DE60313018D1 - Mikroelektromechanisches bauteil mit piezoelektrischem dünnfilmaktuator - Google Patents

Mikroelektromechanisches bauteil mit piezoelektrischem dünnfilmaktuator

Info

Publication number
DE60313018D1
DE60313018D1 DE60313018T DE60313018T DE60313018D1 DE 60313018 D1 DE60313018 D1 DE 60313018D1 DE 60313018 T DE60313018 T DE 60313018T DE 60313018 T DE60313018 T DE 60313018T DE 60313018 D1 DE60313018 D1 DE 60313018D1
Authority
DE
Germany
Prior art keywords
thin film
piezoelectric thin
film circuit
microelectromechanical component
microelectromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60313018T
Other languages
English (en)
Other versions
DE60313018T2 (de
Inventor
Joon Park
Ron K Nakahira
Robert C Allison
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE60313018D1 publication Critical patent/DE60313018D1/de
Application granted granted Critical
Publication of DE60313018T2 publication Critical patent/DE60313018T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G5/00—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture
    • H01G5/16—Capacitors in which the capacitance is varied by mechanical means, e.g. by turning a shaft; Processes of their manufacture using variation of distance between electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezo-electric relays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2041—Beam type
    • H10N30/2042—Cantilevers, i.e. having one fixed end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H57/00—Electrostrictive relays; Piezo-electric relays
    • H01H2057/006—Micromechanical piezoelectric relay
DE60313018T 2002-11-14 2003-11-14 Mikroelektromechanisches bauteil mit piezoelektrischem dünnfilmaktuator Expired - Lifetime DE60313018T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/294,413 US7132723B2 (en) 2002-11-14 2002-11-14 Micro electro-mechanical system device with piezoelectric thin film actuator
US294413 2002-11-14
PCT/US2003/036595 WO2004047190A2 (en) 2002-11-14 2003-11-14 Micro electro-mechanical system device with piezoelectric thin film actuator

Publications (2)

Publication Number Publication Date
DE60313018D1 true DE60313018D1 (de) 2007-05-16
DE60313018T2 DE60313018T2 (de) 2007-12-13

Family

ID=32296977

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60313018T Expired - Lifetime DE60313018T2 (de) 2002-11-14 2003-11-14 Mikroelektromechanisches bauteil mit piezoelektrischem dünnfilmaktuator

Country Status (9)

Country Link
US (1) US7132723B2 (de)
EP (1) EP1560787B1 (de)
KR (1) KR20050086629A (de)
AU (1) AU2003295553B2 (de)
DE (1) DE60313018T2 (de)
DK (1) DK1560787T3 (de)
ES (1) ES2282713T3 (de)
NO (1) NO332052B1 (de)
WO (1) WO2004047190A2 (de)

Families Citing this family (30)

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US7446217B2 (en) * 2002-11-14 2008-11-04 Advanced Technology Materials, Inc. Composition and method for low temperature deposition of silicon-containing films
US7531679B2 (en) * 2002-11-14 2009-05-12 Advanced Technology Materials, Inc. Composition and method for low temperature deposition of silicon-containing films such as films including silicon nitride, silicon dioxide and/or silicon-oxynitride
GB0300664D0 (en) * 2003-01-11 2003-02-12 Rolls Royce Plc Sensing film material
US7601860B2 (en) 2003-10-10 2009-10-13 Advanced Technology Materials, Inc. Composition and method for low temperature chemical vapor deposition of silicon-containing films including silicon carbonitride and silicon oxycarbonitride films
US7579496B2 (en) 2003-10-10 2009-08-25 Advanced Technology Materials, Inc. Monosilane or disilane derivatives and method for low temperature deposition of silicon-containing films using the same
EP1548748A1 (de) * 2003-12-17 2005-06-29 Interuniversitaire Microelectronica Centrum vzw ( IMEC) Verfahren zur Herstellung von Sonden für Atomkraftmikroskopie
EP1726048B1 (de) * 2003-12-22 2008-09-10 Nxp B.V. Elektronische einrichtung
US8901703B2 (en) * 2004-05-06 2014-12-02 Nxp, B.V. Electronic device
JP4744849B2 (ja) 2004-11-11 2011-08-10 株式会社東芝 半導体装置
US7198975B2 (en) * 2004-12-21 2007-04-03 Taiwan Semiconductor Manufacturing Company Semiconductor methods and structures
KR100668617B1 (ko) * 2005-01-06 2007-01-16 엘지전자 주식회사 알에프 파워 검출장치 및 그 제조방법
US7098576B2 (en) * 2005-01-10 2006-08-29 Raytheon Company Micro-electrical-mechanical device and method of making same
US7623007B2 (en) * 2005-10-19 2009-11-24 Panasonic Corporation Device including piezoelectric thin film and a support having a vertical cross-section with a curvature
KR101092536B1 (ko) * 2005-11-30 2011-12-13 삼성전자주식회사 압전형 ｒｆ 멤스 소자 및 그 제조방법
US7556978B2 (en) * 2006-02-28 2009-07-07 Freescale Semiconductor, Inc. Piezoelectric MEMS switches and methods of making
JP4316590B2 (ja) 2006-06-23 2009-08-19 株式会社東芝 圧電駆動型ｍｅｍｓアクチュエータ
US7830066B2 (en) * 2007-07-26 2010-11-09 Freescale Semiconductor, Inc. Micromechanical device with piezoelectric and electrostatic actuation and method therefor
JP5079456B2 (ja) * 2007-11-06 2012-11-21 新光電気工業株式会社 半導体装置及びその製造方法
WO2013177326A1 (en) 2012-05-25 2013-11-28 Advanced Technology Materials, Inc. Silicon precursors for low temperature ald of silicon-based thin-films
US9618405B2 (en) 2014-08-06 2017-04-11 Invensense, Inc. Piezoelectric acoustic resonator based sensor
US10726231B2 (en) 2012-11-28 2020-07-28 Invensense, Inc. Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
US10497747B2 (en) 2012-11-28 2019-12-03 Invensense, Inc. Integrated piezoelectric microelectromechanical ultrasound transducer (PMUT) on integrated circuit (IC) for fingerprint sensing
US9511994B2 (en) 2012-11-28 2016-12-06 Invensense, Inc. Aluminum nitride (AlN) devices with infrared absorption structural layer
US9114977B2 (en) 2012-11-28 2015-08-25 Invensense, Inc. MEMS device and process for RF and low resistance applications
TWI621242B (zh) * 2013-09-19 2018-04-11 伊凡聖斯股份有限公司 具有紅外線吸收結構層的氮化鋁（ａｉｎ）裝置
JP6601174B2 (ja) * 2015-11-13 2019-11-06 セイコーエプソン株式会社 圧電アクチュエーター、積層アクチュエーター、圧電モーター、ロボット、ハンド及び送液ポンプ
CN105449327B (zh) * 2015-12-23 2018-01-16 西安电子科技大学 基于机电耦合的分布式mems移相器电容桥高度公差的确定方法
CN105489978B (zh) * 2016-01-21 2018-01-16 西安电子科技大学 基于相移量机电耦合的分布式mems移相器工作电压的调整方法
US10291283B2 (en) 2016-04-01 2019-05-14 Intel Corporation Tunable radio frequency systems using piezoelectric package-integrated switching devices
US11489461B2 (en) * 2020-05-26 2022-11-01 Microsoft Technology Licensing, Llc Thin film actuator having transversely oriented structural stiffeners to increase actuator stroke

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2708244A (en) * 1954-03-24 1955-05-10 Jaffe Bernard Piezoelectric transducers using lead titanate and lead zirconate
US4342936A (en) * 1980-12-19 1982-08-03 Eastman Kodak Company High deflection bandwidth product polymeric piezoelectric flexure mode device and method of making same
US4868448A (en) * 1986-09-24 1989-09-19 General Electric Company Piezoelectric relay switching matrix
US5536963A (en) * 1994-05-11 1996-07-16 Regents Of The University Of Minnesota Microdevice with ferroelectric for sensing or applying a force
GB2353410B (en) * 1999-08-18 2002-04-17 Marconi Electronic Syst Ltd Electrical switches
US6504118B2 (en) * 2000-10-27 2003-01-07 Daniel J Hyman Microfabricated double-throw relay with multimorph actuator and electrostatic latch mechanism
JP2002170470A (ja) * 2000-11-28 2002-06-14 Matsushita Electric Works Ltd 半導体マイクロリレー及びその製造方法
US20020096421A1 (en) 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US7098577B2 (en) * 2002-10-21 2006-08-29 Hrl Laboratories, Llc Piezoelectric switch for tunable electronic components

Also Published As

Publication number Publication date
AU2003295553A1 (en) 2004-06-15
WO2004047190A3 (en) 2004-10-28
KR20050086629A (ko) 2005-08-30
DK1560787T3 (da) 2007-08-20
ES2282713T3 (es) 2007-10-16
EP1560787B1 (de) 2007-04-04
EP1560787A2 (de) 2005-08-10
NO20052671L (no) 2005-06-03
AU2003295553B2 (en) 2007-05-31
WO2004047190A2 (en) 2004-06-03
NO332052B1 (no) 2012-06-11
US7132723B2 (en) 2006-11-07
US20040094815A1 (en) 2004-05-20
DE60313018T2 (de) 2007-12-13

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