DE60129491D1 - Flip-Chip-Assemblage geschützter Mikromechanikteile - Google Patents

Flip-Chip-Assemblage geschützter Mikromechanikteile

Info

Publication number
DE60129491D1
DE60129491D1 DE60129491T DE60129491T DE60129491D1 DE 60129491 D1 DE60129491 D1 DE 60129491D1 DE 60129491 T DE60129491 T DE 60129491T DE 60129491 T DE60129491 T DE 60129491T DE 60129491 D1 DE60129491 D1 DE 60129491D1
Authority
DE
Germany
Prior art keywords
leg portions
pair
flip
protected
shoes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60129491T
Other languages
English (en)
Other versions
DE60129491T2 (de
Inventor
Sunil Thomas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of DE60129491D1 publication Critical patent/DE60129491D1/de
Application granted granted Critical
Publication of DE60129491T2 publication Critical patent/DE60129491T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A43—FOOTWEAR
    • A43B—CHARACTERISTIC FEATURES OF FOOTWEAR; PARTS OF FOOTWEAR
    • A43B3/00—Footwear characterised by the shape or the use
    • A43B3/0026—Footwear characterised by the shape or the use for use in minefields; protecting from landmine blast; preventing landmines from being triggered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
    • B81C1/00785—Avoid chemical alteration, e.g. contamination, oxidation or unwanted etching
    • B81C1/00793—Avoid contamination, e.g. absorption of impurities or oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Disinfection, Sterilisation Or Deodorisation Of Air (AREA)
  • Footwear And Its Accessory, Manufacturing Method And Apparatuses (AREA)
  • Apparatus For Disinfection Or Sterilisation (AREA)
DE60129491T 2000-02-22 2001-02-22 Flip-Chip-Assemblage geschützter Mikromechanikteile Expired - Lifetime DE60129491T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18409100P 2000-02-22 2000-02-22
US184091P 2000-02-22

Publications (2)

Publication Number Publication Date
DE60129491D1 true DE60129491D1 (de) 2007-09-06
DE60129491T2 DE60129491T2 (de) 2008-04-17

Family

ID=22675510

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60129491T Expired - Lifetime DE60129491T2 (de) 2000-02-22 2001-02-22 Flip-Chip-Assemblage geschützter Mikromechanikteile

Country Status (5)

Country Link
US (1) US6507082B2 (de)
EP (1) EP1127838B1 (de)
JP (1) JP2001308225A (de)
AT (1) ATE367999T1 (de)
DE (1) DE60129491T2 (de)

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Publication number Priority date Publication date Assignee Title
FR2800912B1 (fr) * 1999-11-04 2003-07-25 St Microelectronics Sa Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
US6656768B2 (en) * 2001-02-08 2003-12-02 Texas Instruments Incorporated Flip-chip assembly of protected micromechanical devices
KR100332967B1 (ko) * 2000-05-10 2002-04-19 윤종용 디지털 마이크로-미러 디바이스 패키지의 제조 방법
US7498196B2 (en) 2001-03-30 2009-03-03 Megica Corporation Structure and manufacturing method of chip scale package
EP1387604A1 (de) * 2002-07-31 2004-02-04 United Test Center Inc. Kontaktflächen einer gedruckten Leiterplatte geeignet zum sicheren Halten von Lötkugeln
US7071032B2 (en) * 2002-08-01 2006-07-04 Taiwan Semiconductor Manufacturing Co., Ltd. Material to improve image sensor yield during wafer sawing
US20040092029A1 (en) * 2002-10-09 2004-05-13 Jones Mark L. Method of preparing a silicon sample for analysis
US7223981B1 (en) * 2002-12-04 2007-05-29 Aguila Technologies Inc. Gamma ray detector modules
WO2004068180A2 (en) 2003-01-24 2004-08-12 Montana State University-Bozeman Off-axis variable focus and aberration control mirrors and method
CA2517906A1 (en) * 2003-03-03 2004-12-29 Montana State University-Bozeman Miniature confocal optical device, system, and method
US7514283B2 (en) 2003-03-20 2009-04-07 Robert Bosch Gmbh Method of fabricating electromechanical device having a controlled atmosphere
JP4505189B2 (ja) * 2003-03-24 2010-07-21 富士フイルム株式会社 透過型光変調装置及びその実装方法
US8912174B2 (en) * 2003-04-16 2014-12-16 Mylan Pharmaceuticals Inc. Formulations and methods for treating rhinosinusitis
US6936491B2 (en) 2003-06-04 2005-08-30 Robert Bosch Gmbh Method of fabricating microelectromechanical systems and devices having trench isolated contacts
US7075160B2 (en) * 2003-06-04 2006-07-11 Robert Bosch Gmbh Microelectromechanical systems and devices having thin film encapsulated mechanical structures
US6952041B2 (en) * 2003-07-25 2005-10-04 Robert Bosch Gmbh Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
US6903860B2 (en) * 2003-11-01 2005-06-07 Fusao Ishii Vacuum packaged micromirror arrays and methods of manufacturing the same
US7626255B2 (en) * 2003-10-15 2009-12-01 Koninklijke Philips Electronics N.V. Device, system and electric element
US7115436B2 (en) * 2004-02-12 2006-10-03 Robert Bosch Gmbh Integrated getter area for wafer level encapsulated microelectromechanical systems
US7068125B2 (en) * 2004-03-04 2006-06-27 Robert Bosch Gmbh Temperature controlled MEMS resonator and method for controlling resonator frequency
US7102467B2 (en) * 2004-04-28 2006-09-05 Robert Bosch Gmbh Method for adjusting the frequency of a MEMS resonator
KR100789545B1 (ko) 2005-03-07 2007-12-28 삼성전기주식회사 플립칩 실장 기술을 이용한 광변조기 모듈 패키지
KR100815350B1 (ko) 2005-04-01 2008-03-19 삼성전기주식회사 광변조기 모듈 패키지 구조
US7449355B2 (en) * 2005-04-27 2008-11-11 Robert Bosch Gmbh Anti-stiction technique for electromechanical systems and electromechanical device employing same
US7529013B2 (en) * 2005-08-29 2009-05-05 Samsung Electro-Mechanics Co., Ltd. Optical modulator module package
KR100861063B1 (ko) 2005-08-29 2008-09-30 삼성전기주식회사 광 변조기 모듈 패키지
JP2007095780A (ja) * 2005-09-27 2007-04-12 Oki Electric Ind Co Ltd 半導体装置製造用治具と半導体装置製造方法
KR100857172B1 (ko) 2005-10-11 2008-09-05 삼성전기주식회사 멤스 모듈 패키지
KR100836658B1 (ko) 2005-10-11 2008-06-10 삼성전기주식회사 광 변조기 모듈 패키지 및 그 제조 방법
US20070170528A1 (en) 2006-01-20 2007-07-26 Aaron Partridge Wafer encapsulated microelectromechanical structure and method of manufacturing same
JP2007264441A (ja) * 2006-03-29 2007-10-11 Fujitsu Ltd 光結合方法
US7456042B2 (en) * 2006-06-04 2008-11-25 Robert Bosch Gmbh Microelectromechanical systems having stored charge and methods for fabricating and using same
US7824943B2 (en) * 2006-06-04 2010-11-02 Akustica, Inc. Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
US8204352B2 (en) * 2007-11-29 2012-06-19 Kyocera Corporation Optical apparatus, sealing substrate, and method of manufacturing optical apparatus
US7875482B2 (en) 2009-03-19 2011-01-25 Robert Bosch Gmbh Substrate with multiple encapsulated pressures
US8430255B2 (en) * 2009-03-19 2013-04-30 Robert Bosch Gmbh Method of accurately spacing Z-axis electrode
JP5133956B2 (ja) * 2009-09-25 2013-01-30 大日本スクリーン製造株式会社 空間光変調器および露光装置

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278872A (ja) * 1989-04-20 1990-11-15 Ibiden Co Ltd 画像センサー
US5293511A (en) * 1993-03-16 1994-03-08 Texas Instruments Incorporated Package for a semiconductor device
US5516728A (en) * 1994-03-31 1996-05-14 At&T Corp. Process for fabircating an integrated circuit
US5610431A (en) * 1995-05-12 1997-03-11 The Charles Stark Draper Laboratory, Inc. Covers for micromechanical sensors and other semiconductor devices
US5936758A (en) * 1996-04-12 1999-08-10 Texas Instruments Incorporated Method of passivating a micromechanical device within a hermetic package
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
DE59706639D1 (de) * 1996-12-17 2002-04-18 Lab Fuer Physikalische Elektro Verfahren zum aufbringen eines mikrosystems oder wandlers auf ein substrat und nach diesem verfahren herstellbare vorrichtung
KR100643105B1 (ko) * 1998-05-06 2006-11-13 텍사스 인스트루먼츠 인코포레이티드 플립-칩 전자 디바이스를 언더필링하는 저응력 방법 및 장치

Also Published As

Publication number Publication date
EP1127838A2 (de) 2001-08-29
EP1127838A9 (de) 2002-01-02
EP1127838A3 (de) 2003-04-02
US20020163055A1 (en) 2002-11-07
US6507082B2 (en) 2003-01-14
ATE367999T1 (de) 2007-08-15
EP1127838B1 (de) 2007-07-25
DE60129491T2 (de) 2008-04-17
JP2001308225A (ja) 2001-11-02

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Legal Events

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