DE60140879D1 - Halbleiter-led-bauelement und herstellungsverfahren - Google Patents
Halbleiter-led-bauelement und herstellungsverfahrenInfo
- Publication number
- DE60140879D1 DE60140879D1 DE60140879T DE60140879T DE60140879D1 DE 60140879 D1 DE60140879 D1 DE 60140879D1 DE 60140879 T DE60140879 T DE 60140879T DE 60140879 T DE60140879 T DE 60140879T DE 60140879 D1 DE60140879 D1 DE 60140879D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- passivation layer
- inxga1
- layer
- crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000013078 crystal Substances 0.000 abstract 4
- 238000002161 passivation Methods 0.000 abstract 4
- 229910002601 GaN Inorganic materials 0.000 abstract 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000052169A KR100344103B1 (ko) | 2000-09-04 | 2000-09-04 | 질화갈륨계 결정 보호막을 형성한 반도체 소자 및 그 제조방법 |
PCT/KR2001/001494 WO2002021605A1 (en) | 2000-09-04 | 2001-09-04 | The semiconductor led device and producing method |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60140879D1 true DE60140879D1 (de) | 2010-02-04 |
Family
ID=19687250
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60140879T Expired - Lifetime DE60140879D1 (de) | 2000-09-04 | 2001-09-04 | Halbleiter-led-bauelement und herstellungsverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US7053417B2 (de) |
EP (1) | EP1320902B1 (de) |
KR (1) | KR100344103B1 (de) |
AT (1) | ATE453212T1 (de) |
AU (1) | AU2001286288A1 (de) |
DE (1) | DE60140879D1 (de) |
WO (1) | WO2002021605A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100497127B1 (ko) * | 2002-09-05 | 2005-06-28 | 삼성전기주식회사 | 질화갈륨계 반도체 엘이디 소자 |
US7390535B2 (en) * | 2003-07-03 | 2008-06-24 | Aeromet Technologies, Inc. | Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings |
KR101034055B1 (ko) * | 2003-07-18 | 2011-05-12 | 엘지이노텍 주식회사 | 발광 다이오드 및 그 제조방법 |
WO2005015642A1 (ja) * | 2003-08-08 | 2005-02-17 | Sanken Electric Co., Ltd. | 半導体装置及びその製造方法 |
DE102005010821B4 (de) * | 2005-03-07 | 2007-01-25 | Technische Universität Berlin | Verfahren zum Herstellen eines Bauelements |
JP4980594B2 (ja) * | 2005-08-03 | 2012-07-18 | 京セラ株式会社 | P型窒化ガリウム系化合物半導体の製造方法 |
CN101385145B (zh) | 2006-01-05 | 2011-06-08 | 伊鲁米特克斯公司 | 用于引导来自led的光的分立光学装置 |
US8087960B2 (en) | 2006-10-02 | 2012-01-03 | Illumitex, Inc. | LED system and method |
KR20100122485A (ko) | 2008-02-08 | 2010-11-22 | 일루미텍스, 인크. | 발광체층 쉐이핑을 위한 시스템 및 방법 |
TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
US9130026B2 (en) * | 2013-09-03 | 2015-09-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Crystalline layer for passivation of III-N surface |
US9425301B2 (en) | 2014-04-30 | 2016-08-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sidewall passivation for HEMT devices |
DE102017108435A1 (de) | 2017-04-20 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Halbleiterlaserdiode und Verfahren zur Herstellung einer Halbleiterlaserdiode |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4448633A (en) * | 1982-11-29 | 1984-05-15 | United Technologies Corporation | Passivation of III-V semiconductor surfaces by plasma nitridation |
US5777350A (en) * | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
FR2737342B1 (fr) * | 1995-07-25 | 1997-08-22 | Thomson Csf | Composant semiconducteur avec dissipateur thermique integre |
JP3009095B2 (ja) * | 1995-10-27 | 2000-02-14 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
JP3675003B2 (ja) * | 1995-10-27 | 2005-07-27 | 昭和電工株式会社 | 半導体発光素子 |
KR100267839B1 (ko) * | 1995-11-06 | 2000-10-16 | 오가와 에이지 | 질화물 반도체 장치 |
JP3596171B2 (ja) * | 1996-05-16 | 2004-12-02 | 豊田合成株式会社 | 3族窒化物半導体発光素子 |
JP2941743B2 (ja) * | 1996-06-05 | 1999-08-30 | 株式会社東芝 | 化合物半導体発光素子及びその製造方法 |
US5799028A (en) * | 1996-07-18 | 1998-08-25 | Sdl, Inc. | Passivation and protection of a semiconductor surface |
US6020602A (en) * | 1996-09-10 | 2000-02-01 | Kabushiki Kaisha Toshba | GaN based optoelectronic device and method for manufacturing the same |
US6093952A (en) * | 1999-03-31 | 2000-07-25 | California Institute Of Technology | Higher power gallium nitride schottky rectifier |
US6812152B2 (en) * | 2001-08-09 | 2004-11-02 | Comlase Ab | Method to obtain contamination free laser mirrors and passivation of these |
-
2000
- 2000-09-04 KR KR1020000052169A patent/KR100344103B1/ko active IP Right Grant
-
2001
- 2001-09-04 AT AT01965717T patent/ATE453212T1/de not_active IP Right Cessation
- 2001-09-04 DE DE60140879T patent/DE60140879D1/de not_active Expired - Lifetime
- 2001-09-04 EP EP01965717A patent/EP1320902B1/de not_active Expired - Lifetime
- 2001-09-04 WO PCT/KR2001/001494 patent/WO2002021605A1/en active Application Filing
- 2001-09-04 US US10/363,432 patent/US7053417B2/en not_active Expired - Lifetime
- 2001-09-04 AU AU2001286288A patent/AU2001286288A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002021605A1 (en) | 2002-03-14 |
US7053417B2 (en) | 2006-05-30 |
KR20020018871A (ko) | 2002-03-09 |
US20040007786A1 (en) | 2004-01-15 |
ATE453212T1 (de) | 2010-01-15 |
AU2001286288A1 (en) | 2002-03-22 |
KR100344103B1 (ko) | 2002-07-24 |
EP1320902B1 (de) | 2009-12-23 |
EP1320902A1 (de) | 2003-06-25 |
EP1320902A4 (de) | 2006-10-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8507357B2 (en) | Method for lift-off of light-emitting diode substrate | |
DE60140879D1 (de) | Halbleiter-led-bauelement und herstellungsverfahren | |
KR101103882B1 (ko) | 반도체 발광소자 및 그 제조방법 | |
US8436377B2 (en) | GaN-based light-emitting diode and method for manufacturing the same | |
CN102738334B (zh) | 具有电流扩展层的发光二极管及其制作方法 | |
DE602005019569D1 (de) | Lichtemittierende bauelemente mit stromblockierungsstrukturen und verfahren zur herstellung von lichtemittierenden bauelementen mit stromblockierungsstrukturen | |
EP1619729A4 (de) | Lichtemittierendes bauelement auf galliumnitridbasis | |
TW200635084A (en) | Light emitting device | |
CN101794849B (zh) | 一种SiC衬底GaN基LED的湿法腐蚀剥离方法 | |
CN101908587B (zh) | 一种退火剥离倒装SiC衬底GaN基LED的制作方法 | |
TW200717863A (en) | Gallium nitride-based compound semiconductor light-emitting device | |
US20140051197A1 (en) | Method for fabricating a vertical light emitting diode (vled) die having epitaxial structure with protective layer | |
US8772815B2 (en) | Semiconductor light emitting device having a protecting member and method of fabricating the same | |
KR20070093653A (ko) | 발광 다이오드의 제조방법 | |
TW200731583A (en) | Method of manufacturing gallium nitride based light emitting diode | |
TW200725948A (en) | Gallium nitride-based compound semiconductor light-emitting device and production method thereof | |
TW201338204A (zh) | 發光裝置之製造方法 | |
WO2005060013A8 (ja) | 半導体発光素子およびその製法 | |
KR101978485B1 (ko) | 발광 소자 및 발광 소자 패키지 | |
CN104332538A (zh) | 一种发光二极管外延结构 | |
KR102200027B1 (ko) | 발광소자 및 조명시스템 | |
CN103682005B (zh) | Led磊晶制程 | |
KR101012638B1 (ko) | 수직형 질화물계 발광소자의 제조방법 | |
CN108417678B (zh) | 发光二极管结构及其制作方法 | |
KR102411948B1 (ko) | 반도체 소자 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 1320902 Country of ref document: EP Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWAELTE |
|
R082 | Change of representative |
Ref document number: 1320902 Country of ref document: EP Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWA, DE |
|
R081 | Change of applicant/patentee |
Ref document number: 1320902 Country of ref document: EP Owner name: EPIVALLEY CO., LTD., KR Free format text: FORMER OWNER: EPIVALLEY CO., LTD., SAMSUNG LED CO., LTD., , KR Effective date: 20121207 Ref document number: 1320902 Country of ref document: EP Owner name: SAMSUNG ELECTRONICS CO., LTD., KR Free format text: FORMER OWNER: EPIVALLEY CO., LTD., SAMSUNG LED CO., LTD., , KR Effective date: 20121207 |
|
R082 | Change of representative |
Ref document number: 1320902 Country of ref document: EP Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWA, DE Effective date: 20121207 |