DE60118963D1 - Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung - Google Patents

Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung

Info

Publication number
DE60118963D1
DE60118963D1 DE60118963T DE60118963T DE60118963D1 DE 60118963 D1 DE60118963 D1 DE 60118963D1 DE 60118963 T DE60118963 T DE 60118963T DE 60118963 T DE60118963 T DE 60118963T DE 60118963 D1 DE60118963 D1 DE 60118963D1
Authority
DE
Germany
Prior art keywords
polishing
chemical
mechanical
pad
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60118963T
Other languages
English (en)
Other versions
DE60118963T2 (de
Inventor
S Obeng
M Yokley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
psiloQuest Inc
Original Assignee
psiloQuest Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/000,101 external-priority patent/US6846225B2/en
Application filed by psiloQuest Inc filed Critical psiloQuest Inc
Priority claimed from PCT/US2001/044177 external-priority patent/WO2002043922A1/en
Publication of DE60118963D1 publication Critical patent/DE60118963D1/de
Application granted granted Critical
Publication of DE60118963T2 publication Critical patent/DE60118963T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

DE60118963T 2000-11-29 2001-11-27 Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung Expired - Fee Related DE60118963T2 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US25029900P 2000-11-29 2000-11-29
US250299P 2000-11-29
US30437501P 2001-07-10 2001-07-10
US304375P 2001-07-10
US10/000,101 US6846225B2 (en) 2000-11-29 2001-10-24 Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US101 2001-10-24
PCT/US2001/044177 WO2002043922A1 (en) 2000-11-29 2001-11-27 Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method

Publications (2)

Publication Number Publication Date
DE60118963D1 true DE60118963D1 (de) 2006-05-24
DE60118963T2 DE60118963T2 (de) 2006-12-21

Family

ID=27356605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60118963T Expired - Fee Related DE60118963T2 (de) 2000-11-29 2001-11-27 Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung

Country Status (4)

Country Link
EP (1) EP1345734B1 (de)
CN (1) CN1484566A (de)
AU (1) AU2002217867A1 (de)
DE (1) DE60118963T2 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
CN102554764A (zh) * 2012-02-15 2012-07-11 蔡桂芳 适用于超长超薄石英板的研磨抛光机及研磨抛光方法
US9873180B2 (en) * 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
KR101945874B1 (ko) * 2017-08-07 2019-02-11 에스케이씨 주식회사 표면 처리된 연마패드용 윈도우 및 이를 포함하는 연마패드
CN116749093B (zh) * 2023-08-11 2023-11-07 太原理工大学 磁性磨具的制备工艺及基于磁性磨具的细长管内抛光装置
CN117840840B (zh) * 2024-03-08 2024-05-07 常州臻晶半导体有限公司 一种兆声辅助大直径碳化硅晶片检测设备及其检测方法

Also Published As

Publication number Publication date
EP1345734A1 (de) 2003-09-24
CN1484566A (zh) 2004-03-24
DE60118963T2 (de) 2006-12-21
EP1345734B1 (de) 2006-04-19
AU2002217867A1 (en) 2002-06-11

Similar Documents

Publication Publication Date Title
DE60118963D1 (de) Polierkissen aus vernetztem polyethylen zum chemisch-mechanischen polieren und poliervorrichtung
DE60210275D1 (de) Poliervorrichtung und polierkissen
DE602004001268D1 (de) Polierkissen und chemisch-mechanisches Polierverfahren
DE10084915T1 (de) Polierkissen und Poliervorrichtung
DE60041674D1 (de) Abrichtvorrichtung und Poliervorrichtung
DE60138343D1 (de) Substrathalter und Poliervorrichtung
DE60138263D1 (de) Ceriumoxidsol und Abrasiv
AU2003302299A8 (en) Polishing pad and method for manufacturing semiconductor device
DE69815753D1 (de) Abrichtvorrichtung zum Abrichten von Polierkissen
IL151862A0 (en) Integrated chemical-mechanical polishing
DE60117809D1 (de) Reinigungsmittelzusammensetzung zum chemisch-mechanischen planarisieren
GB0323505D0 (en) Polishing pad and system
EP1351702A4 (de) Trem-1-spleissvariante zur modifikation von immunreaktionen
EP1340588A4 (de) Schleifstoff und polierverfahren
DE69805399D1 (de) Integrierte kissen-und bandeinheit für chemisch-mechanisches polieren
DE60018019D1 (de) Werkstückhalter und Poliervorrichtung mit demselben
DE602005007125D1 (de) Chemisch-mechanisches Polierkissen und chemisch-mechanisches Polierverfahren
DE60020646D1 (de) Spitzenlose Rundschleifvorrichtung
DE60326702D1 (de) Polierverfahren und poliervorrichtung
DE60007642T2 (de) Spindelanordnung für poliervorrichtung
DE60025989D1 (de) Formschleifprodukt und Benutzung in einer Polierscheibe
DE60044469D1 (de) Polierkissen mit fixiertem schleifmittel und flüssigkeitsspender
SG120149A1 (en) Apparatus and method for pre-conditioning CMP polishing pad
DE19983991T1 (de) Kugelreinigungs- und -poliervorrichtung
DE60113972D1 (de) Halbleiterpolierhalter und poliervefahren

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee