DE60310938D1 - Verfahren zur herstellung eines verbundkörpers, ins besondere kühlkörper - Google Patents
Verfahren zur herstellung eines verbundkörpers, ins besondere kühlkörperInfo
- Publication number
- DE60310938D1 DE60310938D1 DE60310938T DE60310938T DE60310938D1 DE 60310938 D1 DE60310938 D1 DE 60310938D1 DE 60310938 T DE60310938 T DE 60310938T DE 60310938 T DE60310938 T DE 60310938T DE 60310938 D1 DE60310938 D1 DE 60310938D1
- Authority
- DE
- Germany
- Prior art keywords
- producing
- metal
- particular heating
- powder mixture
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0084—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ carbon or graphite as the main non-metallic constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C47/00—Making alloys containing metallic or non-metallic fibres or filaments
- C22C47/14—Making alloys containing metallic or non-metallic fibres or filaments by powder metallurgy, i.e. by processing mixtures of metal powder and fibres or filaments
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C49/00—Alloys containing metallic or non-metallic fibres or filaments
- C22C49/14—Alloys containing metallic or non-metallic fibres or filaments characterised by the fibres or filaments
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0208396 | 2002-07-04 | ||
FR0208396A FR2841805B1 (fr) | 2002-07-04 | 2002-07-04 | Procede de fabrication d'un produit composite et en particulier d'un drain thermique |
PCT/FR2003/002043 WO2004005566A2 (fr) | 2002-07-04 | 2003-07-01 | Procede de fabrication d'un produit composite et en particulier d'un drain thermique. |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60310938D1 true DE60310938D1 (de) | 2007-02-15 |
DE60310938T2 DE60310938T2 (de) | 2007-10-11 |
Family
ID=29725162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60310938T Expired - Fee Related DE60310938T2 (de) | 2002-07-04 | 2003-07-01 | Verfahren zur herstellung eines verbundkörpers, insbesondere kühlkörper |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1520057B1 (de) |
AT (1) | ATE350506T1 (de) |
AU (1) | AU2003260645A1 (de) |
DE (1) | DE60310938T2 (de) |
ES (1) | ES2280801T3 (de) |
FR (1) | FR2841805B1 (de) |
WO (1) | WO2004005566A2 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200632266A (en) * | 2005-03-03 | 2006-09-16 | Mitac Technology Corp | Dissipation heat pipe structure and manufacturing method thereof (II) |
AT505491B1 (de) * | 2007-07-10 | 2010-06-15 | Electrovac Ag | Verbundwerkstoff |
EP2061078B1 (de) * | 2007-11-16 | 2015-07-15 | IQ evolution GmbH | Kühlkörper |
DE102008005529A1 (de) | 2008-01-22 | 2009-07-23 | Robert Bosch Gmbh | Kühlkörper und Verfahren zur Herstellung eines Kühlkörpers |
FR2968676B1 (fr) * | 2010-12-14 | 2012-12-07 | Arkema France | Procede d'introduction de nanocharges d'origine carbonique dans un metal ou un alliage |
CN104602488A (zh) * | 2014-12-31 | 2015-05-06 | 东莞市高明企业服务有限公司 | 一种运用于空调器的散热片及其加工工艺 |
DE102017216290B4 (de) * | 2017-09-14 | 2022-09-08 | Freie Universität Berlin | Verbundwerkstoff und Verfahren zu dessen Herstellung, Kühlkörper und elektronisches Bauteil |
CN109576520B (zh) * | 2018-11-30 | 2020-04-17 | 安徽工业大学 | 一种采用纳米熔盐制备含纳米颗粒硅铝铁合金的方法 |
CN109396453B (zh) * | 2018-12-21 | 2021-10-01 | 东莞市精研粉体科技有限公司 | 一种弥散强化铝青铜球形粉的制备方法 |
CN111822718B (zh) * | 2020-07-07 | 2022-05-13 | 鞍钢股份有限公司 | 一种粉末冶金-热轧制备不锈钢复合板的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5453293A (en) * | 1991-07-17 | 1995-09-26 | Beane; Alan F. | Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects |
US5561829A (en) * | 1993-07-22 | 1996-10-01 | Aluminum Company Of America | Method of producing structural metal matrix composite products from a blend of powders |
JPH08253826A (ja) * | 1994-10-19 | 1996-10-01 | Sumitomo Electric Ind Ltd | 焼結摩擦材およびそれに用いられる複合銅合金粉末とそれらの製造方法 |
US6596139B2 (en) * | 2000-05-31 | 2003-07-22 | Honeywell International Inc. | Discontinuous high-modulus fiber metal matrix composite for physical vapor deposition target backing plates and other thermal management applications |
JP2002080280A (ja) * | 2000-06-23 | 2002-03-19 | Sumitomo Electric Ind Ltd | 高熱伝導性複合材料及びその製造方法 |
-
2002
- 2002-07-04 FR FR0208396A patent/FR2841805B1/fr not_active Expired - Fee Related
-
2003
- 2003-07-01 EP EP03762722A patent/EP1520057B1/de not_active Expired - Lifetime
- 2003-07-01 WO PCT/FR2003/002043 patent/WO2004005566A2/fr active IP Right Grant
- 2003-07-01 AT AT03762722T patent/ATE350506T1/de not_active IP Right Cessation
- 2003-07-01 ES ES03762722T patent/ES2280801T3/es not_active Expired - Lifetime
- 2003-07-01 AU AU2003260645A patent/AU2003260645A1/en not_active Abandoned
- 2003-07-01 DE DE60310938T patent/DE60310938T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1520057A2 (de) | 2005-04-06 |
WO2004005566A2 (fr) | 2004-01-15 |
AU2003260645A8 (en) | 2004-01-23 |
WO2004005566A3 (fr) | 2004-04-01 |
ATE350506T1 (de) | 2007-01-15 |
FR2841805A1 (fr) | 2004-01-09 |
AU2003260645A1 (en) | 2004-01-23 |
EP1520057B1 (de) | 2007-01-03 |
ES2280801T3 (es) | 2007-09-16 |
FR2841805B1 (fr) | 2005-04-01 |
DE60310938T2 (de) | 2007-10-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |