DE602008005244D1 - MEMS-Mikroschalter mit leitfähigem Mechanikstopp - Google Patents

MEMS-Mikroschalter mit leitfähigem Mechanikstopp

Info

Publication number
DE602008005244D1
DE602008005244D1 DE602008005244T DE602008005244T DE602008005244D1 DE 602008005244 D1 DE602008005244 D1 DE 602008005244D1 DE 602008005244 T DE602008005244 T DE 602008005244T DE 602008005244 T DE602008005244 T DE 602008005244T DE 602008005244 D1 DE602008005244 D1 DE 602008005244D1
Authority
DE
Germany
Prior art keywords
mechanical stop
conductive mechanical
mems microswitch
microswitch
mems
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008005244T
Other languages
English (en)
Inventor
Xuefeng Wang
Kanakasabapathi Subramanian
Christopher Fred Keimel
Marco Francesco Aimi
Kuna Venkat Satya Rama Kishore
Glenn Scott Claydon
Oliver Charles Boomhower
Parag Thakre
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of DE602008005244D1 publication Critical patent/DE602008005244D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00Microstructural systems; Auxiliary parts of microstructural devices or systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00Electrostatic relays; Electro-adhesion relays
    • H01H59/0009Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0072Electrostatic relays; Electro-adhesion relays making use of micromechanics with stoppers or protrusions for maintaining a gap, reducing the contact area or for preventing stiction between the movable and the fixed electrode in the attracted position

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
DE602008005244T 2007-12-20 2008-12-11 MEMS-Mikroschalter mit leitfähigem Mechanikstopp Active DE602008005244D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/961,767 US7609136B2 (en) 2007-12-20 2007-12-20 MEMS microswitch having a conductive mechanical stop

Publications (1)

Publication Number Publication Date
DE602008005244D1 true DE602008005244D1 (de) 2011-04-14

Family

ID=40499615

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008005244T Active DE602008005244D1 (de) 2007-12-20 2008-12-11 MEMS-Mikroschalter mit leitfähigem Mechanikstopp

Country Status (7)

Country Link
US (1) US7609136B2 (de)
EP (1) EP2073236B1 (de)
JP (1) JP5449756B2 (de)
KR (1) KR101538169B1 (de)
CN (1) CN101533740B (de)
CA (1) CA2645834A1 (de)
DE (1) DE602008005244D1 (de)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
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US7754986B1 (en) * 2007-02-27 2010-07-13 National Semiconductor Corporation Mechanical switch that reduces the effect of contact resistance
KR101303579B1 (ko) * 2007-07-19 2013-09-09 삼성전자주식회사 전기기계적 스위치 및 그 제조방법
JP4492677B2 (ja) * 2007-11-09 2010-06-30 セイコーエプソン株式会社 アクティブマトリクス装置、電気光学表示装置、および電子機器
US8354899B2 (en) * 2009-09-23 2013-01-15 General Electric Company Switch structure and method
US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
US8576029B2 (en) * 2010-06-17 2013-11-05 General Electric Company MEMS switching array having a substrate arranged to conduct switching current
KR20120009574A (ko) * 2010-07-19 2012-02-02 주식회사 코미코 멤스 스위치 및 이의 제조 방법
FR2963784B1 (fr) * 2010-08-11 2012-08-31 Univ Limoges Microsystemes electromecaniques a gaps d'air.
US8797127B2 (en) 2010-11-22 2014-08-05 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS switch with reduced dielectric charging effect
JP2012196727A (ja) * 2011-03-18 2012-10-18 Fujitsu Ltd Mems素子
US9120667B2 (en) * 2011-06-20 2015-09-01 International Business Machines Corporation Micro-electro-mechanical system (MEMS) and related actuator bumps, methods of manufacture and design structures
EP2733114A4 (de) 2011-07-15 2015-02-25 Murata Manufacturing Co Dünnschichtvorrichtung und herstellungsverfahren dafür
KR101273700B1 (ko) * 2011-09-15 2013-06-12 삼성전기주식회사 Mems 소자
US9829550B2 (en) 2012-12-27 2017-11-28 General Electric Company Multi-nuclear receiving coils for magnetic resonance imaging (MRI)
US20140264655A1 (en) * 2013-03-13 2014-09-18 Invensense, Inc. Surface roughening to reduce adhesion in an integrated mems device
US9362074B2 (en) * 2013-03-14 2016-06-07 Intel Corporation Nanowire-based mechanical switching device
US9136165B2 (en) * 2013-06-04 2015-09-15 Invensense, Inc. Methods for stiction reduction in MEMS sensors
US9475093B2 (en) * 2013-10-03 2016-10-25 Fujifilm Dimatix, Inc. Piezoelectric ultrasonic transducer array with switched operational modes
US9525119B2 (en) 2013-12-11 2016-12-20 Fujifilm Dimatix, Inc. Flexible micromachined transducer device and method for fabricating same
US9748048B2 (en) * 2014-04-25 2017-08-29 Analog Devices Global MEMS switch
US20160099112A1 (en) * 2014-10-03 2016-04-07 wiSpry, Inc. . Systems, devices, and methods to reduce dielectric charging in micro-electro-mechanical systems devices
US9708176B2 (en) * 2015-05-28 2017-07-18 Invensense, Inc. MEMS sensor with high voltage switch
JP2017073227A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
JP2017073228A (ja) * 2015-10-05 2017-04-13 アルプス電気株式会社 磁気リードスイッチ
CN108352275B (zh) * 2015-11-16 2020-07-28 卡文迪什动力有限公司 高功率rf mems开关的热管理
CN105702527B (zh) * 2016-05-03 2018-09-21 北京邮电大学 一种微机电系统开关
CN108698813B (zh) * 2016-06-02 2023-01-20 歌尔股份有限公司 Mems器件及电子设备
CN109983556B (zh) * 2016-09-29 2021-03-23 卡文迪什动力有限公司 具有近零冲击着陆的mems rf开关
US10416524B1 (en) * 2017-04-25 2019-09-17 University Of South Florida Chromatic devices comprising a salt-based electrolyte
US11292715B2 (en) * 2019-06-27 2022-04-05 Taiwan Semiconductor Manufacturing Company, Ltd. Conductive bond structure to increase membrane sensitivity in MEMS device

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Publication number Priority date Publication date Assignee Title
US6384353B1 (en) * 2000-02-01 2002-05-07 Motorola, Inc. Micro-electromechanical system device
US6307169B1 (en) * 2000-02-01 2001-10-23 Motorola Inc. Micro-electromechanical switch
KR100738064B1 (ko) * 2001-02-27 2007-07-12 삼성전자주식회사 비선형적 복원력의 스프링을 가지는 mems 소자
US6657832B2 (en) * 2001-04-26 2003-12-02 Texas Instruments Incorporated Mechanically assisted restoring force support for micromachined membranes
US6646215B1 (en) * 2001-06-29 2003-11-11 Teravicin Technologies, Inc. Device adapted to pull a cantilever away from a contact structure
WO2003028059A1 (en) * 2001-09-21 2003-04-03 Hrl Laboratories, Llc Mems switches and methods of making same
AU2002363529A1 (en) * 2001-11-09 2003-05-19 Coventor, Incorporated Micro-scale interconnect device with internal heat spreader and method for fabricating same
US6608268B1 (en) * 2002-02-05 2003-08-19 Memtronics, A Division Of Cogent Solutions, Inc. Proximity micro-electro-mechanical system
US6876282B2 (en) * 2002-05-17 2005-04-05 International Business Machines Corporation Micro-electro-mechanical RF switch
US6657525B1 (en) * 2002-05-31 2003-12-02 Northrop Grumman Corporation Microelectromechanical RF switch
US6686820B1 (en) * 2002-07-11 2004-02-03 Intel Corporation Microelectromechanical (MEMS) switching apparatus
US6998946B2 (en) * 2002-09-17 2006-02-14 The Board Of Trustees Of The University Of Illinois High cycle deflection beam MEMS devices
CN1252771C (zh) * 2003-09-29 2006-04-19 中国科学院上海微系统与信息技术研究所 一种微型扭转式单刀双置射频开关结构及制作方法
US7283024B2 (en) * 2003-12-18 2007-10-16 Intel Corporation MEMS switch stopper bumps with adjustable height
US7352266B2 (en) 2004-02-20 2008-04-01 Wireless Mems, Inc. Head electrode region for a reliable metal-to-metal contact micro-relay MEMS switch
US20050248424A1 (en) * 2004-05-07 2005-11-10 Tsung-Kuan Chou Composite beam microelectromechanical system switch
JP4504237B2 (ja) * 2005-03-18 2010-07-14 富士通株式会社 ウエットエッチング方法、マイクロ可動素子製造方法、およびマイクロ可動素子
CN1716492A (zh) * 2005-06-07 2006-01-04 北京邮电大学 集成方式的rf mems开关
US7385744B2 (en) * 2006-06-28 2008-06-10 Qualcomm Mems Technologies, Inc. Support structure for free-standing MEMS device and methods for forming the same
JP2008238330A (ja) * 2007-03-27 2008-10-09 Toshiba Corp Mems装置およびこのmems装置を有する携帯通信端末

Also Published As

Publication number Publication date
KR101538169B1 (ko) 2015-07-20
EP2073236A1 (de) 2009-06-24
US20090159410A1 (en) 2009-06-25
CN101533740B (zh) 2013-11-13
US7609136B2 (en) 2009-10-27
EP2073236B1 (de) 2011-03-02
CA2645834A1 (en) 2009-06-20
CN101533740A (zh) 2009-09-16
JP2009152194A (ja) 2009-07-09
KR20090067080A (ko) 2009-06-24
JP5449756B2 (ja) 2014-03-19

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