DE602004006676D1 - Gefaltete flexible Verbindungsschaltung mit Rasterkontaktschnittstelle - Google Patents

Gefaltete flexible Verbindungsschaltung mit Rasterkontaktschnittstelle

Info

Publication number
DE602004006676D1
DE602004006676D1 DE602004006676T DE602004006676T DE602004006676D1 DE 602004006676 D1 DE602004006676 D1 DE 602004006676D1 DE 602004006676 T DE602004006676 T DE 602004006676T DE 602004006676 T DE602004006676 T DE 602004006676T DE 602004006676 D1 DE602004006676 D1 DE 602004006676D1
Authority
DE
Germany
Prior art keywords
flexible connection
connection circuit
contact interface
folded flexible
raster
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004006676T
Other languages
English (en)
Other versions
DE602004006676T2 (de
Inventor
Steven A Rosenau
Mohammed E Ali
Brian E Lemoff
Lisa A Windover
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avago Technologies International Sales Pte Ltd
Original Assignee
Avago Technologies Fiber IP Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies Fiber IP Singapore Pte Ltd filed Critical Avago Technologies Fiber IP Singapore Pte Ltd
Publication of DE602004006676D1 publication Critical patent/DE602004006676D1/de
Application granted granted Critical
Publication of DE602004006676T2 publication Critical patent/DE602004006676T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G02B6/4281—Electrical aspects containing printed circuit boards [PCB] the printed circuit boards being flexible
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4283—Electrical aspects with electrical insulation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/056—Folded around rigid support or component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Wire Bonding (AREA)
DE602004006676T 2003-07-18 2004-02-12 Gefaltete flexible Verbindungsschaltung mit Rasterkontaktschnittstelle Expired - Lifetime DE602004006676T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US623304 2003-07-18
US10/623,304 US6879032B2 (en) 2003-07-18 2003-07-18 Folded flex circuit interconnect having a grid array interface

Publications (2)

Publication Number Publication Date
DE602004006676D1 true DE602004006676D1 (de) 2007-07-12
DE602004006676T2 DE602004006676T2 (de) 2007-09-13

Family

ID=33477147

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004006676T Expired - Lifetime DE602004006676T2 (de) 2003-07-18 2004-02-12 Gefaltete flexible Verbindungsschaltung mit Rasterkontaktschnittstelle

Country Status (6)

Country Link
US (1) US6879032B2 (de)
EP (1) EP1499167B1 (de)
JP (1) JP4628714B2 (de)
CN (1) CN100420099C (de)
DE (1) DE602004006676T2 (de)
TW (1) TWI333685B (de)

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Also Published As

Publication number Publication date
US20050012199A1 (en) 2005-01-20
TW200504965A (en) 2005-02-01
CN100420099C (zh) 2008-09-17
US6879032B2 (en) 2005-04-12
JP4628714B2 (ja) 2011-02-09
EP1499167A2 (de) 2005-01-19
TWI333685B (en) 2010-11-21
CN1577993A (zh) 2005-02-09
EP1499167A3 (de) 2005-10-12
EP1499167B1 (de) 2007-05-30
JP2005045240A (ja) 2005-02-17
DE602004006676T2 (de) 2007-09-13

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Representative=s name: DILG HAEUSLER SCHINDELMANN PATENTANWALTSGESELLSCHA