DE60138002D1 - Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte - Google Patents

Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte

Info

Publication number
DE60138002D1
DE60138002D1 DE60138002T DE60138002T DE60138002D1 DE 60138002 D1 DE60138002 D1 DE 60138002D1 DE 60138002 T DE60138002 T DE 60138002T DE 60138002 T DE60138002 T DE 60138002T DE 60138002 D1 DE60138002 D1 DE 60138002D1
Authority
DE
Germany
Prior art keywords
low density
specific form
focused ion
ion rays
rays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60138002T
Other languages
English (en)
Inventor
Robert L Gerlach
Mark W Utlaut
Paul P Tesch
Richard J Young
Clive D Chandler
Der Mast Karl D Van
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FEI Co
Original Assignee
FEI Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FEI Co filed Critical FEI Co
Application granted granted Critical
Publication of DE60138002D1 publication Critical patent/DE60138002D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3178Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for applying thin layers on objects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/3002Details
    • H01J37/3007Electron or ion-optical systems
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H01J37/3056Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching for microworking, e.g. etching of gratings, trimming of electrical components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30Electron or ion beam tubes for processing objects
    • H01J2237/317Processing objects on a microscale
    • H01J2237/3174Etching microareas
    • H01J2237/31742Etching microareas for repairing masks
    • H01J2237/31744Etching microareas for repairing masks introducing gas in vicinity of workpiece

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
DE60138002T 2000-01-21 2001-01-19 Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte Expired - Lifetime DE60138002D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US17751800P 2000-01-21 2000-01-21
PCT/EP2001/000621 WO2001054163A1 (en) 2000-01-21 2001-01-19 Shaped and low density focused ion beams

Publications (1)

Publication Number Publication Date
DE60138002D1 true DE60138002D1 (de) 2009-04-30

Family

ID=22648901

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60138002T Expired - Lifetime DE60138002D1 (de) 2000-01-21 2001-01-19 Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte

Country Status (5)

Country Link
US (1) US6949756B2 (de)
EP (1) EP1210723B1 (de)
JP (1) JP5259035B2 (de)
DE (1) DE60138002D1 (de)
WO (1) WO2001054163A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2806527B1 (fr) 2000-03-20 2002-10-25 Schlumberger Technologies Inc Colonne a focalisation simultanee d'un faisceau de particules et d'un faisceau optique
EP1160826A3 (de) * 2000-05-30 2006-12-13 Ebara Corporation Beschichten, Verändern und Ätzen eines Substrats mittels Teilchenbestrahlung
US20060051508A1 (en) * 2000-12-28 2006-03-09 Ilan Gavish Focused ion beam deposition
US6492261B2 (en) * 2000-12-30 2002-12-10 Intel Corporation Focused ion beam metal deposition
US6638580B2 (en) * 2000-12-29 2003-10-28 Intel Corporation Apparatus and a method for forming an alloy layer over a substrate using an ion beam
US6977386B2 (en) * 2001-01-19 2005-12-20 Fei Company Angular aperture shaped beam system and method
US7160475B2 (en) * 2002-11-21 2007-01-09 Fei Company Fabrication of three dimensional structures
US6926935B2 (en) * 2003-06-27 2005-08-09 Fei Company Proximity deposition
JP4344197B2 (ja) * 2003-08-26 2009-10-14 パナソニック株式会社 絶縁膜測定装置、絶縁膜測定方法及び絶縁膜評価装置
FR2859488B1 (fr) * 2003-09-10 2006-02-17 Centre Nat Rech Scient Procede de fabrication d'au moins une cavite dans un materiau
EP1683163B1 (de) 2003-10-17 2012-02-22 Fei Company Extraktionseinrichtung und verfahren für geladene teilchen
JP2006079846A (ja) * 2004-09-07 2006-03-23 Canon Inc 試料の断面評価装置及び試料の断面評価方法
JP5509239B2 (ja) * 2004-09-29 2014-06-04 株式会社日立ハイテクノロジーズ イオンビーム加工装置及び加工方法
JP5033314B2 (ja) * 2004-09-29 2012-09-26 株式会社日立ハイテクノロジーズ イオンビーム加工装置及び加工方法
US8414908B2 (en) * 2005-04-28 2013-04-09 The Regents Of The University Of California Compositions comprising nanostructures for cell, tissue and artificial organ growth, and methods for making and using same
JP5600371B2 (ja) * 2006-02-15 2014-10-01 エフ・イ−・アイ・カンパニー 荷電粒子ビーム処理のための保護層のスパッタリング・コーティング
EP2063450A1 (de) * 2007-11-21 2009-05-27 FEI Company Verfahren zum Erhalten eines Rastertransmissionsbildes einer Probe in einer teilchenoptischen Vorrichtung
US20110085968A1 (en) * 2009-10-13 2011-04-14 The Regents Of The University Of California Articles comprising nano-materials for geometry-guided stem cell differentiation and enhanced bone growth
WO2011163397A1 (en) 2010-06-22 2011-12-29 The Regents Of The University Of California Microfabricated high-bandpass foucault aperture for electron microscopy
JP6403200B2 (ja) 2014-12-03 2018-10-10 日本電子株式会社 成膜方法および集束イオンビーム装置
JP2017020106A (ja) * 2015-07-02 2017-01-26 エフ・イ−・アイ・カンパニー 高スループット・パターン形成のための適応ビーム電流
US9679742B2 (en) 2015-10-30 2017-06-13 Fei Company Method for optimizing charged particle beams formed by shaped apertures
US10971618B2 (en) 2019-08-02 2021-04-06 Applied Materials Israel Ltd. Generating milled structural elements with a flat upper surface
CN117293005A (zh) 2022-06-23 2023-12-26 Fei 公司 聚焦离子束系统和方法

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE33193E (en) * 1981-09-30 1990-04-03 Hitachi, Ltd. Ion beam processing apparatus and method of correcting mask defects
JPS59168652A (ja) * 1983-03-16 1984-09-22 Hitachi Ltd 素子修正方法及びその装置
JPS6169125A (ja) 1984-08-06 1986-04-09 Nippon Telegr & Teleph Corp <Ntt> 荷電ビ−ム露光装置
US4698236A (en) * 1984-10-26 1987-10-06 Ion Beam Systems, Inc. Augmented carbonaceous substrate alteration
US4634871A (en) 1985-01-14 1987-01-06 Hughes Aircraft Company Method and apparatus for spot shaping and blanking a focused beam
US4661709A (en) 1985-06-28 1987-04-28 Control Data Corporation Modular all-electrostatic electron-optical column and assembly of said columns into an array and method of manufacture
US4694178A (en) 1985-06-28 1987-09-15 Control Data Corporation Multiple channel electron beam optical column lithography system and method of operation
US4687940A (en) * 1986-03-20 1987-08-18 Hughes Aircraft Company Hybrid focused-flood ion beam system and method
JPS62281349A (ja) 1986-05-29 1987-12-07 Seiko Instr & Electronics Ltd 金属パタ−ン膜の形成方法及びその装置
NL8602176A (nl) 1986-08-27 1988-03-16 Philips Nv Ionen bundel apparaat voor nabewerking van patronen.
US4724359A (en) * 1986-10-17 1988-02-09 General Electric Company Laminar flow guns for light valves
AT391771B (de) * 1987-03-05 1990-11-26 Ims Ionen Mikrofab Syst Einrichtung zur verkleinernden oder 1 : 1 ionenprojektionslithographie
US4874460A (en) * 1987-11-16 1989-10-17 Seiko Instruments Inc. Method and apparatus for modifying patterned film
US6048588A (en) * 1988-07-08 2000-04-11 Cauldron Limited Partnership Method for enhancing chemisorption of material
DE68920281T2 (de) 1988-10-31 1995-05-11 Fujitsu Ltd Vorrichtung und Verfahren zur Lithographie mittels eines Strahls geladener Teilchen.
DE3910054A1 (de) * 1989-03-28 1990-10-11 Siemens Ag Ionenimplantationsanlage
JP2708547B2 (ja) * 1989-05-10 1998-02-04 株式会社日立製作所 デバイス移植方法
US5093572A (en) 1989-11-02 1992-03-03 Mitsubishi Denki Kabushiki Kaisha Scanning electron microscope for observation of cross section and method of observing cross section employing the same
NL9000822A (nl) * 1990-04-09 1991-11-01 Philips Nv Werkwijze voor bestraling van een object met een geladen deeltjesbundel en inrichting voor uitvoering van de werkwijze.
US5126287A (en) * 1990-06-07 1992-06-30 Mcnc Self-aligned electron emitter fabrication method and devices formed thereby
US5061850A (en) * 1990-07-30 1991-10-29 Wisconsin Alumni Research Foundation High-repetition rate position sensitive atom probe
US5149974A (en) 1990-10-29 1992-09-22 International Business Machines Corporation Gas delivery for ion beam deposition and etching
US5188705A (en) 1991-04-15 1993-02-23 Fei Company Method of semiconductor device manufacture
WO1994013010A1 (en) 1991-04-15 1994-06-09 Fei Company Process of shaping features of semiconductor devices
US5389196A (en) * 1992-01-30 1995-02-14 Massachusetts Institute Of Technology Methods for fabricating three-dimensional micro structures
JP3117836B2 (ja) 1993-03-02 2000-12-18 セイコーインスツルメンツ株式会社 集束イオンビーム装置
US5504340A (en) * 1993-03-10 1996-04-02 Hitachi, Ltd. Process method and apparatus using focused ion beam generating means
EP0637057B1 (de) * 1993-07-30 1996-12-11 International Business Machines Corporation Vorrichtung und Verfahren um feine Metal-linie auf einem Substrat abzulegen
US5435850A (en) 1993-09-17 1995-07-25 Fei Company Gas injection system
US5524018A (en) * 1993-10-04 1996-06-04 Adachi; Yoshi Superior resolution laser using bessel transform optical filter
US5528048A (en) * 1994-03-15 1996-06-18 Fujitsu Limited Charged particle beam exposure system and method
AU2914095A (en) 1994-06-28 1996-01-25 Fei Company Charged particle deposition of electrically insulating films
JP3265901B2 (ja) * 1995-03-24 2002-03-18 株式会社日立製作所 集束イオンビーム装置及び集束イオンビーム照射方法
JPH09199072A (ja) * 1996-01-22 1997-07-31 Hitachi Ltd イオンビーム投射方法および装置
JPH09283496A (ja) * 1996-04-18 1997-10-31 Hitachi Ltd 荷電粒子ビーム照射によるパターン形成方法及びその装置
US5916424A (en) * 1996-04-19 1999-06-29 Micrion Corporation Thin film magnetic recording heads and systems and methods for manufacturing the same
US6128134A (en) * 1997-08-27 2000-10-03 Digital Optics Corporation Integrated beam shaper and use thereof
JPH10144583A (ja) * 1996-11-07 1998-05-29 Nikon Corp 荷電粒子線投影方法および荷電粒子線投影装置
JPH10162769A (ja) * 1996-11-28 1998-06-19 Hitachi Ltd イオンビーム加工装置
US6042738A (en) * 1997-04-16 2000-03-28 Micrion Corporation Pattern film repair using a focused particle beam system
US6274877B1 (en) * 1997-05-08 2001-08-14 Canon Kabushiki Kaisha Electron beam exposure apparatus
US6538254B1 (en) 1997-07-22 2003-03-25 Hitachi, Ltd. Method and apparatus for sample fabrication
JPH1177333A (ja) * 1997-09-09 1999-03-23 Hitachi Ltd 集束イオンビーム加工装置及びその方法
US6583426B1 (en) * 1997-09-10 2003-06-24 Hitachi, Ltd. Projection ion beam machining apparatus
JPH11154479A (ja) * 1997-11-20 1999-06-08 Hitachi Ltd 2次電子画像検出方法及びその装置並びに集束荷電粒子ビームによる処理方法及びその装置
JP2926132B1 (ja) * 1998-01-23 1999-07-28 セイコーインスツルメンツ株式会社 集束イオンビームによる二次イオン像観察方法
US5945677A (en) 1998-04-10 1999-08-31 The Regents Of The University Of California Focused ion beam system
US6011269A (en) 1998-04-10 2000-01-04 Etec Systems, Inc. Shaped shadow projection for an electron beam column
US6277542B1 (en) * 1998-06-05 2001-08-21 Nikon Corporation Charged-particle-beam projection-exposure methods exhibiting more uniform beam-current density
US6455863B1 (en) * 1999-06-09 2002-09-24 Applied Materials, Inc. Apparatus and method for forming a charged particle beam of arbitrary shape
US6414307B1 (en) * 1999-07-09 2002-07-02 Fei Company Method and apparatus for enhancing yield of secondary ions

Also Published As

Publication number Publication date
JP5259035B2 (ja) 2013-08-07
JP2003520409A (ja) 2003-07-02
US6949756B2 (en) 2005-09-27
WO2001054163A9 (en) 2002-10-17
EP1210723A1 (de) 2002-06-05
WO2001054163A1 (en) 2001-07-26
EP1210723B1 (de) 2009-03-18
US20010045525A1 (en) 2001-11-29

Similar Documents

Publication Publication Date Title
DE60138002D1 (de) Fokussierte ionenstrahlen mit vorgegebener form und geringer dichte
ATE282388T1 (de) Absorbierender artikel mit verbesserten vertikalen docht- und rückfeuchteeigenschaften
DE69920390D1 (de) Mram mit geteilten wort-und bitleitungen
DK1079786T3 (da) Absorberende struktur i en absorberende artikel
DE60138457D1 (de) Gleichlaufgelenk mit feststehendem zentrum und sich kreuzenden rillen
DE10197087T1 (de) Dünner und mehrschichtiger Absorptionskern mit hoher Kapazität
ID22733A (id) Bahan penyerap zat keluaran tubuh
FI19992753A (fi) Menetelmä vastaanottimessa ja vastaanotin
DE60115114D1 (de) Graphitnanofaser und deren Verwendung
DE59900554D1 (de) Gargerät mit energiespeicher- und energieentnahmesystem
DE69935574D1 (de) Antikörper gegen mensliches il-12
EP1333864A4 (de) Radionuklid niedriger dichte enthaltendes teilchenförmiges material
DE69905859D1 (de) Rotierende energiespeicherungsvorrichtung und dazu gehörige werkzeuge
DE60303068D1 (de) Schwindungsarme Laminatzusammensetzung mit geringer Dichte
DE50211216D1 (de) Magnetische speichereinheit und magnetisches speicherarray
DE60127177D1 (de) Radiotherapeutisches gerät mit mehrblattkollimator
DE60211455D1 (de) Organisches poröses Material und organischer poröser Ionenaustauscher
DE60130398D1 (de) Selbstsperrendes Differentialgetriebe mit kompakter Bauweise
NO990053D0 (no) Fresstyring med orienterings- og dybdebestemmelsesevne
DE60107627D1 (de) Sauerstoff und Wasserdampf absorbierende Zusammensetzung
DE60135154D1 (de) Photochrome härtbare zusammensetzung und gehärtete gegenstände daraus
DE60011246D1 (de) Radioaktive mikrokugel und herstellungsverfahren dazu
DE50115805D1 (de) Elektronenerergiefilter mit magnetischen Umlenkbereichen
DE69940533D1 (de) Leistungsverstärker mit sanfter Umschaltung und Mehrpegel-Schaltzellen
DE60139509D1 (de) Copolyester mit hohem carboxylendgruppengehalt und herstellungsverfahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition