DE60214159D1 - Methode zur entfernung von oxiden auf kupferanschlussflächen - Google Patents

Methode zur entfernung von oxiden auf kupferanschlussflächen

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Publication number
DE60214159D1
DE60214159D1 DE60214159T DE60214159T DE60214159D1 DE 60214159 D1 DE60214159 D1 DE 60214159D1 DE 60214159 T DE60214159 T DE 60214159T DE 60214159 T DE60214159 T DE 60214159T DE 60214159 D1 DE60214159 D1 DE 60214159D1
Authority
DE
Germany
Prior art keywords
connection plates
copper connection
removing oxides
oxides
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60214159T
Other languages
English (en)
Other versions
DE60214159T2 (de
Inventor
Wai Mui
Bte Harun
Chu Tan
Nor Faizairi Mohd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Freescale Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of DE60214159D1 publication Critical patent/DE60214159D1/de
Application granted granted Critical
Publication of DE60214159T2 publication Critical patent/DE60214159T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10S438/00—Semiconductor device manufacturing: process
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  • Engineering & Computer Science (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE60214159T 2001-03-12 2002-02-08 Methode zur entfernung von oxiden auf kupferanschlussflächen Expired - Lifetime DE60214159T2 (de)

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US803749 2001-03-12
US09/803,749 US6693020B2 (en) 2001-03-12 2001-03-12 Method of preparing copper metallization die for wirebonding
PCT/US2002/003807 WO2002073687A2 (en) 2001-03-12 2002-02-08 Method of removing oxide from copper bond pads

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DE102005019160B4 (de) * 2005-04-25 2007-04-05 Emag Holding Gmbh Verfahren zur Herstellung von Kugelnaben für Gleichlaufgelenke
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TWI370515B (en) * 2006-09-29 2012-08-11 Megica Corp Circuit component
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US8030775B2 (en) 2007-08-27 2011-10-04 Megica Corporation Wirebond over post passivation thick metal
US20100052174A1 (en) * 2008-08-27 2010-03-04 Agere Systems Inc. Copper pad for copper wire bonding
JP6030637B2 (ja) * 2011-04-25 2016-11-24 エア プロダクツ アンド ケミカルズ インコーポレイテッドＡｉｒ Ｐｒｏｄｕｃｔｓ Ａｎｄ Ｃｈｅｍｉｃａｌｓ Ｉｎｃｏｒｐｏｒａｔｅｄ ワイヤーボンディング法を改良するためのリードフレームのクリーニング
CN107845568A (zh) * 2017-10-31 2018-03-27 浙江华越芯装电子股份有限公司 一种集成电路封装键合前等离子清洗方法及装置
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US6693020B2 (en) 2004-02-17
US20020127825A1 (en) 2002-09-12
EP1388167B1 (de) 2006-08-23
WO2002073687A3 (en) 2003-11-13
EP1388167A2 (de) 2004-02-11
JP2004527114A (ja) 2004-09-02
JP4056394B2 (ja) 2008-03-05
TW557560B (en) 2003-10-11
DE60214159T2 (de) 2006-12-14
AU2002242136A1 (en) 2002-09-24

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