DE602004016648D1 - Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren - Google Patents

Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren

Info

Publication number
DE602004016648D1
DE602004016648D1 DE602004016648T DE602004016648T DE602004016648D1 DE 602004016648 D1 DE602004016648 D1 DE 602004016648D1 DE 602004016648 T DE602004016648 T DE 602004016648T DE 602004016648 T DE602004016648 T DE 602004016648T DE 602004016648 D1 DE602004016648 D1 DE 602004016648D1
Authority
DE
Germany
Prior art keywords
circuit board
identifiable information
circuit
printed circuit
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004016648T
Other languages
English (en)
Inventor
Shih-Ping Hsu
Shang-Wei Chen
Suo-Hsia Tang
Chao-Wen Shih
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Precision Technology Corp
Original Assignee
Phoenix Precision Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Precision Technology Corp filed Critical Phoenix Precision Technology Corp
Publication of DE602004016648D1 publication Critical patent/DE602004016648D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09927—Machine readable code, e.g. bar code
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
DE602004016648T 2004-07-30 2004-07-30 Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren Active DE602004016648D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04018155A EP1622431B1 (de) 2004-07-30 2004-07-30 Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren

Publications (1)

Publication Number Publication Date
DE602004016648D1 true DE602004016648D1 (de) 2008-10-30

Family

ID=34926010

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004016648T Active DE602004016648D1 (de) 2004-07-30 2004-07-30 Leiterplatte mit identifizierbaren Informationen und Herstellungsverfahren

Country Status (3)

Country Link
EP (1) EP1622431B1 (de)
AT (1) ATE408979T1 (de)
DE (1) DE602004016648D1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6208054B2 (ja) * 2014-03-10 2017-10-04 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
CN110321749B (zh) 2018-03-28 2022-05-13 奥特斯(中国)有限公司 用于部件承载件的双重编码可追踪系统
CN108811303A (zh) * 2018-06-13 2018-11-13 广州兴森快捷电路科技有限公司 封装基板及其加工方法
EP3723459A1 (de) 2019-04-10 2020-10-14 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger mit hoher passiver intermodulationsleistung (pim)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3027410A1 (de) * 1980-07-19 1982-02-18 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zur eingabe von informationen an galvanisieranlagen, sowie zugehoerige ware und vorrichtung
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
JP2000340950A (ja) * 1999-05-31 2000-12-08 Matsushita Electric Ind Co Ltd 多層回路基板における積層合致精度検査マーク構造
JP2002237669A (ja) * 2001-02-09 2002-08-23 Yamaichi Electronics Co Ltd Ｋｇｄ用サブストレートへの認識マークの形成方法
US6861764B2 (en) * 2001-06-27 2005-03-01 Shinko Electric Industries Co., Ltd. Wiring substrate having position information

Also Published As

Publication number Publication date
EP1622431B1 (de) 2008-09-17
EP1622431A1 (de) 2006-02-01
ATE408979T1 (de) 2008-10-15

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Legal Events

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8364 No opposition during term of opposition