DE60120064D1 - Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum - Google Patents

Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Info

Publication number
DE60120064D1
DE60120064D1 DE60120064T DE60120064T DE60120064D1 DE 60120064 D1 DE60120064 D1 DE 60120064D1 DE 60120064 T DE60120064 T DE 60120064T DE 60120064 T DE60120064 T DE 60120064T DE 60120064 D1 DE60120064 D1 DE 60120064D1
Authority
DE
Germany
Prior art keywords
process chamber
atmosphere
speed
pump
primary pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60120064T
Other languages
English (en)
Other versions
DE60120064T2 (de
Inventor
Roland Bernard
Eric Chevalier
Gloria Sogan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent SAS
Original Assignee
Alcatel SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel SA filed Critical Alcatel SA
Publication of DE60120064D1 publication Critical patent/DE60120064D1/de
Application granted granted Critical
Publication of DE60120064T2 publication Critical patent/DE60120064T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/20Control of fluid pressure characterised by the use of electric means
    • G05D16/2006Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means
    • G05D16/2066Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source
    • G05D16/2073Control of fluid pressure characterised by the use of electric means with direct action of electric energy on controlling means using controlling means acting on the pressure source with a plurality of pressure sources
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D27/00Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00
    • G05D27/02Simultaneous control of variables covered by two or more of main groups G05D1/00 - G05D25/00 characterised by the use of electric means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/6851With casing, support, protector or static constructional installations
    • Y10T137/6966Static constructional installations
    • Y10T137/6969Buildings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • Y10T137/86083Vacuum pump
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00Fluid handling
    • Y10T137/8593Systems
    • Y10T137/85978With pump
    • Y10T137/86131Plural
    • Y10T137/86139Serial

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Vapour Deposition (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Drying Of Semiconductors (AREA)
  • Battery Electrode And Active Subsutance (AREA)
DE60120064T 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum Expired - Lifetime DE60120064T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0005094 2000-04-20
FR0005094A FR2808098B1 (fr) 2000-04-20 2000-04-20 Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes
PCT/FR2001/001220 WO2001082019A1 (fr) 2000-04-20 2001-04-20 Procede et dispositif de conditionnement de l'atmosphere dans une chambre de procedes

Publications (2)

Publication Number Publication Date
DE60120064D1 true DE60120064D1 (de) 2006-07-06
DE60120064T2 DE60120064T2 (de) 2006-12-21

Family

ID=8849454

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60120064T Expired - Lifetime DE60120064T2 (de) 2000-04-20 2001-04-20 Verfahren und vorrichtung zur konditionierung der atmosphäre in einem prozessraum

Country Status (7)

Country Link
US (3) US6316045B1 (de)
EP (1) EP1190285B1 (de)
JP (1) JP2003532283A (de)
AT (1) ATE328310T1 (de)
DE (1) DE60120064T2 (de)
FR (1) FR2808098B1 (de)
WO (1) WO2001082019A1 (de)

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US20060240680A1 (en) * 2005-04-25 2006-10-26 Applied Materials, Inc. Substrate processing platform allowing processing in different ambients
CN101389786A (zh) * 2006-02-28 2009-03-18 Nxp股份有限公司 处理装置和在该处理装置中处理晶片的方法
KR101126413B1 (ko) 2006-03-16 2012-03-28 어플라이드 머티어리얼스, 인코포레이티드 전자 디바이스 제조 시스템의 동작을 향상시키는 방법 및 장치
US8026113B2 (en) * 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
WO2008147523A1 (en) * 2007-05-25 2008-12-04 Applied Materials, Inc. Cogeneration abatement system for electronic device manufacturing
JP2010528475A (ja) * 2007-05-25 2010-08-19 アプライド マテリアルズ インコーポレイテッド 電子デバイス製造システムを組み立てる及び運転する方法及び装置
US20090018688A1 (en) * 2007-06-15 2009-01-15 Applied Materials, Inc. Methods and systems for designing and validating operation of abatement systems
JP4959457B2 (ja) * 2007-07-26 2012-06-20 東京エレクトロン株式会社 基板搬送モジュール及び基板処理システム
KR20100084676A (ko) * 2007-10-26 2010-07-27 어플라이드 머티어리얼스, 인코포레이티드 향상된 연료 회로를 사용하는 스마트 저감을 위한 방법 및 장치
US9997325B2 (en) 2008-07-17 2018-06-12 Verity Instruments, Inc. Electron beam exciter for use in chemical analysis in processing systems
FR2940322B1 (fr) * 2008-12-19 2011-02-11 Alcatel Lucent Procede de descente en pression dans un sas de chargement et de dechargement et equipement associe
FR2946736A1 (fr) * 2009-06-12 2010-12-17 Alcatel Lucent Station et procede de sechage et/ou de degazage d'un produit ou d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats
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JP5304934B2 (ja) * 2012-07-25 2013-10-02 富士通セミコンダクター株式会社 真空ポンプの運転方法及び半導体装置の製造方法
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Also Published As

Publication number Publication date
EP1190285A1 (de) 2002-03-27
US6316045B1 (en) 2001-11-13
EP1190285B1 (de) 2006-05-31
US7219692B2 (en) 2007-05-22
US20020153102A1 (en) 2002-10-24
JP2003532283A (ja) 2003-10-28
US6649019B2 (en) 2003-11-18
US20020022283A1 (en) 2002-02-21
FR2808098B1 (fr) 2002-07-19
WO2001082019A1 (fr) 2001-11-01
ATE328310T1 (de) 2006-06-15
FR2808098A1 (fr) 2001-10-26
DE60120064T2 (de) 2006-12-21

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ALCATEL LUCENT, PARIS, FR

8364 No opposition during term of opposition