DE602005024409D1 - Umkonfigurierbare luftströmungs-lenkeinrichtung für ein modular-flügel-chassis - Google Patents

Umkonfigurierbare luftströmungs-lenkeinrichtung für ein modular-flügel-chassis

Info

Publication number
DE602005024409D1
DE602005024409D1 DE602005024409T DE602005024409T DE602005024409D1 DE 602005024409 D1 DE602005024409 D1 DE 602005024409D1 DE 602005024409 T DE602005024409 T DE 602005024409T DE 602005024409 T DE602005024409 T DE 602005024409T DE 602005024409 D1 DE602005024409 D1 DE 602005024409D1
Authority
DE
Germany
Prior art keywords
airflow
director
employed
channels
airflow director
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005024409T
Other languages
English (en)
Inventor
Christopher D Lucero
Javier Leija
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Radisys Corp
Original Assignee
Radisys Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Radisys Corp filed Critical Radisys Corp
Publication of DE602005024409D1 publication Critical patent/DE602005024409D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20563—Forced ventilation of a gaseous coolant within sub-racks for removing heat from electronic boards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Automatic Cycles, And Cycles In General (AREA)
  • Body Structure For Vehicles (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Air-Flow Control Members (AREA)
DE602005024409T 2004-06-24 2005-06-10 Umkonfigurierbare luftströmungs-lenkeinrichtung für ein modular-flügel-chassis Active DE602005024409D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/875,968 US7259961B2 (en) 2004-06-24 2004-06-24 Reconfigurable airflow director for modular blade chassis
PCT/US2005/020576 WO2006011965A1 (en) 2004-06-24 2005-06-10 Reconfigurable airflow director for modular blade chassis

Publications (1)

Publication Number Publication Date
DE602005024409D1 true DE602005024409D1 (de) 2010-12-09

Family

ID=34972466

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005024409T Active DE602005024409D1 (de) 2004-06-24 2005-06-10 Umkonfigurierbare luftströmungs-lenkeinrichtung für ein modular-flügel-chassis

Country Status (9)

Country Link
US (1) US7259961B2 (de)
EP (1) EP1782161B1 (de)
JP (1) JP2008501200A (de)
KR (1) KR20070024637A (de)
CN (1) CN1973252A (de)
AT (1) ATE486312T1 (de)
DE (1) DE602005024409D1 (de)
TW (1) TWI278575B (de)
WO (1) WO2006011965A1 (de)

