DE60236266D1 - Montagevorrichtung für leiterplatte - Google Patents

Montagevorrichtung für leiterplatte

Info

Publication number
DE60236266D1
DE60236266D1 DE60236266T DE60236266T DE60236266D1 DE 60236266 D1 DE60236266 D1 DE 60236266D1 DE 60236266 T DE60236266 T DE 60236266T DE 60236266 T DE60236266 T DE 60236266T DE 60236266 D1 DE60236266 D1 DE 60236266D1
Authority
DE
Germany
Prior art keywords
board
pcb
mounting device
supporting element
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60236266T
Other languages
English (en)
Inventor
Carlo Morlacchi
Aldo Carettoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB SpA
Original Assignee
ABB SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ABB SpA filed Critical ABB SpA
Application granted granted Critical
Publication of DE60236266D1 publication Critical patent/DE60236266D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1428—Housings for small modular apparatus with terminal block

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Crushing And Pulverization Processes (AREA)
  • Conveying And Assembling Of Building Elements In Situ (AREA)
  • Vehicle Body Suspensions (AREA)
DE60236266T 2001-04-24 2002-04-19 Montagevorrichtung für leiterplatte Expired - Lifetime DE60236266D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT2001MI000868A ITMI20010868A1 (it) 2001-04-24 2001-04-24 Dispositivo di assemblaggio di schede per circuiti stampati
PCT/EP2002/004389 WO2002087300A1 (en) 2001-04-24 2002-04-19 Printed circuit board assembly device

Publications (1)

Publication Number Publication Date
DE60236266D1 true DE60236266D1 (de) 2010-06-17

Family

ID=11447548

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60236266T Expired - Lifetime DE60236266D1 (de) 2001-04-24 2002-04-19 Montagevorrichtung für leiterplatte

Country Status (7)

Country Link
EP (1) EP1384397B1 (de)
CN (1) CN1253061C (de)
AT (1) ATE467338T1 (de)
DE (1) DE60236266D1 (de)
ES (1) ES2345383T3 (de)
IT (1) ITMI20010868A1 (de)
WO (1) WO2002087300A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985802B2 (ja) * 2017-02-27 2021-12-22 川崎重工業株式会社 筐体及び基板の筐体への設置方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8328337U1 (de) * 1983-10-01 1989-06-15 Siemens Ag, 1000 Berlin Und 8000 Muenchen, De
JPS61107199A (ja) * 1984-10-30 1986-05-26 原子燃料工業株式会社 原子炉一次冷却系における異物回収方法
JP2877878B2 (ja) * 1990-02-28 1999-04-05 日本ヒューレット・パッカード株式会社 プリント基板保持桟構およびその使用方法
JP3347888B2 (ja) * 1994-08-11 2002-11-20 アルプス電気株式会社 プリント基板保持構造
DE29823669U1 (de) * 1998-06-18 1999-09-23 Wieland Electric Gmbh Universalgehäuse

Also Published As

Publication number Publication date
CN1253061C (zh) 2006-04-19
ITMI20010868A0 (it) 2001-04-24
EP1384397A1 (de) 2004-01-28
ES2345383T3 (es) 2010-09-22
CN1462575A (zh) 2003-12-17
WO2002087300A1 (en) 2002-10-31
EP1384397B1 (de) 2010-05-05
ITMI20010868A1 (it) 2002-10-24
ATE467338T1 (de) 2010-05-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition