DE60232113D1 - Herstellungsverfahren von ausserflächigen Strukturen von Mikrobauelementen - Google Patents

Herstellungsverfahren von ausserflächigen Strukturen von Mikrobauelementen

Info

Publication number
DE60232113D1
DE60232113D1 DE60232113T DE60232113T DE60232113D1 DE 60232113 D1 DE60232113 D1 DE 60232113D1 DE 60232113 T DE60232113 T DE 60232113T DE 60232113 T DE60232113 T DE 60232113T DE 60232113 D1 DE60232113 D1 DE 60232113D1
Authority
DE
Germany
Prior art keywords
production method
surface structures
micro devices
micro
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60232113T
Other languages
English (en)
Inventor
David K Fork
Christopher L Chua
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Application granted granted Critical
Publication of DE60232113D1 publication Critical patent/DE60232113D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/02—Fixed inductances of the signal type  without magnetic core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
DE60232113T 2001-02-09 2002-02-01 Herstellungsverfahren von ausserflächigen Strukturen von Mikrobauelementen Expired - Lifetime DE60232113D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/780,165 US6534249B2 (en) 2001-02-09 2001-02-09 Method of making low cost integrated out-of-plane micro-device structures

Publications (1)

Publication Number Publication Date
DE60232113D1 true DE60232113D1 (de) 2009-06-10

Family

ID=25118826

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60232113T Expired - Lifetime DE60232113D1 (de) 2001-02-09 2002-02-01 Herstellungsverfahren von ausserflächigen Strukturen von Mikrobauelementen

Country Status (4)

Country Link
US (1) US6534249B2 (de)
EP (1) EP1231182B1 (de)
JP (1) JP3981279B2 (de)
DE (1) DE60232113D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6392524B1 (en) * 2000-06-09 2002-05-21 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making
US6856225B1 (en) * 2000-05-17 2005-02-15 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making
US6595787B2 (en) * 2001-02-09 2003-07-22 Xerox Corporation Low cost integrated out-of-plane micro-device structures and method of making
US20040070479A1 (en) * 2002-10-10 2004-04-15 Yutaka Doi Via-less electronic structures and methods
US6844214B1 (en) 2003-08-21 2005-01-18 Xerox, Corporation Microelectromechanical system based sensors, sensor arrays, sensing systems, sensing methods and methods of fabrication
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US7283029B2 (en) * 2004-12-08 2007-10-16 Purdue Research Foundation 3-D transformer for high-frequency applications
JP2007005635A (ja) * 2005-06-24 2007-01-11 Toshiba Corp 半導体装置
US7550855B2 (en) * 2005-12-02 2009-06-23 Palo Alto Research Center Incorporated Vertically spaced plural microsprings
US20070145523A1 (en) * 2005-12-28 2007-06-28 Palo Alto Research Center Incorporated Integrateable capacitors and microcoils and methods of making thereof
US7517769B2 (en) * 2005-12-28 2009-04-14 Palo Alto Research Center Incorporated Integrateable capacitors and microcoils and methods of making thereof
US7713388B2 (en) * 2006-02-27 2010-05-11 Palo Alto Research Center Incorporated Out-of-plane spring structures on a substrate
US8068004B1 (en) * 2010-02-03 2011-11-29 Xilinx, Inc. Embedded inductor
US8441808B2 (en) 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
US8519534B2 (en) 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
US8823133B2 (en) 2011-03-29 2014-09-02 Xilinx, Inc. Interposer having an inductor
US9406738B2 (en) 2011-07-20 2016-08-02 Xilinx, Inc. Inductive structure formed using through silicon vias
US9330823B1 (en) 2011-12-19 2016-05-03 Xilinx, Inc. Integrated circuit structure with inductor in silicon interposer
US8525353B2 (en) 2011-12-19 2013-09-03 Palo Alto Research Center Incorporated Microspring structures adapted for target device cooling
US9337138B1 (en) 2012-03-09 2016-05-10 Xilinx, Inc. Capacitors within an interposer coupled to supply and ground planes of a substrate
US10109410B2 (en) 2017-01-17 2018-10-23 Palo Alto Research Center Incorporated Out of plane structures and methods for making out of plane structures

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9500849D0 (sv) * 1995-03-10 1995-03-10 Pharmacia Ab Methods for the manufacturing of micromachined structures and micromachined structures manufactured using such methods
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
KR100202998B1 (ko) * 1995-12-02 1999-06-15 남재우 마이크로 팁을 갖는 웨이퍼 프로브 카드 및 그 제조방법
US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US5944537A (en) * 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
US5979892A (en) * 1998-05-15 1999-11-09 Xerox Corporation Controlled cilia for object manipulation
US6396677B1 (en) * 2000-05-17 2002-05-28 Xerox Corporation Photolithographically-patterned variable capacitor structures and method of making
US6856225B1 (en) * 2000-05-17 2005-02-15 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making

Also Published As

Publication number Publication date
JP3981279B2 (ja) 2007-09-26
EP1231182A3 (de) 2003-10-08
EP1231182A2 (de) 2002-08-14
JP2002329631A (ja) 2002-11-15
US6534249B2 (en) 2003-03-18
US20020110758A1 (en) 2002-08-15
EP1231182B1 (de) 2009-04-29

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Legal Events

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