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7259961B2 (en) 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US20060004837A1 (en) * 2004-06-30 2006-01-05 Genovker Victoria V Advanced switching peer-to-peer protocol
US7652891B2 (en) * 2004-12-06 2010-01-26 Radisys Corporation Airflow control system
JP2007011931A (ja) * 2005-07-04 2007-01-18 Hitachi Ltd 記憶制御装置
JP2007047998A (ja) * 2005-08-09 2007-02-22 Sony Corp 電子部品冷却構造及び情報処理装置
US8189599B2 (en) * 2005-08-23 2012-05-29 Rpx Corporation Omni-protocol engine for reconfigurable bit-stream processing in high-speed networks
JP4680726B2 (ja) * 2005-08-31 2011-05-11 本田技研工業株式会社 小型車両の防風装置
US7804685B2 (en) 2005-09-19 2010-09-28 Chatsworth Products, Inc. Ducted exhaust equipment enclosure
US11212928B2 (en) 2005-09-19 2021-12-28 Chatsworth Products, Inc. Vertical exhaust duct for electronic equipment enclosure
US7542287B2 (en) * 2005-09-19 2009-06-02 Chatsworth Products, Inc. Air diverter for directing air upwardly in an equipment enclosure
US8107238B2 (en) 2005-09-19 2012-01-31 Chatsworth Products, Inc. Ducted exhaust equipment enclosure
US11259446B2 (en) 2005-09-19 2022-02-22 Chatsworth Products, Inc. Vertical exhaust duct for electronic equipment enclosure
US7420806B1 (en) * 2005-11-22 2008-09-02 Juniper Networks, Inc. Airflow distribution through an electronic device
US7430117B2 (en) * 2005-12-14 2008-09-30 Flextronics Ap, Llc Airflow system for electronics chassis
US20070171610A1 (en) * 2006-01-20 2007-07-26 Chatsworth Products, Inc. Internal air duct
US8257155B2 (en) * 2006-01-20 2012-09-04 Chatsworth Products, Inc. Selectively routing air within an electronic equipment enclosure
US7827442B2 (en) 2006-01-23 2010-11-02 Slt Logic Llc Shelf management controller with hardware/software implemented dual redundant configuration
CN101427616B (zh) * 2006-03-20 2012-05-30 弗莱克斯电子有限责任公司 增加用于电子机箱的空气入口/出口的尺寸
US7821790B2 (en) * 2006-03-24 2010-10-26 Slt Logic, Llc Modular chassis providing scalable mechanical, electrical and environmental functionality for MicroTCA and Advanced TCA boards
US7355850B2 (en) * 2006-03-31 2008-04-08 National Instruments Corporation Vented and ducted sub-rack support member
DE102006018709B3 (de) * 2006-04-20 2007-10-11 Nft Nanofiltertechnik Gmbh Wärmetauscher
US7701714B2 (en) * 2006-05-26 2010-04-20 Flextronics Ap, Llc Liquid-air hybrid cooling in electronics equipment
WO2008003038A2 (en) * 2006-06-29 2008-01-03 Se2 Labs Systems and methods for improved cooling of lelectrical components
US7508664B2 (en) * 2006-07-28 2009-03-24 International Business Machines Corporation Mechanical assembly to support orthogonal airflow devices in a normal airflow slot of a server chassis
US20080024985A1 (en) * 2006-07-31 2008-01-31 Zong-Jui Lee Computer casing with high heat dissipation efficiency
US7394654B2 (en) * 2006-10-19 2008-07-01 Cisco Technology, Inc. Method and apparatus for providing thermal management in an electronic device
US7515411B2 (en) * 2007-02-09 2009-04-07 Lsi Corporation Multi-fan airflow regulation for fan fail conditions
WO2008103927A2 (en) * 2007-02-22 2008-08-28 Tellabs Operations, Inc. Apparatus and method for configuring a dual rack-mountable chassis
US20090036049A1 (en) * 2007-07-30 2009-02-05 Lodhia Ashwin V Chassis having bottom and rear-provided air vents to enable airflow through the chassis
US20090061755A1 (en) * 2007-08-28 2009-03-05 Panduit Corp. Intake Duct
CN101377705B (zh) * 2007-08-30 2012-08-29 鸿富锦精密工业（深圳）有限公司 电脑
US20090109619A1 (en) * 2007-10-25 2009-04-30 Motorola, Inc. Method apparatus for cooling system having an s-shaped air flow path for use in a chassis
US7751186B2 (en) * 2007-10-29 2010-07-06 Dell Products L.P. Chassis having a bypass channel for air flow
US7907402B2 (en) * 2007-11-09 2011-03-15 Panduit Corp. Cooling system
WO2009103090A2 (en) 2008-02-14 2009-08-20 Chatsworth Products, Inc. Air directing device
US8175753B2 (en) * 2008-02-15 2012-05-08 The Pnc Financial Services Group, Inc. Systems and methods for computer equipment management
US20090260795A1 (en) * 2008-04-16 2009-10-22 Perazzo Thomas M Active door array for cooling system
US7486511B1 (en) 2008-06-04 2009-02-03 International Business Machines Corporation Passive rear door for controlled hot air exhaust
US7715182B2 (en) * 2008-07-03 2010-05-11 Lsi Corporation Drive box
FR2934906B1 (fr) * 2008-08-05 2010-09-03 Thales Sa Calculateur embarque equipe d'un dispositif de refroidissement aeraulique autonome
US7633754B1 (en) * 2008-08-27 2009-12-15 Ciena Corporation Air cooling system for an electronics rack
US7675750B1 (en) * 2008-08-29 2010-03-09 Qlogic, Corporation Apparatus and methods for cooling networks switches
US7646602B1 (en) 2008-08-29 2010-01-12 Qlogic, Corporation Apparatus and methods for cooling network switches
US10321601B2 (en) * 2008-10-17 2019-06-11 Artesyn Embedded Computing, Inc. System and method for restricting airflow through a portion of an electronics enclosure
US8482917B2 (en) * 2008-11-05 2013-07-09 Arista Networks, Inc. Network switch cooling system
GB2464839B (en) * 2008-12-03 2012-11-28 Ibm Controllable air inlet duct for server racks
US20100159816A1 (en) * 2008-12-23 2010-06-24 International Business Machines Corporation Converging segments cooling
EP2205054A1 (de) * 2009-01-05 2010-07-07 Chatsworth Product, INC. Gehäuse für elektronisches Gerät mit System zur Steuerung des Luftstroms von einer Seite zur anderen Seite
US20110228475A1 (en) * 2010-03-17 2011-09-22 International Business Machines Corporation Enclosure with concurrently maintainable field replaceable units
CN102238850A (zh) * 2010-04-29 2011-11-09 鸿富锦精密工业（深圳）有限公司 服务器组合
US8653363B2 (en) 2010-06-01 2014-02-18 Chatsworth Products, Inc. Magnetic filler panel for use in airflow control system in electronic equipment enclosure
JP5829010B2 (ja) * 2010-06-24 2015-12-09 富士通株式会社 筐体装置の冷却構造
US8446725B2 (en) * 2010-08-05 2013-05-21 Alcatel Lucent Airflow control in an electronic chassis
US8400765B2 (en) * 2010-09-20 2013-03-19 Amazon Technologies, Inc. System with air flow under data storage devices
JP5725039B2 (ja) 2010-12-28 2015-05-27 富士通株式会社 冷却ユニット，電子機器及び案内部材
WO2013000119A1 (en) * 2011-06-28 2013-01-03 Telefonaktiebolaget L M Ericsson (Publ) Electronic device with heat-dissipating structure
TW201309179A (zh) * 2011-08-04 2013-02-16 Wistron Corp 流阻調節裝置及刀鋒伺服器
US8780551B2 (en) * 2011-12-21 2014-07-15 Brocade Communications Systems, Inc. Blade and air deflector in a plenum
US9408330B2 (en) * 2012-04-18 2016-08-02 International Business Machines Coporation Apparatus to cool a computing device
US9839155B2 (en) 2012-05-16 2017-12-05 Panduit Corp. Thermal ducting system
TW201408179A (zh) * 2012-08-01 2014-02-16 Hon Hai Prec Ind Co Ltd 導風件及具有該導風件的電子裝置
US20140073234A1 (en) * 2012-09-11 2014-03-13 International Business Machines Corporation Chassis with an airflow adjustment
US9204576B2 (en) * 2012-09-14 2015-12-01 Cisco Technolgy, Inc. Apparatus, system, and method for configuring a system of electronic chassis
CN103717033A (zh) * 2012-09-29 2014-04-09 华为技术有限公司 一种机箱，及温控设备
TW201442610A (zh) * 2013-04-30 2014-11-01 Hon Hai Prec Ind Co Ltd 機箱
US9203782B2 (en) 2013-11-20 2015-12-01 Ciena Corporation High density networking shelf and system
DE102014201483B4 (de) * 2014-01-28 2016-04-07 Wago Verwaltungsgesellschaft Mbh Quaderförmiges Gehäuse für ein Elektronikmodul, Elektronikmodul und Anordnung zur Kühlung wenigstens eines Elektronikmoduls
US9788461B2 (en) * 2014-07-30 2017-10-10 Ciena Corporation Airflow divider for balancing airflow in a modular chassis system
EP3048545B1 (de) * 2015-01-23 2024-09-25 Tata Consultancy Services Limited System und verfahren zur ermöglichung homogenisierter verteilung eines luftstroms in einem datenzentrum
CN104754894B (zh) * 2015-04-09 2018-05-04 北京百度网讯科技有限公司 服务器机柜
WO2016167805A1 (en) 2015-04-17 2016-10-20 Hewlett-Packard Development Company, L.P. Shell ductings for cool air delivery
US9603289B1 (en) 2016-01-14 2017-03-21 Ciena Corporation Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages
US10212846B2 (en) * 2016-05-12 2019-02-19 Facebook, Inc. Data storage server drawer
FR3062771B1 (fr) * 2017-02-08 2019-04-05 Alstom Transport Technologies Module electronique refroidi par convection forcee avec grille de distribution du flux d'air
JP6769356B2 (ja) * 2017-03-13 2020-10-14 富士通株式会社 情報処理装置
US11019753B2 (en) 2017-06-27 2021-05-25 Microsoft Technology Licensing, Llc Cooling electronic devices within a data center
US10219405B2 (en) * 2017-07-10 2019-02-26 National Instruments Corporation Airflow straightener in an electronics chassis
USD865755S1 (en) * 2018-01-12 2019-11-05 Guohui Yang Computer main processor box
US20190357390A1 (en) * 2018-05-18 2019-11-21 Nokia Solutions And Networks Oy Fan apparatuses for chassis airflow
US11212945B2 (en) 2019-05-31 2021-12-28 Hewlett Packard Enterprise Development Lp System airflow variable configuration
US10952353B1 (en) * 2019-08-21 2021-03-16 Schneider Electric It Corporation Thermal buffering module for equipment rack
US11980009B2 (en) 2019-10-15 2024-05-07 Ciena Corporation Liquid cooling high-density pluggable modules for a network element
US11112573B2 (en) 2019-11-01 2021-09-07 Ciena Corporation Cooling multiple high-density network pluggable optical modules using a shared heat exchanger
US11184995B2 (en) 2019-11-01 2021-11-23 Ciena Corporation High-density network element cooling via unequipped pluggable optical module cages
US11659692B2 (en) * 2019-12-20 2023-05-23 Microsoft Technology Licensing, Llc Rack assembly for vertical airflow cooled devices
CN113163635A (zh) * 2020-01-23 2021-07-23 华为技术有限公司 一种电子设备外罩及电子设备组件
US11735455B2 (en) * 2021-03-12 2023-08-22 Taiwan Semiconductor Manufacturing Company, Ltd. Systems, devices, and methods for air flow optimization including adjacent a FOUP

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2894728A (en) * 1957-02-06 1959-07-14 Trane Co Multi-zone air conditioning unit
US3387648A (en) * 1967-02-23 1968-06-11 Navy Usa Cabinet enclosed recirculation cooling system carried on extensible chassis mountingelectronic modules
US3592260A (en) * 1969-12-05 1971-07-13 Espey Mfg & Electronics Corp Heat exchanger with inner guide strip
US3874444A (en) * 1973-12-03 1975-04-01 Gte Automatic Electric Lab Inc Duo-baffle air separator apparatus
US3917370A (en) 1974-08-29 1975-11-04 Amp Inc Interconnect device for use in closed fluid circulating systems
DE2651015C2 (de) 1976-11-09 1980-09-04 Honeywell-Elac-Nautik Gmbh, 2300 Kiel Chassis für einen elektrischen Leistungsverstärker
US4261519A (en) * 1978-12-20 1981-04-14 Honeywell Information Systems Inc. Air distribution system
JPS57186091U (de) * 1981-05-19 1982-11-26
US4648007A (en) * 1985-10-28 1987-03-03 Gte Communications Systems Corporation Cooling module for electronic equipment
JPH0770853B2 (ja) * 1987-01-21 1995-07-31 株式会社日立製作所 電子装置の冷却装置
JPH0737359Y2 (ja) * 1989-10-20 1995-08-23 富士通株式会社 電子機器の冷却構造
JPH04252098A (ja) * 1991-01-28 1992-09-08 Fujitsu Ltd 電子機器の冷却構造
US5202816A (en) 1991-05-20 1993-04-13 Dewilde Mark A High density circuit board chassis cooling system
DE4211759C2 (de) 1992-04-08 1997-04-03 Schroff Gmbh Lüftereinschub
FR2699422B1 (fr) 1992-12-17 1997-01-10 Transrack Sa Caisson de ventilation pour armoires electriques ou electroniques.
US5676199A (en) 1993-07-23 1997-10-14 Lee; Richard M. L. Thermostat controlled cooler for a CPU
JP3246834B2 (ja) * 1994-07-20 2002-01-15 株式会社東芝 電子機器の筐体構造
JPH09167896A (ja) * 1995-12-15 1997-06-24 Mitsubishi Electric Corp 電子部品収容装置および電子部品収容装置の冷却方法
US6011688A (en) 1997-06-04 2000-01-04 Hewlett Packard Co. Compact apparatus for cooling a plurality of circuit packs arranged with a cage
US6042474A (en) * 1997-06-04 2000-03-28 Lsi Logic Corporation Compact ventilation unit with exhaust ports for electronic apparatus
JP4080593B2 (ja) 1998-05-11 2008-04-23 浜松ホトニクス株式会社 光センサ
US6381147B1 (en) * 1998-05-15 2002-04-30 Hybricon Corporation Card guide including air deflector means
US5995368A (en) * 1998-10-20 1999-11-30 Nortel Networks Corporation Air flow distribution device for shelf-based circuit cards
US6289678B1 (en) 1998-12-03 2001-09-18 Phoenix Group, Inc. Environmental system for rugged disk drive
US6094919A (en) 1999-01-04 2000-08-01 Intel Corporation Package with integrated thermoelectric module for cooling of integrated circuits
US6185109B1 (en) * 1999-02-26 2001-02-06 3Com Corporation Electronic chassis apparatus and method
US6326597B1 (en) 1999-04-15 2001-12-04 Applied Materials, Inc. Temperature control system for process chamber
JP4174919B2 (ja) * 1999-07-07 2008-11-05 ソニー株式会社 ファン装置付き電気機器
JP2001257495A (ja) * 2000-03-10 2001-09-21 Oki Electric Ind Co Ltd 筐体の冷却構造
US6252770B1 (en) * 2000-08-02 2001-06-26 Ming-Chuan Yu Electronic apparatus cooling device
US6512672B1 (en) * 2000-12-29 2003-01-28 Cisco Technology, Inc. Modular air flow distribution system
US6882533B2 (en) 2001-02-22 2005-04-19 Hewlett-Packard Development Company, L.P. Thermal connector for cooling electronics
US6616469B2 (en) 2001-03-12 2003-09-09 Tyco Electronics Logistics Ag Electrical and fluid interconnect
US6506111B2 (en) * 2001-05-16 2003-01-14 Sanmina-Sci Corporation Cooling airflow distribution device
US6646879B2 (en) 2001-05-16 2003-11-11 Cray Inc. Spray evaporative cooling system and method
US6646878B2 (en) 2001-07-16 2003-11-11 I-Bus Corporation Fail safe cooling system
US20030062150A1 (en) 2001-09-25 2003-04-03 Melissa Sweitzer Temperature/strain control of fatigue vulnerable devices used in electronic circuits
CA2358019A1 (en) * 2001-09-27 2003-03-27 Alcatel Canada Inc. System and method for configuring a network element
JP4085649B2 (ja) * 2002-02-25 2008-05-14 日本電気株式会社 電子装置の結露防止構造及び結露防止方法
US20040008483A1 (en) 2002-07-13 2004-01-15 Kioan Cheon Water cooling type cooling system for electronic device
US6807056B2 (en) 2002-09-24 2004-10-19 Hitachi, Ltd. Electronic equipment
US6754076B2 (en) 2002-10-30 2004-06-22 International Business Machines Corporation Stackable liquid cooling pump
TW586653U (en) * 2003-04-18 2004-05-01 Delta Electronics Inc Heat dissipation module with twin centrifugal fans
US7097495B2 (en) 2003-07-14 2006-08-29 Tribotek, Inc. System and methods for connecting electrical components
US6912131B2 (en) * 2003-08-27 2005-06-28 Lucent Technologies Inc. Electronic components card air deflector
US6880345B1 (en) 2003-11-04 2005-04-19 Intel Corporation Cooling system for an electronic component
JP2005228237A (ja) 2004-02-16 2005-08-25 Hitachi Ltd 液冷システム及びそれを備えた電子機器
US8430156B2 (en) 2004-04-29 2013-04-30 Hewlett-Packard Development Company, L.P. Liquid loop with multiple pump assembly
US20050241803A1 (en) 2004-04-29 2005-11-03 Hewlett-Packard Development Company, L.P. Liquid cooling loop using tubing and bellows for stress isolation and tolerance variation
US7259961B2 (en) 2004-06-24 2007-08-21 Intel Corporation Reconfigurable airflow director for modular blade chassis
US6935868B1 (en) 2004-06-29 2005-08-30 Intel Corporation Adjustable-width, dual-connector card module

Also Published As

Publication number Publication date
TW200604444A (en) 2006-02-01
TWI278575B (en) 2007-04-11
KR20070024637A (ko) 2007-03-02
WO2006011965A1 (en) 2006-02-02
EP1782161B1 (de) 2010-10-27
JP2008501200A (ja) 2008-01-17
US7259961B2 (en) 2007-08-21
US20050286222A1 (en) 2005-12-29
ATE486312T1 (de) 2010-11-15
CN1973252A (zh) 2007-05-30
EP1782161A1 (de) 2007-05-09

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