DE602005008096D1 - Vorrichtung zur verkapselung von elektronischen bauteilen - Google Patents

Vorrichtung zur verkapselung von elektronischen bauteilen

Info

Publication number
DE602005008096D1
DE602005008096D1 DE602005008096T DE602005008096T DE602005008096D1 DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1 DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 T DE602005008096 T DE 602005008096T DE 602005008096 D1 DE602005008096 D1 DE 602005008096D1
Authority
DE
Germany
Prior art keywords
electronic components
plastering
packing reel
secured
integrated circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005008096T
Other languages
English (en)
Inventor
Stefan Dick
Michelle Martin
Francois Dessus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sued Chemie Inc
Original Assignee
Sued Chemie Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/996,916 external-priority patent/US7335422B2/en
Application filed by Sued Chemie Inc filed Critical Sued Chemie Inc
Publication of DE602005008096D1 publication Critical patent/DE602005008096D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01012—Magnesium [Mg]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Magnetic Treatment Devices (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
DE602005008096T 2004-11-24 2005-11-01 Vorrichtung zur verkapselung von elektronischen bauteilen Active DE602005008096D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/996,916 US7335422B2 (en) 2002-04-25 2004-11-24 Absorbent polymeric material
US11/005,289 US7389877B2 (en) 2000-08-28 2004-12-06 Apparatus for packaging electronic components including a reel entrained with desiccating material
PCT/US2005/039427 WO2006057776A2 (en) 2004-11-24 2005-11-01 Apparatus for packaging electronic components

Publications (1)

Publication Number Publication Date
DE602005008096D1 true DE602005008096D1 (de) 2008-08-21

Family

ID=36498403

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005008096T Active DE602005008096D1 (de) 2004-11-24 2005-11-01 Vorrichtung zur verkapselung von elektronischen bauteilen

Country Status (6)

Country Link
US (1) US7389877B2 (de)
EP (1) EP1815729B1 (de)
AT (1) ATE400990T1 (de)
DE (1) DE602005008096D1 (de)
TW (1) TW200626445A (de)
WO (1) WO2006057776A2 (de)

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JP2002096974A (ja) * 2000-09-22 2002-04-02 Oki Electric Ind Co Ltd 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法
CA2570492A1 (en) * 2004-06-14 2005-12-29 Sports Media, Inc. Container and method of making a container
US8205766B2 (en) * 2009-05-20 2012-06-26 The Bergquist Company Method for packaging thermal interface materials
US8430264B2 (en) * 2009-05-20 2013-04-30 The Bergquist Company Method for packaging thermal interface materials
KR20210114378A (ko) 2018-10-18 2021-09-23 씨에스피 테크놀로지스, 인크. 릴 상에 건조제 혼입된 중합체를 갖는 테이프를 사용하여 전자 부품을 포장하기 위한 장치 및 방법
CN109612990B (zh) * 2018-12-14 2021-04-27 杭州家爽包装材料有限公司 一种任意设定干燥剂包指定失效点的方法及产品
US11655966B2 (en) 2019-01-14 2023-05-23 Musco Corporation Apparatus, method, and system for reducing moisture in LED lighting fixtures
MX2021008431A (es) * 2019-01-14 2021-09-08 Musco Corp Aparato, metodo y sistema para reducir la humedad en dispositivos de iluminacion led.

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US4427992A (en) * 1975-12-17 1984-01-24 Motorola, Inc. Method for incorporating a desiccant in a semiconductor package
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FR2381804A1 (fr) * 1977-02-28 1978-09-22 Solvay Compositions moulables a base de polymeres thermoplastiques et de matieres fibreuses vegetales et utilisation de ces compositions pour le calandrage et le thermoformage
US4407897A (en) * 1979-12-10 1983-10-04 American Can Company Drying agent in multi-layer polymeric structure
JPS60170270A (ja) * 1984-02-15 1985-09-03 Matsushita Electric Ind Co Ltd 太陽電池素子のパツケ−ジ構成法
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US5238648A (en) * 1992-06-03 1993-08-24 Irwin Kremen Hermetic enclosure assembly for preservational storage and/or display of otherwise degradable objects
US5390472A (en) * 1992-06-19 1995-02-21 Minnesota Mining And Manufacturing Company Carrier tape with cover strip
FR2698289B1 (fr) * 1992-11-20 1995-01-27 Airsec Ind Sa Matières déshydratantes à base de polymères.
US5401706A (en) * 1993-01-06 1995-03-28 Semco Incorporated Desiccant-coated substrate and method of manufacture
DE69411860T2 (de) * 1993-11-19 1999-02-18 Mitsubishi Gas Chemical Co., Inc., Tokio/Tokyo Sauerstoffabsorber-Einsatz für Behälterdeckel
GB9505425D0 (en) * 1995-03-17 1995-05-03 Unilever Plc Assay devices
US6174952B1 (en) * 1995-04-19 2001-01-16 Capitol Specialty Plastics, Inc. Monolithic polymer composition having a water absorption material
US6194079B1 (en) * 1995-04-19 2001-02-27 Capitol Specialty Plastics, Inc. Monolithic polymer composition having an absorbing material
US6486231B1 (en) * 1995-04-19 2002-11-26 Csp Technologies, Inc. Co-continuous interconnecting channel morphology composition
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ATE254568T1 (de) 1995-04-19 2003-12-15 Csp Technologies Inc Geschlossener behälter mit trockenmittel
US6130263A (en) * 1995-04-19 2000-10-10 Capitol Specialty Plastics, Inc. Desiccant entrained polymer
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US6124006A (en) * 1995-04-19 2000-09-26 Capitol Specialty Plastics, Inc. Modified polymers having controlled transmission rates
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US6206198B1 (en) * 1998-08-11 2001-03-27 Texas Instruments Incorporated Lightweight, high temperature packing reel for integrated circuits
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JP2000208252A (ja) 1999-01-14 2000-07-28 Tdk Corp 有機ｅｌ素子
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SE516853C2 (sv) 2000-04-28 2002-03-12 Foerpackningsinnovation Norden Transportband för lagring och transport av komponenter samt förfarande för framställning av detta
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Also Published As

Publication number Publication date
WO2006057776A3 (en) 2007-01-11
US20050098475A1 (en) 2005-05-12
ATE400990T1 (de) 2008-07-15
US7389877B2 (en) 2008-06-24
EP1815729B1 (de) 2008-07-09
TW200626445A (en) 2006-08-01
EP1815729A2 (de) 2007-08-08
WO2006057776A2 (en) 2006-06-01

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Representative=s name: WESTENDORP SOMMER, 80336 MUENCHEN