检测电路接合可靠度的布局结构 | |
CN204989443U (zh) | 一种耐压测试仪点检装置 | |
CN208366319U (zh) | 一种新型隧道收敛监测辅助装置 | |
CN208432688U (zh) | 一种橡胶附件局部放电检测装置 | |
CN209387108U (zh) | 一种用于沥青路面的车辆称重系统 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |