DE602005003351D1 - Flexibler scrub-ring-kontakt - Google Patents
Flexibler scrub-ring-kontaktInfo
- Publication number
- DE602005003351D1 DE602005003351D1 DE602005003351T DE602005003351T DE602005003351D1 DE 602005003351 D1 DE602005003351 D1 DE 602005003351D1 DE 602005003351 T DE602005003351 T DE 602005003351T DE 602005003351 T DE602005003351 T DE 602005003351T DE 602005003351 D1 DE602005003351 D1 DE 602005003351D1
- Authority
- DE
- Germany
- Prior art keywords
- ring contact
- flexible
- scrub ring
- flexible scrub
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H05K2201/10719—Land grid array [LGA]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/10742—Details of leads
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- H05K2201/10946—Leads attached onto leadless component after manufacturing the component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US57534804P | 2004-05-28 | 2004-05-28 | |
US57534704P | 2004-05-28 | 2004-05-28 | |
US575348P | 2004-05-28 | ||
US575347P | 2004-05-28 | ||
US61477404P | 2004-09-30 | 2004-09-30 | |
US614774P | 2004-09-30 | ||
PCT/US2005/018946 WO2005119849A1 (en) | 2004-05-28 | 2005-05-27 | Flexible scrub ring contact |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602005003351D1 true DE602005003351D1 (de) | 2007-12-27 |
DE602005003351T2 DE602005003351T2 (de) | 2008-09-11 |
Family
ID=34971402
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602005003351T Expired - Fee Related DE602005003351T2 (de) | 2004-05-28 | 2005-05-27 | Flexibler scrub-ring-kontakt |
Country Status (6)
Country | Link |
---|---|
US (1) | US7284991B2 (de) |
EP (1) | EP1749334B1 (de) |
JP (1) | JP4456149B2 (de) |
KR (1) | KR100883455B1 (de) |
DE (1) | DE602005003351T2 (de) |
WO (1) | WO2005119849A1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1766726A1 (de) | 2004-05-28 | 2007-03-28 | Molex Incorporated | Flexibles ringverbindungssystem |
JP5064205B2 (ja) * | 2007-12-27 | 2012-10-31 | タイコエレクトロニクスジャパン合同会社 | コンタクトおよびインタポーザ |
JP5360900B2 (ja) * | 2009-11-04 | 2013-12-04 | 北川工業株式会社 | 導電部品 |
DE102011003887A1 (de) * | 2011-02-09 | 2012-08-09 | Robert Bosch Gmbh | Elektrische Direktkontaktierungsanordnung für Kontaktflächen auf einer Leiterplatte |
US9512863B2 (en) * | 2012-04-26 | 2016-12-06 | California Institute Of Technology | Silicon alignment pins: an easy way to realize a wafer-to-wafer alignment |
JP6256129B2 (ja) * | 2014-03-14 | 2018-01-10 | オムロン株式会社 | 圧接端子 |
JP6684419B2 (ja) * | 2016-03-02 | 2020-04-22 | 北川工業株式会社 | コンタクト |
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US3985413A (en) * | 1973-11-26 | 1976-10-12 | Amp Incorporated | Miniature electrical connector |
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GB1536589A (en) * | 1976-05-15 | 1978-12-20 | Int Computers Ltd | Electrical connectors and to methods for making electrical connectors |
US4421370A (en) * | 1981-07-16 | 1983-12-20 | Accutest Corporation | Contact array |
US4805885A (en) * | 1982-12-21 | 1989-02-21 | Amp Incorporated | Sinuous spring |
US4927369A (en) * | 1989-02-22 | 1990-05-22 | Amp Incorporated | Electrical connector for high density usage |
US5071359A (en) * | 1990-04-27 | 1991-12-10 | Rogers Corporation | Array connector |
US5035628A (en) | 1990-05-29 | 1991-07-30 | Amp Incorporated | Electrical connector for electrically interconnecting two parallel surfaces |
US5199889A (en) * | 1991-11-12 | 1993-04-06 | Jem Tech | Leadless grid array socket |
US5214563A (en) * | 1991-12-31 | 1993-05-25 | Compaq Computer Corporation | Thermally reactive lead assembly and method for making same |
US5334804A (en) * | 1992-11-17 | 1994-08-02 | Fujitsu Limited | Wire interconnect structures for connecting an integrated circuit to a substrate |
JP3236975B2 (ja) * | 1993-05-24 | 2001-12-10 | 日本航空電子工業株式会社 | フィルム状コネクタ |
JP3415845B2 (ja) * | 1993-07-27 | 2003-06-09 | シチズン時計株式会社 | 電気的接続構造及びその電気的接続方法 |
US5971253A (en) * | 1995-07-31 | 1999-10-26 | Tessera, Inc. | Microelectronic component mounting with deformable shell terminals |
US5573435A (en) * | 1995-08-31 | 1996-11-12 | The Whitaker Corporation | Tandem loop contact for an electrical connector |
JPH10228966A (ja) * | 1997-02-12 | 1998-08-25 | Hirose Electric Co Ltd | 中間電気コネクタ |
US5879172A (en) * | 1997-04-03 | 1999-03-09 | Emulation Technology, Inc. | Surface mounted adapter using elastomeric conductors |
US6200141B1 (en) * | 1997-08-19 | 2001-03-13 | Aries Electronics, Inc. | Land grid array connector |
JP4025885B2 (ja) * | 1998-02-06 | 2007-12-26 | 協伸工業株式会社 | コネクタチップ及びテーピングコネクタチップ |
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US6019610A (en) * | 1998-11-23 | 2000-02-01 | Glatts, Iii; George F. | Elastomeric connector |
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EP1065750A3 (de) * | 1999-07-02 | 2002-01-09 | Shin-Etsu Polymer Co., Ltd. | Rohrförmiger Schaltkreisverbinder |
US6794890B1 (en) * | 1999-07-27 | 2004-09-21 | Mitsubishi Denki Kabushiki Kaisha | Test socket, method of manufacturing the test socket, test method using the test socket, and member to be tested |
EP1315244B1 (de) | 1999-10-20 | 2004-12-22 | Fci | Niedrigprofilierte Buchsen hoher Dichte und entsprechendes Herstellungsverfahren |
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US6722896B2 (en) * | 2001-03-22 | 2004-04-20 | Molex Incorporated | Stitched LGA connector |
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US6781390B2 (en) * | 2001-07-20 | 2004-08-24 | Nhk Spring Co., Ltd. | Conductive coil contact member |
TW547771U (en) * | 2002-07-23 | 2003-08-11 | Via Tech Inc | Elastic electrical contact package structure |
EP1766726A1 (de) * | 2004-05-28 | 2007-03-28 | Molex Incorporated | Flexibles ringverbindungssystem |
-
2005
- 2005-05-27 KR KR1020067024814A patent/KR100883455B1/ko not_active IP Right Cessation
- 2005-05-27 DE DE602005003351T patent/DE602005003351T2/de not_active Expired - Fee Related
- 2005-05-27 JP JP2007513492A patent/JP4456149B2/ja not_active Expired - Fee Related
- 2005-05-27 EP EP05755116A patent/EP1749334B1/de not_active Expired - Fee Related
- 2005-05-27 WO PCT/US2005/018946 patent/WO2005119849A1/en active IP Right Grant
- 2005-05-27 US US11/140,232 patent/US7284991B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1749334B1 (de) | 2007-11-14 |
US20050277309A1 (en) | 2005-12-15 |
WO2005119849A1 (en) | 2005-12-15 |
EP1749334A1 (de) | 2007-02-07 |
DE602005003351T2 (de) | 2008-09-11 |
JP2007537579A (ja) | 2007-12-20 |
KR100883455B1 (ko) | 2009-02-16 |
US7284991B2 (en) | 2007-10-23 |
JP4456149B2 (ja) | 2010-04-28 |
KR20070012725A (ko) | 2007-01-26 |
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