DE60215691D1 - Verfahren zur hestellung einer abbildungsvorrichtung - Google Patents

Verfahren zur hestellung einer abbildungsvorrichtung

Info

Publication number
DE60215691D1
DE60215691D1 DE60215691T DE60215691T DE60215691D1 DE 60215691 D1 DE60215691 D1 DE 60215691D1 DE 60215691 T DE60215691 T DE 60215691T DE 60215691 T DE60215691 T DE 60215691T DE 60215691 D1 DE60215691 D1 DE 60215691D1
Authority
DE
Germany
Prior art keywords
deposited
holding
substrate
semiconducting material
metallic surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60215691T
Other languages
English (en)
Other versions
DE60215691T2 (de
Inventor
Daniel Lincot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre National de la Recherche Scientifique CNRS
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Centre National de la Recherche Scientifique CNRS
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre National de la Recherche Scientifique CNRS, Commissariat a lEnergie Atomique CEA filed Critical Centre National de la Recherche Scientifique CNRS
Application granted granted Critical
Publication of DE60215691D1 publication Critical patent/DE60215691D1/de
Publication of DE60215691T2 publication Critical patent/DE60215691T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14665—Imagers using a photoconductor layer
    • H01L27/14676—X-ray, gamma-ray or corpuscular radiation imagers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
  • Paper (AREA)
  • Manipulator (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Details Of Cameras Including Film Mechanisms (AREA)
DE60215691T 2001-12-10 2002-12-09 Verfahren zur hestellung einer abbildungsvorrichtung Expired - Lifetime DE60215691T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0115911 2001-12-10
FR0115911A FR2833410B1 (fr) 2001-12-10 2001-12-10 Procede de realisation d'un dispositif d'imagerie
PCT/FR2002/004234 WO2003050875A2 (fr) 2001-12-10 2002-12-09 Procede de realisation d'un dispositif d'imagerie

Publications (2)

Publication Number Publication Date
DE60215691D1 true DE60215691D1 (de) 2006-12-07
DE60215691T2 DE60215691T2 (de) 2007-08-23

Family

ID=8870276

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60215691T Expired - Lifetime DE60215691T2 (de) 2001-12-10 2002-12-09 Verfahren zur hestellung einer abbildungsvorrichtung

Country Status (6)

Country Link
US (1) US7713759B2 (de)
EP (1) EP1451875B1 (de)
AT (1) ATE343852T1 (de)
DE (1) DE60215691T2 (de)
FR (1) FR2833410B1 (de)
WO (1) WO2003050875A2 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102263382B1 (ko) * 2014-04-07 2021-06-11 주식회사 레이언스 이미지센서 및 이의 제조방법
JP2015228408A (ja) * 2014-05-30 2015-12-17 キヤノン株式会社 放射線検出素子、放射線検出器と放射線検出素子の製造方法
CN104362187B (zh) * 2014-10-27 2016-08-17 中国科学院上海硅酸盐研究所 一种碘化铅和氧化铅复合物薄膜及其制备方法
FR3111919B1 (fr) * 2020-06-30 2022-08-26 Commissariat Energie Atomique Procede de depot d’une couche de perovskite inorganique

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3772168A (en) * 1972-08-10 1973-11-13 H Dillenberg Electrolytic plating of tin-nickel, tin-cobalt or tin-nickel-cobalt on a metal base and acid bath for said plating
US3968360A (en) * 1975-04-14 1976-07-06 Hughes Aircraft Company High resolution photoconductive array and process for fabricating same
US4341954A (en) * 1980-02-06 1982-07-27 Nippon Telegraph & Telephone Public Corp. Photo-electric converting apparatus
EP0393206B1 (de) * 1988-10-14 1996-05-08 Matsushita Electric Industrial Co., Ltd. Bildsensor und verfahren zu dessen herstellung
JP3649907B2 (ja) * 1998-01-20 2005-05-18 シャープ株式会社 二次元画像検出器およびその製造方法
JP3670179B2 (ja) * 1999-11-11 2005-07-13 三井金属鉱業株式会社 キャリア箔付電解銅箔及びそのキャリア箔付電解銅箔を用いた銅張積層板
US6576292B2 (en) * 2001-08-13 2003-06-10 Sharp Laboratories Of America, Inc. Method of forming highly adhesive copper thin films on metal nitride substrates via CVD

Also Published As

Publication number Publication date
US7713759B2 (en) 2010-05-11
EP1451875B1 (de) 2006-10-25
FR2833410A1 (fr) 2003-06-13
ATE343852T1 (de) 2006-11-15
FR2833410B1 (fr) 2004-03-19
US20060177958A1 (en) 2006-08-10
EP1451875A2 (de) 2004-09-01
DE60215691T2 (de) 2007-08-23
WO2003050875A2 (fr) 2003-06-19
WO2003050875A3 (fr) 2003-12-11

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Legal Events

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8364 No opposition during term of opposition