DE602005017858D1 - Mikroelektromechanisches Bauteil mit integrierter Abdeckung - Google Patents

Mikroelektromechanisches Bauteil mit integrierter Abdeckung

Info

Publication number
DE602005017858D1
DE602005017858D1 DE602005017858T DE602005017858T DE602005017858D1 DE 602005017858 D1 DE602005017858 D1 DE 602005017858D1 DE 602005017858 T DE602005017858 T DE 602005017858T DE 602005017858 T DE602005017858 T DE 602005017858T DE 602005017858 D1 DE602005017858 D1 DE 602005017858D1
Authority
DE
Germany
Prior art keywords
integrated cover
microelectromechanical component
microelectromechanical
component
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005017858T
Other languages
English (en)
Inventor
Anthony M Chiu
Harry Michael Siegel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics lnc USA
Original Assignee
STMicroelectronics lnc USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics lnc USA filed Critical STMicroelectronics lnc USA
Publication of DE602005017858D1 publication Critical patent/DE602005017858D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00333—Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0136—Growing or depositing of a covering layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0163—Reinforcing a cap, e.g. with ribs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
DE602005017858T 2004-09-28 2005-09-26 Mikroelektromechanisches Bauteil mit integrierter Abdeckung Active DE602005017858D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/952,183 US7098065B2 (en) 2004-09-28 2004-09-28 Integrated lid formed on MEMS device

Publications (1)

Publication Number Publication Date
DE602005017858D1 true DE602005017858D1 (de) 2010-01-07

Family

ID=35623700

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005017858T Active DE602005017858D1 (de) 2004-09-28 2005-09-26 Mikroelektromechanisches Bauteil mit integrierter Abdeckung

Country Status (3)

Country Link
US (1) US7098065B2 (de)
EP (1) EP1640334B1 (de)
DE (1) DE602005017858D1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7585744B2 (en) * 2003-12-08 2009-09-08 Freescale Semiconductor, Inc. Method of forming a seal for a semiconductor device
JP4726927B2 (ja) * 2008-06-19 2011-07-20 株式会社日立製作所 集積化マイクロエレクトロメカニカルシステムおよびその製造方法
US8148790B2 (en) * 2008-07-08 2012-04-03 Wispry, Inc. Thin-film lid MEMS devices and methods
WO2010111601A2 (en) * 2009-03-26 2010-09-30 Semprius, Inc. Methods of forming printable integrated circuit devices and devices formed thereby
EP2697155B1 (de) 2011-04-14 2017-01-11 Robert Bosch GmbH Mems-paket oder sensorpaket mit kappeninterner elektrischer durchkontaktierung und verfahren dafür
US8648432B2 (en) * 2011-11-28 2014-02-11 Texas Instruments Deutschland Gmbh Fully embedded micromechanical device, system on chip and method for manufacturing the same
JP6331551B2 (ja) * 2014-03-25 2018-05-30 セイコーエプソン株式会社 Ｍｅｍｓデバイス
US11807520B2 (en) * 2021-06-23 2023-11-07 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and method for manufacturing thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5181156A (en) * 1992-05-14 1993-01-19 Motorola Inc. Micromachined capacitor structure and method for making
US5441597A (en) 1992-12-01 1995-08-15 Honeywell Inc. Microstructure gas valve control forming method
US5417235A (en) 1993-07-28 1995-05-23 Regents Of The University Of Michigan Integrated microvalve structures with monolithic microflow controller
DE4332843C2 (de) 1993-09-27 1997-04-24 Siemens Ag Verfahren zur Herstellung einer mikromechanischen Vorrichtung und mikromechanische Vorrichtung
DE19509868A1 (de) * 1995-03-17 1996-09-19 Siemens Ag Mikromechanisches Halbleiterbauelement
US5992233A (en) 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
DE10005555A1 (de) 2000-02-09 2001-08-16 Bosch Gmbh Robert Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
US7153717B2 (en) * 2000-05-30 2006-12-26 Ic Mechanics Inc. Encapsulation of MEMS devices using pillar-supported caps
JP4156946B2 (ja) * 2003-02-26 2008-09-24 三菱電機株式会社 加速度センサ
US7585744B2 (en) * 2003-12-08 2009-09-08 Freescale Semiconductor, Inc. Method of forming a seal for a semiconductor device

Also Published As

Publication number Publication date
EP1640334A2 (de) 2006-03-29
EP1640334A3 (de) 2006-05-17
EP1640334B1 (de) 2009-11-25
US20060065961A1 (en) 2006-03-30
US7098065B2 (en) 2006-08-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition