DE602004015137D1 - Integrierter thermischer sensor für mikrowellentransistoren - Google Patents

Integrierter thermischer sensor für mikrowellentransistoren

Info

Publication number
DE602004015137D1
DE602004015137D1 DE602004015137T DE602004015137T DE602004015137D1 DE 602004015137 D1 DE602004015137 D1 DE 602004015137D1 DE 602004015137 T DE602004015137 T DE 602004015137T DE 602004015137 T DE602004015137 T DE 602004015137T DE 602004015137 D1 DE602004015137 D1 DE 602004015137D1
Authority
DE
Germany
Prior art keywords
thermal sensor
integrated thermal
microwave transistors
microwave
transistors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004015137T
Other languages
English (en)
Inventor
Michael G Adlerstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of DE602004015137D1 publication Critical patent/DE602004015137D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/18—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
    • G01K7/20—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Amplifiers (AREA)
DE602004015137T 2003-11-04 2004-11-01 Integrierter thermischer sensor für mikrowellentransistoren Active DE602004015137D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/701,045 US6991367B2 (en) 2003-11-04 2003-11-04 Integrated thermal sensor for microwave transistors
PCT/US2004/036264 WO2005045381A1 (en) 2003-11-04 2004-11-01 An integrated thermal sensor for microwave transistors

Publications (1)

Publication Number Publication Date
DE602004015137D1 true DE602004015137D1 (de) 2008-08-28

Family

ID=34551348

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004015137T Active DE602004015137D1 (de) 2003-11-04 2004-11-01 Integrierter thermischer sensor für mikrowellentransistoren

Country Status (6)

Country Link
US (1) US6991367B2 (de)
EP (1) EP1682858B1 (de)
JP (1) JP4660484B2 (de)
KR (1) KR101236454B1 (de)
DE (1) DE602004015137D1 (de)
WO (1) WO2005045381A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4536408B2 (ja) * 2004-03-30 2010-09-01 ルネサスエレクトロニクス株式会社 集積回路装置
US8562210B2 (en) 2010-11-19 2013-10-22 International Business Machines Corporation Thermal sensor for semiconductor circuits
KR101306407B1 (ko) * 2012-05-17 2013-09-09 홍윤기 압력저항 센서를 이용한 온도측정방법 및 온도측정장치
DE102015223470A1 (de) * 2015-11-26 2017-06-01 Robert Bosch Gmbh Halbleiterbauelement mit einem Substrat und einem ersten Temperaturmesselement sowie Verfahren zum Bestimmen eines durch ein Halbleiterbauelement fließenden Stromes sowie Steuergerät für ein Fahrzeug
US10107873B2 (en) 2016-03-10 2018-10-23 Allegro Microsystems, Llc Electronic circuit for compensating a sensitivity drift of a hall effect element due to stress
US10162017B2 (en) 2016-07-12 2018-12-25 Allegro Microsystems, Llc Systems and methods for reducing high order hall plate sensitivity temperature coefficients
US10520559B2 (en) 2017-08-14 2019-12-31 Allegro Microsystems, Llc Arrangements for Hall effect elements and vertical epi resistors upon a substrate

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US2050878A (en) * 1934-04-25 1936-08-11 Gen Electric Measuring device
US2432199A (en) * 1945-08-08 1947-12-09 George N Kamm Wheatstone bridge meter
US3091965A (en) * 1960-05-27 1963-06-04 William L Strickland Radio frequency hazard detector
US3531990A (en) * 1966-11-14 1970-10-06 Foxboro Co Wheatstone bridge for making precise temperature measurements
US3517555A (en) * 1968-03-29 1970-06-30 Us Army Radio frequency hazard detector
USRE27458E (en) * 1970-03-04 1972-08-15 Solid state temperature measuring device
US3928800A (en) * 1973-06-25 1975-12-23 Sperry Rand Corp Calorimetric resistance bridges
US3908164A (en) * 1974-10-03 1975-09-23 Xerox Corp Corona current measurement and control arrangement
DE2945546C2 (de) * 1979-11-10 1983-09-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Schaltungsanordnung für abstimmbare HF-Kreise
JPS5690264A (en) * 1979-12-24 1981-07-22 Nippon Denki Sanei Kk Measuring device of bridge
US4719434A (en) * 1981-08-14 1988-01-12 Texas Instruments Incorporated Varactor trimming for MMICs
EP0072647B1 (de) * 1981-08-14 1989-11-08 Texas Instruments Incorporated Varaktorabgleich für MMICS
US4713581A (en) 1983-08-09 1987-12-15 Haimson Research Corporation Method and apparatus for accelerating a particle beam
JPS60141011A (ja) * 1983-12-28 1985-07-26 Nec Corp コレクタ飽和抑制回路
US4936144A (en) * 1986-05-23 1990-06-26 Djorup Robert Sonny Directional thermal anemometer transducer
US4793182A (en) * 1987-06-02 1988-12-27 Djorup Robert Sonny Constant temperature hygrometer
US4924195A (en) * 1989-06-19 1990-05-08 At&T Bell Laboratories Crystal oscillator with broad tuning capability
US5444219A (en) * 1990-09-24 1995-08-22 U.S. Philips Corporation Temperature sensing device and a temperature sensing circuit using such a device
GB2248151A (en) * 1990-09-24 1992-03-25 Philips Electronic Associated Temperature sensing and protection circuit.
GB9115694D0 (en) 1991-07-19 1991-09-04 Philips Electronic Associated A temperature sensing device and a temperature sensing circuit using such a device
US5370458A (en) * 1990-10-09 1994-12-06 Lockheed Sanders, Inc. Monolithic microwave power sensor
JP3982842B2 (ja) * 1993-08-18 2007-09-26 株式会社ルネサステクノロジ 半導体装置
DE19543236C2 (de) * 1994-11-18 2001-01-25 Hitachi Ltd Einlaßluftmengen-Meßvorrichtung für Verbrennungsmotoren
JPH11220327A (ja) * 1997-10-31 1999-08-10 Dynamics Corp Of America 発振器の温度補償回路
US5912595A (en) * 1997-12-16 1999-06-15 Ma; John Y. Digitally temperature compensated voltage-controlled oscillator tunable to different frequency channels
US6091309A (en) * 1998-01-26 2000-07-18 Burke; Joseph P. Tunable low noise oscillator using delay lines and ring mode trap filter
US5994970A (en) * 1998-03-23 1999-11-30 Dallas Semiconductor Corporation Temperature compensated crystal oscillator
JP2000088891A (ja) * 1998-09-10 2000-03-31 Shimadzu Corp ブリッジ回路及びこれを用いた検出器
US6198296B1 (en) * 1999-01-14 2001-03-06 Burr-Brown Corporation Bridge sensor linearization circuit and method
EP1301987A1 (de) * 2000-07-20 2003-04-16 Paratek Microwave, Inc. Spannungsgesteuerter oszillatoren mit stimmbaren dielektrischen baulelementen
US6384787B1 (en) * 2001-02-21 2002-05-07 The Boeing Company Flat reflectarray antenna
US6486679B1 (en) * 2002-01-21 2002-11-26 Kenneth David Holt Wide-band ratiometric radio frequency bridge
KR100440764B1 (ko) * 2002-09-03 2004-07-21 전자부품연구원 마이크로파 전력센서 및 그의 제조방법
EP1460437A1 (de) 2003-03-18 2004-09-22 Agilent Technologies Inc Leistungsmessanordnung und Verfahren
US7030600B2 (en) * 2003-11-04 2006-04-18 Raytheon Company Broadband microwave power sensor

Also Published As

Publication number Publication date
US20050094708A1 (en) 2005-05-05
JP2007511093A (ja) 2007-04-26
EP1682858B1 (de) 2008-07-16
JP4660484B2 (ja) 2011-03-30
KR101236454B1 (ko) 2013-02-25
EP1682858A1 (de) 2006-07-26
WO2005045381A1 (en) 2005-05-19
US6991367B2 (en) 2006-01-31
KR20060120071A (ko) 2006-11-24

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Legal Events

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