DE60315223D1 - Kühllamellen - Google Patents

Kühllamellen

Info

Publication number
DE60315223D1
DE60315223D1 DE60315223T DE60315223T DE60315223D1 DE 60315223 D1 DE60315223 D1 DE 60315223D1 DE 60315223 T DE60315223 T DE 60315223T DE 60315223 T DE60315223 T DE 60315223T DE 60315223 D1 DE60315223 D1 DE 60315223D1
Authority
DE
Germany
Prior art keywords
foil
metallic
fins
plate
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60315223T
Other languages
English (en)
Other versions
DE60315223T2 (de
Inventor
Benjamin P Gundale
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bergquist Co Inc
Original Assignee
Bergquist Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bergquist Co Inc filed Critical Bergquist Co Inc
Application granted granted Critical
Publication of DE60315223D1 publication Critical patent/DE60315223D1/de
Publication of DE60315223T2 publication Critical patent/DE60315223T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/103—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding using a roller
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/10—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
DE60315223T 2002-06-17 2003-06-17 Kühllamellen Expired - Lifetime DE60315223T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/172,877 US6650215B1 (en) 2002-06-17 2002-06-17 Finned heat sinks
US172877 2002-06-17

Publications (2)

Publication Number Publication Date
DE60315223D1 true DE60315223D1 (de) 2007-09-13
DE60315223T2 DE60315223T2 (de) 2007-11-15

Family

ID=29419908

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60315223T Expired - Lifetime DE60315223T2 (de) 2002-06-17 2003-06-17 Kühllamellen

Country Status (7)

Country Link
US (1) US6650215B1 (de)
EP (1) EP1376677B1 (de)
JP (1) JP4128490B2 (de)
AT (1) ATE368938T1 (de)
CA (1) CA2431520A1 (de)
DE (1) DE60315223T2 (de)
TW (1) TWI250590B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147041B2 (en) * 2004-05-03 2006-12-12 Parker-Hannifin Corporation Lightweight heat sink
JP4952070B2 (ja) * 2006-06-02 2012-06-13 ソニー株式会社 面状光源装置及び液晶表示装置組立体
KR101424136B1 (ko) * 2007-09-06 2014-08-04 삼성전자주식회사 발열핀을 갖는 전자부품용 열교환장치
CN101549435B (zh) * 2008-04-03 2012-06-13 富准精密工业(深圳)有限公司 散热器制造方法
US10919106B2 (en) * 2017-06-09 2021-02-16 General Electric Company Ultrasonic welding of annular components
JP2019096702A (ja) * 2017-11-21 2019-06-20 トヨタ自動車株式会社 冷却器
US11305373B2 (en) * 2019-10-30 2022-04-19 Raytheon Company Ultrasonic additively manufactured coldplates on heat spreaders
CN115394657A (zh) * 2022-05-31 2022-11-25 浙江禾芯集成电路有限公司 一种应用于平面型功率器件的封装结构的封装方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5533257A (en) * 1994-05-24 1996-07-09 Motorola, Inc. Method for forming a heat dissipation apparatus
US5791406A (en) * 1994-08-02 1998-08-11 Hoogovens Aluminium Profiltechnik, Gmbh Cooling device for electrical or electronic components having a base plate and cooling elements and method for manufacturing the same
JPH08130274A (ja) * 1994-10-29 1996-05-21 Shinko Metal Prod Kk ヒートシンク
US5653280A (en) * 1995-11-06 1997-08-05 Ncr Corporation Heat sink assembly and method of affixing the same to electronic devices
TW349193B (en) * 1997-11-14 1999-01-01 Hon Hai Prec Ind Co Ltd Method of assembling heat sink fins and product thereof
JP4355412B2 (ja) * 1999-11-26 2009-11-04 昭和電工株式会社 ヒートシンクおよびその製造方法

Also Published As

Publication number Publication date
CA2431520A1 (en) 2003-12-17
EP1376677A2 (de) 2004-01-02
DE60315223T2 (de) 2007-11-15
JP4128490B2 (ja) 2008-07-30
EP1376677B1 (de) 2007-08-01
ATE368938T1 (de) 2007-08-15
US6650215B1 (en) 2003-11-18
TW200405483A (en) 2004-04-01
EP1376677A3 (de) 2006-03-01
JP2004023105A (ja) 2004-01-22
TWI250590B (en) 2006-03-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition