DE602005021938D1 - Verfahren zum Verspannen einer Dünnschichtstruktur - Google Patents
Verfahren zum Verspannen einer DünnschichtstrukturInfo
- Publication number
- DE602005021938D1 DE602005021938D1 DE602005021938T DE602005021938T DE602005021938D1 DE 602005021938 D1 DE602005021938 D1 DE 602005021938D1 DE 602005021938 T DE602005021938 T DE 602005021938T DE 602005021938 T DE602005021938 T DE 602005021938T DE 602005021938 D1 DE602005021938 D1 DE 602005021938D1
- Authority
- DE
- Germany
- Prior art keywords
- bracing
- thin
- film structure
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7849—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being provided under the channel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/66772—Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76275—Vertical isolation by bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76289—Lateral isolation by air gap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78651—Silicon transistors
- H01L29/78654—Monocrystalline silicon transistors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0451440A FR2872626B1 (fr) | 2004-07-05 | 2004-07-05 | Procede pour contraindre un motif mince |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602005021938D1 true DE602005021938D1 (de) | 2010-08-05 |
Family
ID=34948366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005021938T Active DE602005021938D1 (de) | 2004-07-05 | 2005-07-04 | Verfahren zum Verspannen einer Dünnschichtstruktur |
Country Status (4)
Country | Link |
---|---|
US (1) | US8343780B2 (de) |
EP (1) | EP1615271B1 (de) |
DE (1) | DE602005021938D1 (de) |
FR (1) | FR2872626B1 (de) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2934085B1 (fr) * | 2008-07-21 | 2010-09-03 | Commissariat Energie Atomique | Procede pour containdre simultanement en tension et en compression les canaux de transistors nmos et pmos respectivement |
FR2974941B1 (fr) | 2011-05-06 | 2013-06-14 | Commissariat Energie Atomique | Procede de realisation de nanocristaux de |
FR2974940B1 (fr) | 2011-05-06 | 2015-11-13 | Commissariat Energie Atomique | Procede de realisation de nanocristaux de semi-conducteur orientes selon une direction pre-definie |
FR2986369B1 (fr) | 2012-01-30 | 2016-12-02 | Commissariat Energie Atomique | Procede pour contraindre un motif mince et procede de fabrication de transistor integrant ledit procede |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532510A (en) * | 1994-12-30 | 1996-07-02 | At&T Corp. | Reverse side etching for producing layers with strain variation |
US6583015B2 (en) * | 2000-08-07 | 2003-06-24 | Amberwave Systems Corporation | Gate technology for strained surface channel and strained buried channel MOSFET devices |
US6563152B2 (en) * | 2000-12-29 | 2003-05-13 | Intel Corporation | Technique to obtain high mobility channels in MOS transistors by forming a strain layer on an underside of a channel |
JP2002237590A (ja) * | 2001-02-09 | 2002-08-23 | Univ Tohoku | Mos型電界効果トランジスタ |
US6621131B2 (en) * | 2001-11-01 | 2003-09-16 | Intel Corporation | Semiconductor transistor having a stressed channel |
JP2003197906A (ja) * | 2001-12-28 | 2003-07-11 | Fujitsu Ltd | 半導体装置および相補型半導体装置 |
US6492216B1 (en) * | 2002-02-07 | 2002-12-10 | Taiwan Semiconductor Manufacturing Company | Method of forming a transistor with a strained channel |
FR2838237B1 (fr) * | 2002-04-03 | 2005-02-25 | St Microelectronics Sa | Procede de fabrication d'un transistor a effet de champ a grille isolee a canal contraint et circuit integre comprenant un tel transistor |
US6841001B2 (en) * | 2002-07-19 | 2005-01-11 | Cree, Inc. | Strain compensated semiconductor structures and methods of fabricating strain compensated semiconductor structures |
WO2004081982A2 (en) * | 2003-03-07 | 2004-09-23 | Amberwave Systems Corporation | Shallow trench isolation process |
