DE60110453D1 - Weichlotwerkstoff und dessen verwendung in ein elektrisches oder elektronisches bauteil - Google Patents

Weichlotwerkstoff und dessen verwendung in ein elektrisches oder elektronisches bauteil

Info

Publication number
DE60110453D1
DE60110453D1 DE60110453T DE60110453T DE60110453D1 DE 60110453 D1 DE60110453 D1 DE 60110453D1 DE 60110453 T DE60110453 T DE 60110453T DE 60110453 T DE60110453 T DE 60110453T DE 60110453 D1 DE60110453 D1 DE 60110453D1
Authority
DE
Germany
Prior art keywords
electrical
electronic component
light material
soft light
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60110453T
Other languages
English (en)
Other versions
DE60110453T2 (de
Inventor
Atsushi Yamaguchi
Masato Hirano
Yoshinori Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of DE60110453D1 publication Critical patent/DE60110453D1/de
Application granted granted Critical
Publication of DE60110453T2 publication Critical patent/DE60110453T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE60110453T 2000-09-18 2001-09-17 Weichlotwerkstoff und dessen verwendung in einem elektrischen oder elektronischen bauteil Expired - Lifetime DE60110453T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000281718A JP2002096191A (ja) 2000-09-18 2000-09-18 はんだ材料およびこれを利用する電気・電子機器
JP2000281718 2000-09-18
PCT/JP2001/008030 WO2002022302A1 (en) 2000-09-18 2001-09-17 Solder material and electric or electronic device in which the same is used

Publications (2)

Publication Number Publication Date
DE60110453D1 true DE60110453D1 (de) 2005-06-02
DE60110453T2 DE60110453T2 (de) 2006-01-26

Family

ID=18766332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60110453T Expired - Lifetime DE60110453T2 (de) 2000-09-18 2001-09-17 Weichlotwerkstoff und dessen verwendung in einem elektrischen oder elektronischen bauteil

Country Status (6)

Country Link
US (1) US20030015575A1 (de)
EP (1) EP1337377B1 (de)
JP (1) JP2002096191A (de)
CN (1) CN1216715C (de)
DE (1) DE60110453T2 (de)
WO (1) WO2002022302A1 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4230194B2 (ja) 2002-10-30 2009-02-25 内橋エステック株式会社 合金型温度ヒューズ及び温度ヒューズエレメント用線材
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis
GB2421030B (en) * 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
CN1330455C (zh) * 2005-05-09 2007-08-08 天津大学 氧化锆纳米颗粒增强型锡银复合焊料及其制备方法
JP4671780B2 (ja) * 2005-06-22 2011-04-20 三菱重工環境・化学エンジニアリング株式会社 有機性廃水の処理方法及び該システム
JP5696173B2 (ja) * 2005-08-12 2015-04-08 アンタヤ・テクノロジーズ・コープ はんだ組成物
US20070036670A1 (en) * 2005-08-12 2007-02-15 John Pereira Solder composition
PL1922175T3 (pl) * 2005-08-12 2020-03-31 Aptiv Technologies Limited Kompozycja lutu
US20080175748A1 (en) * 2005-08-12 2008-07-24 John Pereira Solder Composition
US20070292708A1 (en) * 2005-08-12 2007-12-20 John Pereira Solder composition
CN101437900B (zh) * 2006-08-28 2012-09-19 松下电器产业株式会社 热固性树脂组合物、其制备方法及电路板
EP2177305B1 (de) * 2007-07-18 2013-07-03 Senju Metal Industry Co., Ltd In-haltiges bleifreies lot für elektronische schaltung eines fahrzeuges
WO2009131178A1 (ja) * 2008-04-23 2009-10-29 千住金属工業株式会社 引け巣が抑制された鉛フリーはんだ合金
WO2010021268A1 (ja) * 2008-08-21 2010-02-25 株式会社村田製作所 電子部品装置およびその製造方法
JP5339968B2 (ja) * 2009-03-04 2013-11-13 パナソニック株式会社 実装構造体及びモータ
EP2422918B1 (de) * 2009-04-20 2017-12-06 Panasonic Intellectual Property Management Co., Ltd. Lötmaterial und anordnung elektronischer komponenten
CN101804527A (zh) * 2010-04-06 2010-08-18 山东大学 一种低锌Sn-Zn基无铅钎焊材料
CN103476539B (zh) 2011-02-04 2016-08-17 安塔亚技术公司 无铅焊料组合物
KR101773733B1 (ko) * 2011-02-25 2017-08-31 센주긴조쿠고교 가부시키가이샤 파워 디바이스용의 땜납 합금과 고전류 밀도의 땜납 조인트
US9595768B2 (en) 2011-05-03 2017-03-14 Pilkington Group Limited Glazing with a soldered connector
JP2013163207A (ja) * 2012-02-10 2013-08-22 Nihon Superior Co Ltd Ｓｎ−Ｂｉ系はんだ合金
KR101305801B1 (ko) * 2012-05-10 2013-09-06 센주긴조쿠고교 가부시키가이샤 음향용 땜납 합금
WO2014013632A1 (ja) 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
SG11201401482UA (en) * 2012-10-09 2014-06-27 Alpha Metals Lead-free and antimony-free tin solder reliable at high temperatures
CN104870673B (zh) * 2012-12-18 2016-07-06 千住金属工业株式会社 无铅软钎料合金
ES2881222T3 (es) * 2013-09-11 2021-11-29 Senju Metal Industry Co Circuito semiconductor que incluye una soldadura sin plomo
EP2979807B1 (de) 2014-06-24 2018-04-11 Harima Chemicals, Inc. Lötlegierung, lötzusammensetzung, lötpaste und elektronische leiterplatte
KR101985646B1 (ko) * 2014-07-21 2019-06-04 알파 어셈블리 솔루션스 인크. 솔더링용 저온 고신뢰성 주석 합금
JP6408282B2 (ja) * 2014-07-31 2018-10-17 新日鉄住金マテリアルズ株式会社 半田ボールおよび電子部材
CN109641323B (zh) * 2017-03-17 2022-02-08 富士电机株式会社 软钎焊材料
JP6708942B1 (ja) * 2019-05-27 2020-06-10 千住金属工業株式会社 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4176443A (en) * 1977-03-08 1979-12-04 Sgs-Ates Componenti Elettronici S.P.A. Method of connecting semiconductor structure to external circuits
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
CN1087994C (zh) * 1995-09-29 2002-07-24 松下电器产业株式会社 无铅钎料合金
JPH09174279A (ja) * 1995-12-26 1997-07-08 Senju Metal Ind Co Ltd はんだ合金
US5667132A (en) * 1996-04-19 1997-09-16 Lucent Technologies Inc. Method for solder-bonding contact pad arrays
JP3693762B2 (ja) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ 無鉛はんだ
US5863493A (en) * 1996-12-16 1999-01-26 Ford Motor Company Lead-free solder compositions
JP2000015476A (ja) * 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
US6176947B1 (en) * 1998-12-31 2001-01-23 H-Technologies Group, Incorporated Lead-free solders
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy

Also Published As

Publication number Publication date
US20030015575A1 (en) 2003-01-23
EP1337377B1 (de) 2005-04-27
EP1337377A1 (de) 2003-08-27
CN1392817A (zh) 2003-01-22
WO2002022302A1 (en) 2002-03-21
CN1216715C (zh) 2005-08-31
JP2002096191A (ja) 2002-04-02
DE60110453T2 (de) 2006-01-26

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)