DE602005022329D1 - Sprühkühlsystem für querdünnfilmverdunstungssprühkühlung - Google Patents

Sprühkühlsystem für querdünnfilmverdunstungssprühkühlung

Info

Publication number
DE602005022329D1
DE602005022329D1 DE602005022329T DE602005022329T DE602005022329D1 DE 602005022329 D1 DE602005022329 D1 DE 602005022329D1 DE 602005022329 T DE602005022329 T DE 602005022329T DE 602005022329 T DE602005022329 T DE 602005022329T DE 602005022329 D1 DE602005022329 D1 DE 602005022329D1
Authority
DE
Germany
Prior art keywords
cooling
spray cooling
conduit
cross
spray
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005022329T
Other languages
English (en)
Inventor
Charles L Tilton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isothermal Systems Research Inc
Original Assignee
Isothermal Systems Research Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isothermal Systems Research Inc filed Critical Isothermal Systems Research Inc
Publication of DE602005022329D1 publication Critical patent/DE602005022329D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H01L23/4735—Jet impingement
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2339/00—Details of evaporators; Details of condensers
    • F25B2339/02—Details of evaporators
    • F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat Treatment Of Strip Materials And Filament Materials (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Sorption Type Refrigeration Machines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE602005022329T 2004-08-05 2005-08-05 Sprühkühlsystem für querdünnfilmverdunstungssprühkühlung Active DE602005022329D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/913,299 US7104078B2 (en) 2004-08-05 2004-08-05 Spray cooling system for transverse thin-film evaporative spray cooling
PCT/US2005/028077 WO2006017817A2 (en) 2004-08-05 2005-08-05 Spray cooling system for transverse thin-film evaporative spray cooling

Publications (1)

Publication Number Publication Date
DE602005022329D1 true DE602005022329D1 (de) 2010-08-26

Family

ID=35756049

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005022329T Active DE602005022329D1 (de) 2004-08-05 2005-08-05 Sprühkühlsystem für querdünnfilmverdunstungssprühkühlung

Country Status (7)

Country Link
US (1) US7104078B2 (de)
EP (1) EP1794527B1 (de)
JP (1) JP2008509563A (de)
AT (1) ATE474197T1 (de)
CA (1) CA2576002A1 (de)
DE (1) DE602005022329D1 (de)
WO (1) WO2006017817A2 (de)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7392660B2 (en) * 2004-08-05 2008-07-01 Isothermal Systems Research, Inc. Spray cooling system for narrow gap transverse evaporative spray cooling
US7901191B1 (en) 2005-04-07 2011-03-08 Parker Hannifan Corporation Enclosure with fluid inducement chamber
FR2886509B1 (fr) * 2005-05-24 2007-09-14 Thales Sa Dispositif electronique modulaire fonctionnant dans des environnements severes
US7450386B2 (en) * 2005-07-30 2008-11-11 Articchoke Enterprises Llc Phase-separated evaporator, blade-thru condenser and heat dissipation system thereof
US7495914B2 (en) * 2006-02-06 2009-02-24 Isothermal Systems Research, Inc. Narrow gap spray cooling in a globally cooled enclosure
US8174828B2 (en) * 2006-02-06 2012-05-08 Parker-Hannifin Corporation Narrow gap spray cooling in a globally cooled enclosure
US7602608B2 (en) * 2006-02-06 2009-10-13 Isothermal Systems Research, Inc. Narrow gap spray cooling in a globally cooled enclosure
US7477513B1 (en) 2006-12-29 2009-01-13 Isothermal Systems Research, Inc. Dual sided board thermal management system
FR2911247B1 (fr) * 2007-01-08 2009-02-27 Sames Technologies Soc Par Act Carte electronique et plaque froide pour cette carte.
WO2008127644A1 (en) * 2007-04-13 2008-10-23 Xcelaero Corporation Evaporative cooling system for electronic components
JP4625851B2 (ja) * 2008-04-28 2011-02-02 株式会社日立製作所 冷却システム及びそれを備えた電子機器
JP2010027700A (ja) * 2008-07-16 2010-02-04 Panasonic Corp サーバ装置
US7944694B2 (en) 2008-10-23 2011-05-17 International Business Machines Corporation Liquid cooling apparatus and method for cooling blades of an electronic system chassis
US7885070B2 (en) * 2008-10-23 2011-02-08 International Business Machines Corporation Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
US7983040B2 (en) 2008-10-23 2011-07-19 International Business Machines Corporation Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
US7916483B2 (en) 2008-10-23 2011-03-29 International Business Machines Corporation Open flow cold plate for liquid cooled electronic packages
US7961475B2 (en) 2008-10-23 2011-06-14 International Business Machines Corporation Apparatus and method for facilitating immersion-cooling of an electronic subsystem
US8351206B2 (en) 2010-06-29 2013-01-08 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit
US8369091B2 (en) 2010-06-29 2013-02-05 International Business Machines Corporation Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8179677B2 (en) 2010-06-29 2012-05-15 International Business Machines Corporation Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack
US8184436B2 (en) 2010-06-29 2012-05-22 International Business Machines Corporation Liquid-cooled electronics rack with immersion-cooled electronic subsystems
US8345423B2 (en) 2010-06-29 2013-01-01 International Business Machines Corporation Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems
CN102322751B (zh) * 2011-09-01 2013-09-25 东南大学 用于高热流热源冷却的喷雾冷却装置
WO2017170153A1 (ja) * 2016-03-31 2017-10-05 日本電気株式会社 相変化冷却器、及び電子機器
US10798851B1 (en) 2019-05-24 2020-10-06 L3 Technologies, Inc. Systems and methods for implementing intelligent cooling interface archiectures for cooling systems
US11963337B2 (en) * 2022-03-22 2024-04-16 Baidu Usa Llc Contactless device and chip thermal management plate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2906103A (en) * 1957-06-10 1959-09-29 Alvin R Saltzman Chassis design for inert carrier gasliquid thermal diffusion cooling system
JPH05136305A (ja) * 1991-11-08 1993-06-01 Hitachi Ltd 発熱体の冷却装置
US5907473A (en) 1997-04-04 1999-05-25 Raytheon Company Environmentally isolated enclosure for electronic components
JPH11148733A (ja) * 1997-11-17 1999-06-02 Denso Corp 冷凍サイクル用エジェクタ
US6108201A (en) * 1999-02-22 2000-08-22 Tilton; Charles L Fluid control apparatus and method for spray cooling
US6205799B1 (en) * 1999-09-13 2001-03-27 Hewlett-Packard Company Spray cooling system
US6292364B1 (en) * 2000-04-28 2001-09-18 Raytheon Company Liquid spray cooled module
US6595014B2 (en) * 2001-02-22 2003-07-22 Hewlett-Packard Development Company, L.P. Spray cooling system with cooling regime detection
US6571569B1 (en) * 2001-04-26 2003-06-03 Rini Technologies, Inc. Method and apparatus for high heat flux heat transfer
US6498725B2 (en) * 2001-05-01 2002-12-24 Mainstream Engineering Corporation Method and two-phase spray cooling apparatus
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6955062B2 (en) * 2002-03-11 2005-10-18 Isothermal Systems Research, Inc. Spray cooling system for transverse thin-film evaporative spray cooling
US6857283B2 (en) * 2002-09-13 2005-02-22 Isothermal Systems Research, Inc. Semiconductor burn-in thermal management system
TW551029B (en) * 2002-12-31 2003-09-01 Mitac Technology Corp Controlling device and method to proceed cooling onto the object requiring heat dissipation by coolant
US6955063B2 (en) * 2003-06-14 2005-10-18 Nanomist Systems, Llc Cooling of electronics and high density power dissipation systems by fine-mist flooding

Also Published As

Publication number Publication date
CA2576002A1 (en) 2006-02-16
ATE474197T1 (de) 2010-07-15
US20060026970A1 (en) 2006-02-09
WO2006017817A2 (en) 2006-02-16
EP1794527B1 (de) 2010-07-14
EP1794527A2 (de) 2007-06-13
JP2008509563A (ja) 2008-03-27
WO2006017817A3 (en) 2006-09-14
EP1794527A4 (de) 2007-12-12
US7104078B2 (en) 2006-09-12

Similar Documents

Publication Publication Date Title
DE602005022329D1 (de) Sprühkühlsystem für querdünnfilmverdunstungssprühkühlung
WO2007030411A3 (en) Spray cooling system for narrow gap transverse evaporative spray cooling
TW200630026A (en) Liquid cooling system
BRPI0810937A2 (pt) "reformador de vapor alta e termicamente integrado e combinado para a produção de hidrogênio a partir de uma fonte de combustível e uma montagem de reformador de vapor/câmara de combustão para uso em um sistema de processamento de combustível"
TW200625406A (en) Photoresist coating solution supply system and method for supplying photoresist coating solution using thereof, and photoresist coating system using thereof
UA89942C2 (ru) Интегрированный агрегат для нагревательных установок и способ подачи тепла в установку для нагревания
JP2017510453A5 (de)
TW200739727A (en) Semiconductor processing system and vaporizer
WO2011136974A3 (en) Process chambers having shared resources and methods of use thereof
MY163477A (en) Pyrimidinyl-pyridazinone derivatives
MX362280B (es) Modulo de bomba, modulo base de bomba y sistema de bomba.
TR200905002T1 (tr) Su arıtımı için aparat ve proses.
MX2009008820A (es) Sistema y metodo de regulacion y distribucion de flujo de fluido de enfriamiento.
BRPI0513758A (pt) sistema para produção de ar de processo
ATE531497T1 (de) Kühlmittelverteilung zur werkzeugkühlung
TW200717686A (en) Apparatus and method for treating substrate
RU2011109926A (ru) Компьютерная сигнальная система воздушного судна, содержащая несколько сигнальных компьютерных блоков
DK2195586T3 (da) Kollektor
DK1577617T3 (da) Væskefordampningssystem
ATE489246T1 (de) Vorrichtung zur kühlung von elektronikbautteilen
EA200801688A1 (ru) Устройство и способ для охлаждения раствора
TW200743248A (en) Fuel cell system incorporating humidifying apparatus into un-reacted gas outlet piping of fuel cell
GB2518045A (en) Method and system for processing a stream comprising glycol based and kinetic hydrate inhibitors
EP2164689B8 (de) Luftquellenvorrichtung
GB0410850D0 (en) Cooling