US6924182B1 (en) * | 2003-08-15 | 2005-08-02 | Advanced Micro Devices, Inc. | Strained silicon MOSFET having reduced leakage and method of its formation |
US7019326B2 (en) * | 2003-11-14 | 2006-03-28 | Intel Corporation | Transistor with strain-inducing structure in channel |
US7791107B2 (en) * | 2004-06-16 | 2010-09-07 | Massachusetts Institute Of Technology | Strained tri-channel layer for semiconductor-based electronic devices |
US7495266B2 (en) * | 2004-06-16 | 2009-02-24 | Massachusetts Institute Of Technology | Strained silicon-on-silicon by wafer bonding and layer transfer |
US7316960B2 (en) * | 2004-07-13 | 2008-01-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Strain enhanced ultra shallow junction formation |
US7102201B2 (en) * | 2004-07-15 | 2006-09-05 | International Business Machines Corporation | Strained semiconductor device structures |
US7384829B2 (en) * | 2004-07-23 | 2008-06-10 | International Business Machines Corporation | Patterned strained semiconductor substrate and device |
US7306997B2 (en) * | 2004-11-10 | 2007-12-11 | Advanced Micro Devices, Inc. | Strained fully depleted silicon on insulator semiconductor device and manufacturing method therefor |
US7326601B2 (en) * | 2005-09-26 | 2008-02-05 | Advanced Micro Devices, Inc. | Methods for fabrication of a stressed MOS device |
-
2004
- 2004-07-05 FR FR0451440A patent/FR2872626B1/fr not_active Expired - Fee Related
-
2005
- 2005-07-04 EP EP05106047A patent/EP1615271B1/de not_active Expired - Fee Related
- 2005-07-04 DE DE602005021938T patent/DE602005021938D1/de active Active
- 2005-07-05 US US11/172,945 patent/US8343780B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US8343780B2 (en) | 2013-01-01 |
US20060091105A1 (en) | 2006-05-04 |
EP1615271A1 (de) | 2006-01-11 |
FR2872626A1 (fr) | 2006-01-06 |
FR2872626B1 (fr) | 2008-05-02 |
EP1615271B1 (de) | 2010-06-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE602006004097D1 (de) | Verfahren zum Konfigurieren eines lokalen Positionierungssystems | |
DE602006003149D1 (de) | Verfahren zum Zusammenbau einer Turbomaschine | |
DE602006004915D1 (de) | Verfahren zum Herstellen einer Wabenkörperstruktur | |
ATE375448T1 (de) | Verfahren zum betreiben einer windenergieanlage | |
DE602005014378D1 (de) | Verfahren und einrichtung zum erzeugen einer terahertzwelle | |
DE602005024119D1 (de) | Verfahren zum allergennachweis | |
ATE545479T1 (de) | Verfahren zum fügen von teilen in einer fertigungsanlage | |
DE602007001582D1 (de) | Verfahren zum Einsetzen einer hydroelektrischen Turbine | |
DE602006018537D1 (de) | Verfahren zum herstellen einer transportpalette | |
DE602005027019D1 (de) | Verfahren und System zum Melden einer geänderten Telefonnummer | |
DE112005001506A5 (de) | Verfahren zum Abtasten einer Oberfläche | |
DE602005007431D1 (de) | Verfahren zum Walzen der Komponente einer hohlen Gebläseschaufel | |
DE602005015483D1 (de) | Verfahren zum kollektiven produzieren einer elementüberlagerungs-mikrostruktur | |
DE502006003971D1 (de) | Clipmaschine und Verfahren zum Einrichten einer Clipmaschine | |
DE602005004187D1 (de) | Verfahren zum Entfernen keilringgesicherter Schraubenbolzen | |
DE112004002902A5 (de) | Verfahren zum Herstellen eines Metalls | |
DE10391407D2 (de) | Verfahren zum Betreiben einer Turbine | |
DE502004000578D1 (de) | Verfahren zum Betreiben einer Pasteurisierungsanlage | |
DE502006004802D1 (de) | Verfahren zum beschichten einer zylinderlaufbuchse | |
DE602005027312D1 (de) | Verfahren zum herstellen eines piezoelektrischen elements | |
DE502004011564D1 (de) | Verfahren zum betreiben eines netzwerks | |
DE602005021938D1 (de) | Verfahren zum Verspannen einer Dünnschichtstruktur | |
DE112005001345A5 (de) | Verfahren zum Aktivieren einer Anfahrhilfe | |
DE502005000866D1 (de) | Verfahren zum verbinden von bauteilen | |
DE112007003690A5 (de) | Verfahren zum Rüsten einer Bestückvorrichtung |