DE602007007992D1 - Niedertemperaturhärtung von schlagzäh modifizierten epoxidklebstoffen - Google Patents

Niedertemperaturhärtung von schlagzäh modifizierten epoxidklebstoffen

Info

Publication number
DE602007007992D1
DE602007007992D1 DE602007007992T DE602007007992T DE602007007992D1 DE 602007007992 D1 DE602007007992 D1 DE 602007007992D1 DE 602007007992 T DE602007007992 T DE 602007007992T DE 602007007992 T DE602007007992 T DE 602007007992T DE 602007007992 D1 DE602007007992 D1 DE 602007007992D1
Authority
DE
Germany
Prior art keywords
low temperature
modified epoxy
temperature calculation
impact tool
epoxy adhesives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602007007992T
Other languages
English (en)
Inventor
Ian Aspin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hexcel Composites Ltd
Original Assignee
Hexcel Composites Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Composites Ltd filed Critical Hexcel Composites Ltd
Publication of DE602007007992D1 publication Critical patent/DE602007007992D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
DE602007007992T 2007-01-17 2007-01-17 Niedertemperaturhärtung von schlagzäh modifizierten epoxidklebstoffen Active DE602007007992D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2007/000190 WO2008087467A1 (en) 2007-01-17 2007-01-17 Low temperature curing of toughened epoxy adhesives

Publications (1)

Publication Number Publication Date
DE602007007992D1 true DE602007007992D1 (de) 2010-09-02

Family

ID=38043543

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602007007992T Active DE602007007992D1 (de) 2007-01-17 2007-01-17 Niedertemperaturhärtung von schlagzäh modifizierten epoxidklebstoffen

Country Status (6)

Country Link
US (1) US20100108259A1 (de)
EP (1) EP2121861B1 (de)
AT (1) ATE474896T1 (de)
DE (1) DE602007007992D1 (de)
ES (1) ES2349385T3 (de)
WO (1) WO2008087467A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680159A (zh) * 2020-12-28 2021-04-20 上海仁速新材料有限公司 一种紫外光固化环氧胶黏剂及其制备方法和应用

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110097568A1 (en) * 2008-03-25 2011-04-28 Toray Industries, Inc Epoxy resin composition, fiber-reinforced composite material, and method for producing the same
EP2168745B1 (de) 2008-09-30 2012-10-24 Hexcel Composites, Ltd. Zur Hälfte imprägniertes Material mit einer Oberflächenkunststoffschicht um Eigenschaften des Materials zu verbessern
CA2752503C (en) 2009-02-16 2016-12-06 Cytec Technology Corp. Conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
BR112012003572B1 (pt) 2009-08-31 2020-03-17 Cytec Technology Corp. Composição adesiva de termofixação, filme adesivo de termofixação, processo para a união de um primeiro substrato a um segundo substrato, e, método para a produção de um filme adesivo de termofixação
JP5721988B2 (ja) * 2010-09-29 2015-05-20 曙ブレーキ工業株式会社 接着剤
GB201100568D0 (en) 2011-01-13 2011-03-02 Cytec Engineered Materials Ltd Particle reinforced polymer composition
US8895148B2 (en) 2011-11-09 2014-11-25 Cytec Technology Corp. Structural adhesive and bonding application thereof
BR112017000219A2 (pt) 2014-07-08 2018-01-16 Dow Global Technologies Llc adesivo durável à falha de alta tg de cura retardada
WO2017127644A1 (en) * 2016-01-20 2017-07-27 Zephyros, Inc. Thermoplastic epoxy materials with core shell phase
US20200032117A1 (en) * 2016-05-26 2020-01-30 Zephyros, Inc. Solid polymeric adhesive compositions having high use temperature, and articles and methods thereof
US10208176B2 (en) 2016-06-22 2019-02-19 Hexcel Corporation Composite material with thermoplastic toughened novolac-based epoxy resin matrix
US10472474B2 (en) 2016-06-22 2019-11-12 Hexcel Corporation Semipreg with thermoplastic toughened novolac-based epoxy resin matrix
US10106661B2 (en) 2016-06-22 2018-10-23 Hexcel Corporation Composite material with thermoplastic toughened novolac-based epoxy resin matrix
US10800129B2 (en) 2017-01-24 2020-10-13 Bell Textron Inc. Honeycomb core sandwich panels
US11732125B2 (en) 2018-02-09 2023-08-22 Ppg Industries Ohio, Inc. Coating compositions
US11702224B2 (en) 2019-07-30 2023-07-18 The Boeing Company Lightning strike protection
US11577275B2 (en) 2019-08-26 2023-02-14 The Boeing Company Co-curable film layer application
US11559957B2 (en) 2020-01-24 2023-01-24 The Boeing Company Reactivation of co-cured film layers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4567216A (en) * 1983-12-22 1986-01-28 Union Carbide Corporation Thermoplastic modified epoxy compositions
US5204442A (en) * 1991-02-06 1993-04-20 General Electric Company Polyether polymers derived from 4,4"-dihydroxy-m-terphenyls
US5266610A (en) * 1991-03-11 1993-11-30 Ici Composites Inc. Toughened cocontinuous resin system
JPH0857709A (ja) * 1994-08-23 1996-03-05 Toshiba Tungaloy Co Ltd スローアウェイチップ
JPH0925393A (ja) * 1995-05-09 1997-01-28 Toray Ind Inc 繊維強化複合材料用エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
DE10017784A1 (de) 2000-04-10 2001-10-11 Henkel Kgaa Schlagfeste Epoxidharz-Zusammensetzungen
US6884854B2 (en) * 2000-04-10 2005-04-26 Henkel Kommanditgesellschaft Auf Aktien Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide
US6949602B2 (en) 2002-12-19 2005-09-27 Illinois Tool Works, Inc. Heat resistant, impact resistant, acrylic/epoxy adhesives

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112680159A (zh) * 2020-12-28 2021-04-20 上海仁速新材料有限公司 一种紫外光固化环氧胶黏剂及其制备方法和应用

Also Published As

Publication number Publication date
US20100108259A1 (en) 2010-05-06
EP2121861A1 (de) 2009-11-25
ATE474896T1 (de) 2010-08-15
ES2349385T3 (es) 2010-12-30
EP2121861B1 (de) 2010-07-21
WO2008087467A1 (en) 2008-07-24

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