DE602006007654D1 - Flüssigkeitejektionsgerät - Google Patents

Flüssigkeitejektionsgerät

Info

Publication number
DE602006007654D1
DE602006007654D1 DE602006007654T DE602006007654T DE602006007654D1 DE 602006007654 D1 DE602006007654 D1 DE 602006007654D1 DE 602006007654 T DE602006007654 T DE 602006007654T DE 602006007654 T DE602006007654 T DE 602006007654T DE 602006007654 D1 DE602006007654 D1 DE 602006007654D1
Authority
DE
Germany
Prior art keywords
flüssigkeitejektionsgerät
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602006007654T
Other languages
English (en)
Inventor
Hirotsuna Miura
Yuji Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of DE602006007654D1 publication Critical patent/DE602006007654D1/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0006—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coating Apparatus (AREA)
  • Optical Filters (AREA)
DE602006007654T 2005-11-08 2006-11-06 Flüssigkeitejektionsgerät Expired - Fee Related DE602006007654D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005323808A JP4525559B2 (ja) 2005-11-08 2005-11-08 液滴吐出装置

Publications (1)

Publication Number Publication Date
DE602006007654D1 true DE602006007654D1 (de) 2009-08-20

Family

ID=37635698

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006007654T Expired - Fee Related DE602006007654D1 (de) 2005-11-08 2006-11-06 Flüssigkeitejektionsgerät

Country Status (7)

Country Link
US (1) US20070103512A1 (de)
EP (1) EP1782957B1 (de)
JP (1) JP4525559B2 (de)
KR (1) KR100804120B1 (de)
CN (1) CN100509415C (de)
DE (1) DE602006007654D1 (de)
TW (1) TWI308084B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101428479B1 (ko) * 2007-06-22 2014-08-11 삼성전자 주식회사 잉크젯 화상 형성 장치 및 그 제어 방법
JP5875485B2 (ja) * 2012-08-24 2016-03-02 株式会社ミマキエンジニアリング ヘッド洗浄装置、インクジェット記録装置およびヘッド洗浄方法
US9505219B2 (en) * 2015-01-09 2016-11-29 Oce-Technologies B.V. Droplet ejection apparatus and method of cleaning the same
DE102016103749A1 (de) * 2016-03-02 2017-09-07 Snaptrack, Inc. Werkstückrohling und Verfahren zur Markierung des Rohlings
DE102017202628B4 (de) * 2017-02-17 2022-03-17 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Verfahren zum Kodieren eines plattenartigen Werkstücks, Verfahren zum Identifizieren eines plattenartigen Werkstücks, Strahlungsbearbeitungsvorrichtung und Kodiersystem
CN109435471A (zh) * 2018-11-22 2019-03-08 上海汉图科技有限公司 超声清洗装置及打印机

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259252A (ja) * 1992-03-10 1993-10-08 Hitachi Ltd 温度特性測定装置
JPH1177340A (ja) 1997-09-10 1999-03-23 Miyachi Technos Corp マーキング方法
JP3514061B2 (ja) * 1997-02-12 2004-03-31 富士ゼロックス株式会社 光学走査装置及びその洗浄方法
JPH11162831A (ja) * 1997-11-21 1999-06-18 Nikon Corp 投影露光装置及び投影露光方法
WO1999027568A1 (fr) * 1997-11-21 1999-06-03 Nikon Corporation Graveur de motifs a projection et procede de sensibilisation a projection
US6854841B1 (en) * 1998-04-17 2005-02-15 Elesys, Inc. Point-of-incidence ink-curing mechanisms for radial printing
EP1065058A3 (de) 1999-06-30 2003-04-09 Canon Kabushiki Kaisha Verfahren zur Herstellung eines Tintenstrahlaufzeichnungskopfes, mittels eines solchen Verfahrens hergestellter Tintenstrahlaufzeichnungskopf, und Laserbearbeitungsverfahren
CN100354134C (zh) * 2001-03-30 2007-12-12 L&P产权管理公司 用于纺织品的喷墨打印方法
SG96643A1 (en) * 2001-09-10 2003-06-16 Inst Data Storage Method and apparatus for cleaning inkjet cartridges
WO2003028943A1 (en) * 2001-10-03 2003-04-10 Lambda Physik Application Center, L.L.C. Method and apparatus for fine liquid spray assisted laser material processing
KR100426087B1 (ko) * 2001-10-12 2004-04-06 삼성전자주식회사 프린트헤드 크리닝장치 및 이를 채용한 잉크젯 프린터
JP2003127537A (ja) * 2001-10-29 2003-05-08 Optrex Corp マーキング方法
JP4107198B2 (ja) * 2002-11-20 2008-06-25 セイコーエプソン株式会社 液滴吐出装置、液滴吐出方法および電気光学装置
JP2004188903A (ja) * 2002-12-13 2004-07-08 Konica Minolta Holdings Inc キャッピング部材、クリーニング部材、配管部材、インクタンク部材、およびこれらを備えたｕｖ硬化型インクジェット記録装置
US7137696B2 (en) * 2003-01-09 2006-11-21 Con-Trol-Cure, Inc. Ink jet UV curing
US20040164325A1 (en) * 2003-01-09 2004-08-26 Con-Trol-Cure, Inc. UV curing for ink jet printer
JP4244382B2 (ja) * 2003-02-26 2009-03-25 セイコーエプソン株式会社 機能性材料定着方法及びデバイス製造方法
CN100380596C (zh) 2003-04-25 2008-04-09 株式会社半导体能源研究所 液滴排出装置、图案的形成方法及半导体装置的制造方法
JP4503941B2 (ja) * 2003-06-02 2010-07-14 東芝テック株式会社 インクジェットヘッド洗浄装置及びインクジェットヘッド洗浄方法
JP4049105B2 (ja) * 2004-02-24 2008-02-20 セイコーエプソン株式会社 ワイピング装置および液滴吐出装置、並びに電気光学装置、電気光学装置の製造方法および電子機器
US7401885B2 (en) 2004-08-23 2008-07-22 Semiconductor Energy Laboratory Co., Ltd. Droplet discharge apparatus
JP4311364B2 (ja) 2005-03-18 2009-08-12 セイコーエプソン株式会社 液滴吐出装置

Also Published As

Publication number Publication date
JP4525559B2 (ja) 2010-08-18
US20070103512A1 (en) 2007-05-10
KR100804120B1 (ko) 2008-02-18
EP1782957B1 (de) 2009-07-08
TW200724399A (en) 2007-07-01
KR20070049579A (ko) 2007-05-11
EP1782957A1 (de) 2007-05-09
CN1962272A (zh) 2007-05-16
JP2007130527A (ja) 2007-05-31
TWI308084B (en) 2009-04-01
CN100509415C (zh) 2009-07-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee