DE60129267D1 - Fertigungsstrasse zur Montage elektronischer Bauteile - Google Patents
Fertigungsstrasse zur Montage elektronischer BauteileInfo
- Publication number
- DE60129267D1 DE60129267D1 DE60129267T DE60129267T DE60129267D1 DE 60129267 D1 DE60129267 D1 DE 60129267D1 DE 60129267 T DE60129267 T DE 60129267T DE 60129267 T DE60129267 T DE 60129267T DE 60129267 D1 DE60129267 D1 DE 60129267D1
- Authority
- DE
- Germany
- Prior art keywords
- assembly
- electronic components
- production line
- production
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53187—Multiple station assembly apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000076421A JP3459610B2 (ja) | 2000-03-17 | 2000-03-17 | 装着ライン |
JP2000076421 | 2000-03-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60129267D1 true DE60129267D1 (de) | 2007-08-23 |
DE60129267T2 DE60129267T2 (de) | 2008-02-14 |
Family
ID=18594167
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60129267T Expired - Lifetime DE60129267T2 (de) | 2000-03-17 | 2001-03-19 | Fertigungsstrasse zur Montage elektronischer Bauteile |
Country Status (4)
Country | Link |
---|---|
US (1) | US6497037B2 (de) |
EP (1) | EP1137335B1 (de) |
JP (1) | JP3459610B2 (de) |
DE (1) | DE60129267T2 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6571462B1 (en) * | 1999-04-27 | 2003-06-03 | Matsushita Electric Industrial Co., Ltd | Electronic component mounting apparatus using duplicate sources of components |
JP2006339388A (ja) * | 2005-06-01 | 2006-12-14 | Yamaha Motor Co Ltd | 実装作業の管理方法、実装ラインおよび実装機 |
JP2007013033A (ja) * | 2005-07-04 | 2007-01-18 | Yamaha Motor Co Ltd | 実装ラインの管理方法 |
KR20080018198A (ko) | 2005-06-27 | 2008-02-27 | 마쯔시다덴기산교 가부시키가이샤 | 장착 조건 결정 방법 |
JP4883071B2 (ja) * | 2008-10-03 | 2012-02-22 | パナソニック株式会社 | 電子部品実装システム |
JP4883070B2 (ja) * | 2008-10-03 | 2012-02-22 | パナソニック株式会社 | 電子部品実装システムおよび電子部品実装方法 |
JP5323137B2 (ja) | 2011-06-14 | 2013-10-23 | ヤマハ発動機株式会社 | 段取り方法、部品実装方法および部品実装システム |
JP6404359B2 (ja) * | 2014-10-03 | 2018-10-10 | 株式会社Fuji | 部品装着システムおよび部品装着装置の異常停止診断方法 |
JP6746702B2 (ja) * | 2016-07-27 | 2020-08-26 | 株式会社Fuji | 基板生産管理装置および基板生産管理方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2766107B2 (ja) | 1991-12-19 | 1998-06-18 | 三洋電機株式会社 | 部品装着装置 |
JPH08172296A (ja) | 1994-10-19 | 1996-07-02 | Sanyo Electric Co Ltd | 電子部品自動装着装置及び電子部品の装着方法 |
US5671527A (en) * | 1995-11-01 | 1997-09-30 | Fuji Machine Mfg. Co., Ltd. | Electronic-component mounting system |
JP3502228B2 (ja) * | 1996-09-27 | 2004-03-02 | サンデン株式会社 | 低温庫 |
JPH10190299A (ja) * | 1996-12-20 | 1998-07-21 | Matsushita Electric Ind Co Ltd | 電子部品実装ライン及び電子部品実装方法 |
EP0883333B1 (de) * | 1997-06-05 | 2004-08-04 | Hitachi High-Tech Instruments Co., Ltd. | Einrichtung zur Montage von elektronischen Bauteilen und Speisevorrichtung dafür |
JP3596243B2 (ja) * | 1997-08-07 | 2004-12-02 | 松下電器産業株式会社 | 電子部品実装方法 |
-
2000
- 2000-03-17 JP JP2000076421A patent/JP3459610B2/ja not_active Expired - Lifetime
-
2001
- 2001-03-15 US US09/805,882 patent/US6497037B2/en not_active Expired - Fee Related
- 2001-03-19 EP EP01106821A patent/EP1137335B1/de not_active Expired - Lifetime
- 2001-03-19 DE DE60129267T patent/DE60129267T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3459610B2 (ja) | 2003-10-20 |
EP1137335A2 (de) | 2001-09-26 |
DE60129267T2 (de) | 2008-02-14 |
EP1137335A3 (de) | 2004-01-02 |
JP2001267799A (ja) | 2001-09-28 |
US6497037B2 (en) | 2002-12-24 |
US20010037187A1 (en) | 2001-11-01 |
EP1137335B1 (de) | 2007-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |