DE602005005867D1 - Maske, Belichtungsverfahren sowie Herstellungsverfahren von Halbleiterelementen - Google Patents

Maske, Belichtungsverfahren sowie Herstellungsverfahren von Halbleiterelementen

Info

Publication number
DE602005005867D1
DE602005005867D1 DE602005005867T DE602005005867T DE602005005867D1 DE 602005005867 D1 DE602005005867 D1 DE 602005005867D1 DE 602005005867 T DE602005005867 T DE 602005005867T DE 602005005867 T DE602005005867 T DE 602005005867T DE 602005005867 D1 DE602005005867 D1 DE 602005005867D1
Authority
DE
Germany
Prior art keywords
mask
manufacturing
semiconductor elements
exposure
exposure method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE602005005867T
Other languages
English (en)
Other versions
DE602005005867T2 (de
Inventor
Shigeru Moriya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE602005005867D1 publication Critical patent/DE602005005867D1/de
Application granted granted Critical
Publication of DE602005005867T2 publication Critical patent/DE602005005867T2/de
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3175—Projection methods, i.e. transfer substantially complete pattern to substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31761—Patterning strategy
    • H01J2237/31767—Step and repeat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31777—Lithography by projection
    • H01J2237/31788—Lithography by projection through mask

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE602005005867T 2004-02-04 2005-02-02 Maske, Belichtungsverfahren sowie Herstellungsverfahren von Halbleiterelementen Expired - Fee Related DE602005005867T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004028077A JP3968524B2 (ja) 2004-02-04 2004-02-04 マスク、露光方法および半導体装置の製造方法
JP2004028077 2004-02-04

Publications (2)

Publication Number Publication Date
DE602005005867D1 true DE602005005867D1 (de) 2008-05-21
DE602005005867T2 DE602005005867T2 (de) 2009-06-10

Family

ID=34675496

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005005867T Expired - Fee Related DE602005005867T2 (de) 2004-02-04 2005-02-02 Maske, Belichtungsverfahren sowie Herstellungsverfahren von Halbleiterelementen

Country Status (6)

Country Link
US (1) US7517618B2 (de)
EP (1) EP1562076B1 (de)
JP (1) JP3968524B2 (de)
KR (1) KR20060041615A (de)
DE (1) DE602005005867T2 (de)
TW (1) TWI286266B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101410999A (zh) * 2006-03-28 2009-04-15 株式会社神户制钢所 膜片结构元件及其制造方法
JP2009276600A (ja) * 2008-05-15 2009-11-26 Horon:Kk マスク転写方法
US20150146179A1 (en) * 2013-11-25 2015-05-28 Takao Utsumi Low energy electron beam lithography
JP6027150B2 (ja) 2014-06-24 2016-11-16 内海　孝雄 低エネルギー電子ビームリソグラフィ
CA3039132A1 (en) * 2018-04-03 2019-10-03 Simon Fraser University Systems and methods for rapid electron area masking (ream) lithography
US10950441B1 (en) * 2019-09-03 2021-03-16 Kyoka Utsumi Mimura Low energy e-beam contact printing lithography

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69233134T2 (de) * 1991-08-22 2004-04-15 Nikon Corp. Reproduktionsverfahren mit hoher Auflösung unter Verwendung eines dem Verfahren angepassten Maskenmusters
AU4167199A (en) * 1998-06-17 2000-01-05 Nikon Corporation Method for producing mask
JP3674573B2 (ja) 2001-06-08 2005-07-20 ソニー株式会社 マスクおよびその製造方法と半導体装置の製造方法
JP2003092250A (ja) 2001-09-18 2003-03-28 Hitachi Ltd 半導体装置及びその製造方法
JP2004014737A (ja) * 2002-06-06 2004-01-15 Renesas Technology Corp 半導体装置およびその製造方法

Also Published As

Publication number Publication date
JP3968524B2 (ja) 2007-08-29
DE602005005867T2 (de) 2009-06-10
TWI286266B (en) 2007-09-01
US7517618B2 (en) 2009-04-14
JP2005223055A (ja) 2005-08-18
TW200538870A (en) 2005-12-01
US20050170265A1 (en) 2005-08-04
EP1562076A2 (de) 2005-08-10
EP1562076B1 (de) 2008-04-09
KR20060041615A (ko) 2006-05-12
EP1562076A3 (de) 2006-05-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee